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11. 发明申请

US20100032692A1 LIGHT EMITTING DEVICE FOR AC OPERATION 有权
标题翻译：用于交流操作的发光装置
公开(公告)号：US20100032692A1
公开(公告)日：2010-02-11
申请号：US12513803
申请日：2007-09-05
申请人： Keon Young Lee , Dae Sung Kal
发明人： Keon Young Lee , Dae Sung Kal
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/62 , H01L2924/0002 , H05B33/0803 , H05B33/0821 , H05B33/089 , Y02B20/341 , H01L2924/00
摘要： An AC light emitting device, in which a plurality of light emitting cells formed on a substrate are flip-bonded to a submount to be driven under an AC power source is disclosed. The light emitting device comprises a first serial array of light emitting cells, and a second serial array of light emitting cells, wherein the second serial array is connected in reverse parallel to the first serial array. Meanwhile, bonding patterns are formed on a submount substrate, and the light emitting cells of the first and second serial arrays are flip-bonded to the bonding patterns. Further, node connecting patterns are formed on the submount substrate, and connect the bonding patterns such that nodes corresponding to each other provided in the first and second serial arrays are electrically connected to each other. Accordingly, it is possible to provide an AC light emitting device which can prevent overvoltage from being applied to light emitting cells in the array to which reverse voltage is applied by bonding patterns and node connecting patterns formed on a submount substrate, thereby protecting the light emitting cells.
摘要翻译：公开了一种AC发光器件，其中形成在衬底上的多个发光单元被翻转接合到在AC电源下被驱动的基座。发光器件包括发光单元的第一串联阵列和发光单元的第二串联阵列，其中第二串联阵列与第一串联阵列反向并联连接。同时，在基板上形成接合图案，并且第一和第二串联阵列的发光单元被翻转接合到接合图案。此外，节点连接图案形成在副安装座基板上，并且连接接合图案，使得设置在第一和第二串行阵列中的彼此相对应的节点彼此电连接。因此，可以提供一种交流发光装置，其能够通过形成在副安装座基板上的图案和节点连接图案来防止过电压施加到反向电压的阵列中的发光单元，由此保护发光细胞。

12. 发明授权

US07361940B2 Leadframe and packaged light emitting diode 有权
标题翻译：引线框和封装发光二极管
公开(公告)号：US07361940B2
公开(公告)日：2008-04-22
申请号：US11178144
申请日：2005-07-08
申请人： Do Hyung Kim , Chung Hoon Lee , Keon Young Lee
发明人： Do Hyung Kim , Chung Hoon Lee , Keon Young Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L23/4334 , H01L24/48 , H01L25/0753 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.
摘要翻译：被配置为与诸如发光二极管（LED）的电子设备一起使用的引线框架包括用于支撑散热器的散热器支撑环。外框架与散热器支撑环间隔开，并且包围散热器支撑环。至少一个支撑引线连接散热器支撑环和外框。分离的引线从外框架朝向散热器支撑环延伸，并且与散热器支撑环间隔开。可以在散热器之后通过注射成型形成的封装体插入引线框架中。

13. 发明授权

US06239420B1 Target for laser cathode ray tube and fabrication method thereof 失效
标题翻译：激光阴极射线管靶及其制造方法
公开(公告)号：US06239420B1
公开(公告)日：2001-05-29
申请号：US09321747
申请日：1999-05-28
申请人： Tae-sung Kim , Keon-young Lee , Chung-dam Song
发明人： Tae-sung Kim , Keon-young Lee , Chung-dam Song
IPC分类号： H01J4014
CPC分类号： H01S3/0388 , H01S3/0382
摘要： There is provided a method for fabricating a target for a laser cathode ray tube including the steps of (a) polishing one plane of a semiconductor layer, (b) forming a first mirror on the polished plane of the semiconductor layer, (c) forming an adhesion layer made of a bisbenzocyclobutene solution on top of a radiation layer, (d) adhering the adhesion layer and the first mirror to each other, (e) polishing the other surface of the semiconductor layer, and (f) forming a second mirror on the other surface of the semiconductor layer.
摘要翻译：提供了一种用于制造激光阴极射线管的靶的方法，包括以下步骤：（a）研磨半导体层的一个平面，（b）在半导体层的抛光平面上形成第一反射镜，（c）形成在辐射层顶部由双苯并环丁烯溶液制成的粘合层，（d）将粘合层和第一反射镜彼此粘合，（e）抛光半导体层的另一个表面，以及（f）形成第二反射镜在半导体层的另一个表面上。

