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11. 发明授权

US08412339B2 Package for an implantable neural stimulation device 有权
标题翻译：可植入神经刺激装置的包装
公开(公告)号：US08412339B2
公开(公告)日：2013-04-02
申请号：US11924709
申请日：2007-10-26
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/18
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译：本发明是用于植入人体的改进的密封包装。可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

12. 发明申请

US20120309134A1 Implantable Microelectronic Device and Method of Manufacture 有权
标题翻译：可植入微电子器件及其制造方法
公开(公告)号：US20120309134A1
公开(公告)日：2012-12-06
申请号：US13567366
申请日：2012-08-06
申请人： Robert J Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L21/56
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（IBAD）形成的氧化铝之类的绝缘体中，并且具有从器件上的接触焊盘延伸到密封层中的孔的生物相容性导电层的堆叠。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

13. 发明授权

US08258635B2 Implantable microelectronic device and method of manufacture 有权
标题翻译：植入式微电子器件及其制造方法
公开(公告)号：US08258635B2
公开(公告)日：2012-09-04
申请号：US12726274
申请日：2010-03-17
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L23/29
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔层。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

14. 发明授权

US08150534B2 Electrode array for even neural pressure 有权
标题翻译：电极阵列甚至神经压力
公开(公告)号：US08150534B2
公开(公告)日：2012-04-03
申请号：US13029955
申请日：2011-02-17
申请人： Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Jordan Matthew Neysmith
发明人： Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Jordan Matthew Neysmith
IPC分类号： A61N1/00
CPC分类号： A61N1/0543 , A61N1/0558
摘要： An electrode array attached to neural tissue, such as the retina, necessarily has graded pressure exerted on the tissue, with higher pressure near the attachment point. Greater pressure improves contact between the electrodes and neural tissue while too much pressure may damage neural tissue. Hence it is advantageous to obtain equal pressure across the array field. In the present invention multiple and selective attachment points are provided on an electrode array allowing a surgeon to select the attachment points providing the best electrode tissue contact.
摘要翻译：附着到神经组织（例如视网膜）上的电极阵列必须具有施加在组织上的分级压力，附近点附近具有更高的压力。更大的压力改善了电极和神经组织之间的接触，而太多的压力可能损伤神经组织。因此，有利的是在阵列场上获得相等的压力。在本发明中，在电极阵列上提供多个选择性附着点，允许外科医生选择提供最佳电极组织接触的附着点。

15. 发明授权

US08145322B1 Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device 有权
标题翻译：柔性电路电极阵列器件及柔性电路电极器件的背面处理方法
公开(公告)号：US08145322B1
公开(公告)日：2012-03-27
申请号：US12177038
申请日：2008-07-21
申请人： Qingfang Yao , Jordan Matthew Neysmith , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
发明人： Qingfang Yao , Jordan Matthew Neysmith , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/04
CPC分类号： A61N1/05 , A61N1/0541 , A61N1/0543 , B23K26/361 , B23K26/362
摘要： The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.
摘要翻译：本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

16. 发明申请

US20090143848A1 Cochlear Stimulation Device 有权
标题翻译：耳蜗刺激装置
公开(公告)号：US20090143848A1
公开(公告)日：2009-06-04
申请号：US12267489
申请日：2008-11-07
申请人： Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
发明人： Robert J. Greenberg , David Daomin Zhou , Jordan Matthew Neysmith , Kelly H. McClure , Jianing Wei , Neil Hamilton Talbot , James Singleton Little
IPC分类号： A61N1/05
CPC分类号： A61N1/0541 , A61N1/0472
摘要： A cochlear stimulation device comprising an electrode array designed to provide enhanced charge injection capacity necessary for neural stimulation. The electrode array comprises electrodes with high surface area or a fractal geometry and correspondingly high electrode capacitance and low electrical impedance. The resultant electrodes have a robust surface and sufficient mechanical strength to withstand physical stress vital for long term stability. The device further comprises wire traces having a multilayer structure which provides a reduced width for the conducting part of the electrode array. The cochlear prosthesis is attached by a grommet to the cochleostomy that is made from a single piece of biocompatible polymer. The device, designed to achieve optimum neural stimulation by appropriate electrode design, is a significant improvement over commercially available hand-built devices.
摘要翻译：耳蜗刺激装置包括设计成提供神经刺激所需的增强的电荷注入能力的电极阵列。电极阵列包括具有高表面积或分形几何形状的电极以及相当高的电极电容和低的电阻抗。所得电极具有坚固的表面和足够的机械强度以抵抗对于长期稳定性至关重要的物理应力。该装置还包括具有多层结构的导线迹线，其为电极阵列的导电部分提供减小的宽度。耳蜗假体通过索环连接到由单一生物相容性聚合物制成的耳蜗切开术。该设备旨在通过适当的电极设计实现最佳神经刺激，这是相对于市售的手工设备的显着改进。

