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11. 发明授权

US07151426B2 Latching micro magnetic relay packages and methods of packaging 有权
标题翻译：闭锁微型继电器封装和封装方法
公开(公告)号：US07151426B2
公开(公告)日：2006-12-19
申请号：US10633914
申请日：2003-08-04
申请人： John Stafford , Gordon Tam , Jun Shen
发明人： John Stafford , Gordon Tam , Jun Shen
IPC分类号： H01H51/22
CPC分类号： B81B7/0077 , H01H1/0036 , H01H36/0006 , H01H50/005 , H01H2036/0093 , H01H2050/007 , H01L23/10 , H01L24/97 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/1461 , H01L2924/30105 , H01L2924/00
摘要： A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.
摘要翻译：形成气密密封的MEMS封装的方法包括以下步骤：在支撑衬底的表面上为MEMS器件提供至少一个接触的支撑GaAs衬底，并在支撑衬底的表面上形成悬臂，定位成电以一个方向与联系人联系。金属密封环周围围绕触点和悬臂固定到支撑基板的表面。在硅芯片中蚀刻空腔以形成帽构件。金属密封圈固定在腔体周围的帽部件上。通过在不使用助焊剂的惰性环境中回流位于两个密封环之间的焊料合金，将封装密封。

12. 发明授权

US06894592B2 Micromagnetic latching switch packaging 失效
标题翻译：微电磁闭锁开关包装
公开(公告)号：US06894592B2
公开(公告)日：2005-05-17
申请号：US10147915
申请日：2002-05-20
申请人： Jun Shen , Prasad S. Godavarti , John Stafford , Gordon Tam
发明人： Jun Shen , Prasad S. Godavarti , John Stafford , Gordon Tam
IPC分类号： H01H50/00 , H01H51/22 , H01M51/22
CPC分类号： H01H50/005 , H01H2050/007
摘要： Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever. An electromagnet is attached to the inner surface or an outer surface of the cap.
摘要翻译：描述了用于微加工磁性锁定开关的封装以及用于组装封装的方法。在一个方面，衬底由相对的第一和第二表面限定。微型开关集成电路（IC）芯片安装在第一表面。芯片上的接触焊盘与第一表面上的迹线耦合。永久磁铁定位成紧邻芯片。盖子连接到第一表面。盖的内表面形成外壳以将芯片封装在第一表面上。芯片可以替代地安装到盖的内表面。该芯片可以以标准或倒装芯片方式定向。另一方面，可移动的微加工悬臂由衬底的表面支撑。盖子贴在表面上。盖的内表面形成在衬底的表面上包围悬臂的外壳。永磁体与悬臂紧邻。电磁铁连接到盖的内表面或外表面。

13. 发明授权

US06778046B2 Latching micro magnetic relay packages and methods of packaging 失效
标题翻译：闭锁微型继电器封装和封装方法
公开(公告)号：US06778046B2
公开(公告)日：2004-08-17
申请号：US10126291
申请日：2002-04-19
申请人： John Stafford , Gordon Tam , Jun Shen
发明人： John Stafford , Gordon Tam , Jun Shen
IPC分类号： H01H5122
CPC分类号： B81B7/0077 , H01H1/0036 , H01H36/0006 , H01H50/005 , H01H2036/0093 , H01H2050/007 , H01L23/10 , H01L24/97 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/1461 , H01L2924/30105 , H01L2924/00
摘要： A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.
摘要翻译：形成气密密封的MEMS封装的方法包括以下步骤：在支撑衬底的表面上为MEMS器件提供至少一个接触的支撑GaAs衬底，并在支撑衬底的表面上形成悬臂，定位成电以一个方向与联系人联系。金属密封环周围围绕触点和悬臂固定到支撑基板的表面。在硅芯片中蚀刻空腔以形成帽构件。金属密封圈固定在腔体周围的帽部件上。通过在不使用助焊剂的惰性环境中回流位于两个密封环之间的焊料合金，将封装密封。

14. 发明授权

US06609607B2 Article separation conveyor 失效
标题翻译：物品分离输送机
公开(公告)号：US06609607B2
公开(公告)日：2003-08-26
申请号：US09838964
申请日：2001-04-20
申请人： Bernard H. Woltjer , Douglas E. Olson , John Stafford , Gerald A. Brouwer , Ricardo N. Schiesser , Dennis J. Schuitema
发明人： Bernard H. Woltjer , Douglas E. Olson , John Stafford , Gerald A. Brouwer , Ricardo N. Schiesser , Dennis J. Schuitema
IPC分类号： B65G4726
CPC分类号： B65G47/68 , B65G37/02 , B65G47/1492 , B65G47/31 , B65G47/71 , B65G2203/044
摘要： An article separation conveyor system includes a plurality of conveyors which are independently and/or collectively operable to destack, separate and/or align articles being conveyed along the article separation conveyor. The conveyor system includes a destacking conveyor, a side by side eliminating conveyor and/or an aligning conveyor. The destacking conveyor includes a plurality of conveying portions, which are inclined to convey articles up and then drop or guide them onto the next adjacent conveyor. The side-by-side eliminating conveyor includes a pair of diverting members and is operable to redirect articles from one side of the conveyor to the other to destack and separate articles as they are continuously conveyed along the conveyor. The aligning conveyor is operable to align articles along one side of the discharge conveyor so the articles are arranged for identification at a downstream scanning device and induction onto a sortation system.
摘要翻译：物品分离输送机系统包括多个输送机，它们独立地和/或共同地可操作地破坏，分离和/或对准沿物品分离输送机输送的物品。输送机系统包括卸料输送机，并排排除输送机和/或排料输送机。倾倒式输送机包括多个输送部分，倾斜的物品向上运送，然后将其下降或引导到下一个相邻的输送机上。并排消除输送机包括一对转向构件，并且可操作以将物品从输送机的一侧重新转向另一侧，以在沿着输送机连续输送时对物品进行拆卸和分离。对准输送机可操作以沿着排放输送机的一侧对准制品，使得物品被布置成用于在下游扫描装置处的识别和感应到分拣系统上。

15. 发明授权

US2115015A Jar lifter 失效
标题翻译：罐子升降机
公开(公告)号：US2115015A
公开(公告)日：1938-04-26
申请号：US10449436
申请日：1936-10-07
申请人： CLAUDE H DOUGLASS , JOHN STAFFORD
发明人： BUELL ECKERT
IPC分类号： A47J45/10
CPC分类号： A47J45/10

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