14. 发明授权

US08610138B2 LED package having an array of light emitting cells coupled in series 有权
公开(公告)号：US08610138B2
公开(公告)日：2013-12-17
申请号：US13296735
申请日：2011-11-15
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuok Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuok Jung Choi
IPC分类号： H01L33/64
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

15. 发明申请

US20110241054A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
标题翻译：具有连接在一起的发光细胞阵列的LED封装
公开(公告)号：US20110241054A1
公开(公告)日：2011-10-06
申请号：US13159846
申请日：2011-06-14
申请人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
发明人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
IPC分类号： H01L33/62 , H01L33/50
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

16. 发明申请

US20100220485A1 SIDE ILLUMINATION LENS AND LUMINESCENT DEVICE USING THE SAME 有权
标题翻译：使用相同的侧面照明镜头和发光装置
公开(公告)号：US20100220485A1
公开(公告)日：2010-09-02
申请号：US12730856
申请日：2010-03-24
申请人： Do-Hyung Kim , Chung-Hooon Lee , Keon-Young Lee , Kwang-Il Park
发明人： Do-Hyung Kim , Chung-Hooon Lee , Keon-Young Lee , Kwang-Il Park
IPC分类号： F21V13/04
CPC分类号： G02B19/0071 , G02B19/0028 , G02B19/0061 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/19107 , H01L2924/00014
摘要： The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.
摘要翻译：本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率和镜头的制造成本。

17. 发明授权

US07737463B2 Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die 有权
标题翻译：具有散热器支撑环并具有多个模制树脂的发光二极管封装，其中具有比初始模塑树脂更高的硬度的二次模塑树脂并且覆盖覆盖LED模具的初级模塑树脂
公开(公告)号：US07737463B2
公开(公告)日：2010-06-15
申请号：US12196028
申请日：2008-08-21
申请人： Chung Hoon Lee , Do Hyung Kim , Keon Young Lee
发明人： Chung Hoon Lee , Do Hyung Kim , Keon Young Lee
IPC分类号： H01L29/00 , H01L23/04 , H01L23/34
CPC分类号： H01L33/52 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12041 , H01L2924/19107 , H01L2924/00 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals and a heat sink inserted into a heat sink support ring. At least portions of the pair of lead terminals and the heat sink are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
摘要翻译：公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子和插入散热器支撑环的散热器。一对引线端子和散热片的至少一部分嵌入在封装主体中。包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。第一模塑树脂覆盖LED芯片。具有比第一成型体硬度高的第二成型树脂覆盖第一成型树脂。因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

18. 发明申请

US20080023721A1 Light Emitting Diode Package Having Multiple Molding Resins 有权
标题翻译：具有多个成型树脂的发光二极管封装
公开(公告)号：US20080023721A1
公开(公告)日：2008-01-31
申请号：US11575128
申请日：2005-06-23
申请人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
发明人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
IPC分类号： H01L29/22
CPC分类号： H01L33/52 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12041 , H01L2924/19107 , H01L2924/00 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
摘要翻译：公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子。一对引线端子的至少一部分嵌入在封装主体中。包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。第一模塑树脂覆盖LED芯片。具有比第一模塑树脂硬度更高的第二模塑树脂覆盖第一模塑树脂。因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

19. 发明申请

US20070284993A1 Side Illumination Lens and Luminescent Device Using the Same 有权
标题翻译：侧面照明镜头和使用其的发光装置
公开(公告)号：US20070284993A1
公开(公告)日：2007-12-13
申请号：US11576882
申请日：2005-10-07
申请人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
发明人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
IPC分类号： F21K2/00 , G02B17/00
CPC分类号： G02B19/0071 , G02B19/0028 , G02B19/0061 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/19107 , H01L2924/00014
摘要： The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.
摘要翻译：本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率和镜头的制造成本。

20. 发明授权

US08445933B2 LED package having an array of light emitting cells coupled in series 有权
公开(公告)号：US08445933B2
公开(公告)日：2013-05-21
申请号：US12782287
申请日：2010-05-18
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/62
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

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