17. 发明申请

US20080288036A1 Flexible Circuit Electrode Array with Wire or Film Support 有权
标题翻译：带电线或薄膜支架的柔性电路电极阵列
公开(公告)号：US20080288036A1
公开(公告)日：2008-11-20
申请号：US12032627
申请日：2008-02-15
申请人： Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
发明人： Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
IPC分类号： A61N1/04
CPC分类号： A61N1/0543 , A61N1/05 , A61N1/0541 , H05K1/0393 , H05K1/118
摘要： The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.
摘要翻译：本发明涉及柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及嵌入在所述阵列中的至少一个支撑。本发明还涉及一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及将电极阵列与互连衬垫连接的折叠柔性电路电缆。本公开还涉及一种制造柔性电路电极阵列的方法，包括：沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 将所述柔性电路电极阵列加热到模具中以在所述柔性电路电极阵列中形成三维形状，至少在基层，顶层或基底与顶层之间嵌入支撑件，和/或折叠柔性电路电缆至少一次将电极阵列与互连衬垫连接在一起。

18. 发明授权

US09643002B2 Method of manufacturing a flexible circuit electrode array with at least one tack opening 有权
公开(公告)号：US09643002B2
公开(公告)日：2017-05-09
申请号：US13167074
申请日：2011-06-23
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
IPC分类号： A61N1/05 , A61N1/36 , H05K1/11 , H05K3/00
CPC分类号： A61N1/0543 , A61N1/36046 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/0014 , H05K2201/05 , H05K2201/053 , H05K2201/09063 , H05K2201/09409 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49174 , Y10T29/49176
摘要： The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.

19. 发明授权

US08501547B2 Implantable microelectronic device and method of manufacture 有权
标题翻译：植入式微电子器件及其制造方法
公开(公告)号：US08501547B2
公开(公告)日：2013-08-06
申请号：US13567366
申请日：2012-08-06
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L21/56
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔层。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

20. 发明授权

US08322027B1 Flexible circuit electrode array and method of manufacturing the same 有权
标题翻译：柔性电路电极阵列及其制造方法
公开(公告)号：US08322027B1
公开(公告)日：2012-12-04
申请号：US11926498
申请日：2007-10-29
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
IPC分类号： H05K3/00 , H05K3/10 , H05K1/00
CPC分类号： H05K3/06 , A61N1/0543 , H05K1/118 , H05K3/0041 , H05K3/28 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2201/0317 , H05K2203/0554 , H05K2203/0789 , H05K2203/0793 , H05K2203/095 , H05K2203/1163 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155
摘要： A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on said insulator polymer base layer; b) applying a layer of photoresist on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; c) activating said insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with said base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of said insulator polymer layer and selective etching said insulator layer and said top coating layer to obtain at least one via; and e) filling said via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.
摘要翻译：一种制造柔性电路电极阵列的方法，包括：a）在所述绝缘体聚合物基底层上沉积包含基底涂层，导电层和顶部涂层的金属迹线层; b）在所述金属迹线层上施加一层光致抗蚀剂，并图案化所述金属迹线层并在所述绝缘体聚合物基底层上形成金属迹线; c）激活所述绝缘体聚合物基层并沉积顶部绝缘体聚合物层并与所述基础绝缘体聚合物层形成单个绝缘聚合物层; d）在所述绝缘体聚合物层的表面上施加薄金属层和光致抗蚀剂层，并选择性地蚀刻所述绝缘体层和所述顶部涂层以获得至少一个通孔; 和e）用电极材料填充所述通孔。放置一层聚合物。将一层金属施加到聚合物上并图案化以产生用于那些电极的电极和引线。将第二层聚合物施加在金属层上并图案化以留下电极的开口，或稍后通过诸如激光烧蚀的手段产生开口。因此阵列及其供电电缆由单体形成。或者，可以施加金属和聚合物的多个交替层以在给定宽度内获得更多的金属迹线。该方法提供了聚合物基底层和聚合物顶层之间的极好的粘合性，并且痕迹金属和电极的绝缘性。

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