专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20110253719A1 PT1-2 PULL TAB 有权
标题翻译： PT1-2拉杆
公开(公告)号：US20110253719A1
公开(公告)日：2011-10-20
申请号：US12613549
申请日：2009-11-06
申请人： GABE CHERIAN
发明人： GABE CHERIAN
IPC分类号： B65D17/34
CPC分类号： B65D51/22 , B65D17/4012 , B65D2517/0014 , B65D2517/0073 , B65D2517/0079 , Y10S220/906
摘要： The invention covers a number of alternative improvements to the prior art pull-tab used to open container such as soda cans. One improvement is by forming the nose of the pull tab at a certain angle to the body of the tab, thus allowing the user to tilt the tab thus lifting the pull tip higher and providing more room for the user to insert the finger tip under the pull tip thus making it easier to open the container. Another improvement is by rotating the pull tab a certain angle and making it follow a caming surface thus lifting the pull tip and again providing more room to insert the finger tip and making it easier to open the container.
摘要翻译：本发明涵盖了用于打开诸如苏打水罐的容器的现有技术拉片的许多替代改进。一个改进是通过将拉片的鼻部以一定的角度形成到突片的主体上，从而允许使用者倾斜拉片，从而更高地提升拉头，并为使用者提供更多的空间，以将指尖插入在拉尖，从而更容易打开容器。另一个改进是通过使拉片旋转一定角度并使其跟随一个凸轮表面，从而提升拉尖，并且再次提供更多的空间来插入指尖并且使得容易打开容器。

12. 发明授权

US07901995B2 Interconnections resistant to wicking 失效
标题翻译：互连抗芯吸
公开(公告)号：US07901995B2
公开(公告)日：2011-03-08
申请号：US11689558
申请日：2007-03-22
申请人： Gabe Cherian
发明人： Gabe Cherian
IPC分类号： H01L21/60
CPC分类号： H05K3/3426 , H01L21/4853 , H01L21/6835 , H01L23/49555 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/73 , H01L24/742 , H01L24/85 , H01L2224/0401 , H01L2224/0603 , H01L2224/1012 , H01L2224/11334 , H01L2224/1134 , H01L2224/11822 , H01L2224/1308 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13184 , H01L2224/13582 , H01L2224/136 , H01L2224/13655 , H01L2224/1403 , H01L2224/16 , H01L2224/1601 , H01L2224/16225 , H01L2224/16235 , H01L2224/45124 , H01L2224/45147 , H01L2224/4556 , H01L2224/45599 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73251 , H01L2224/73257 , H01L2224/81903 , H01L2224/85 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15331 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K3/308 , H05K2201/09418 , H05K2201/10318 , H05K2201/10424 , H05K2201/10689 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734 , H05K2201/10825 , H05K2201/10871 , H05K2201/10946 , H05K2201/10977 , H05K2203/0769 , Y02P70/613 , H01L2224/13099 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2924/00012 , H01L2224/72
摘要： The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.
摘要翻译：本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。更具体地说，涉及高密度电子设备。本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。对于有铅器件，引线面向设备的热中心及其与之相互作用的系统。对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。

13. 发明申请

US20090181560A1 S&P3 CWW2 CONNECTORS WITH WIPE 失效
标题翻译： S＆P3 CWW2连接器与WIPE
公开(公告)号：US20090181560A1
公开(公告)日：2009-07-16
申请号：US12395700
申请日：2009-03-01
申请人： GABE CHERIAN
发明人： GABE CHERIAN
IPC分类号： H05K1/02 , H05K1/00
CPC分类号： H01L23/49811 , G01R1/0466 , G01R1/07357 , H01L23/49555 , H01L2924/00013 , H01L2924/0002 , H01L2924/3011 , H01R12/52 , H01R12/714 , H01R12/89 , H01R13/2421 , H01R13/2435 , H05K7/1069 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/49218 , Y10T29/49222 , H01L2224/29099 , H01L2924/00
摘要： The present invention relates generally to interconnections between electrical and electronic devices, such as integrated circuit packages, chips, wafers, substrates or printed circuit boards or similar electronic devices.The invention relates more specifically to springs, used to make connections to electrical elements and to applications of such springs in connectors or interconnection devices. More particularly the springs can be located adjacent to each other on small effective center distances to accommodate high-density electronic devices.Furthermore, the invention relates to connectors that comprise combs that are used in conjunction with such springs, to create and to control the wiping or scrubbing action, which can promote good electrical connection. Moreover, the invention uses such combs that are thermally matched to the electronic devices to improve the performance during thermal cycling procedures.Finally, this invention describes a number of connectors, test heads and test probes that utilize the above springs and combs.
摘要翻译：本发明一般涉及电气和电子设备之间的互连，例如集成电路封装，芯片，晶片，基板或印刷电路板或类似的电子设备。本发明更具体地涉及用于连接电气元件的弹簧以及这种弹簧在连接器或互连装置中的应用。更具体地，弹簧可以以小的有效中心距离彼此相邻，以适应高密度电子设备。此外，本发明涉及包括与这种弹簧结合使用的梳子的连接器，以产生并控制擦拭或擦洗动作，这可以促进良好的电连接。此外，本发明使用与电子设备热匹配的这种梳子来改善热循环过程中的性能。最后，本发明描述了许多使用上述弹簧和梳子的连接器，测试头和测试探头。

14. 发明申请

US20090032915A1 TFCC (TM) & SWCC (TM) thermal flex contact carriers 失效
标题翻译： TFCC TM和SWCC TM热敏接触载体
公开(公告)号：US20090032915A1
公开(公告)日：2009-02-05
申请号：US12154753
申请日：2008-05-27
申请人： Gabe Cherian , Don Saunders
发明人： Gabe Cherian , Don Saunders
IPC分类号： H01L21/60 , H01L23/495
CPC分类号： H05K3/3426 , H01L21/4853 , H01L21/6835 , H01L23/49555 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/73 , H01L24/742 , H01L24/85 , H01L2224/0401 , H01L2224/0603 , H01L2224/1012 , H01L2224/11334 , H01L2224/1134 , H01L2224/11822 , H01L2224/1308 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13184 , H01L2224/13582 , H01L2224/136 , H01L2224/13655 , H01L2224/1403 , H01L2224/16 , H01L2224/1601 , H01L2224/16225 , H01L2224/16235 , H01L2224/45124 , H01L2224/45147 , H01L2224/4556 , H01L2224/45599 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73251 , H01L2224/73257 , H01L2224/81903 , H01L2224/85 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15331 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K3/308 , H05K2201/09418 , H05K2201/10318 , H05K2201/10424 , H05K2201/10689 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734 , H05K2201/10825 , H05K2201/10871 , H05K2201/10946 , H05K2201/10977 , H05K2203/0769 , Y02P70/613 , H01L2224/13099 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2924/00012 , H01L2224/72
摘要： Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.
摘要翻译：描述了两组互连设备和方法。两者都在电子封装和电路板之间或芯片和衬底之间提供列等。在第一组中，称为热挠性接触载体（TFCC），将柱元素从平面层压结构中雕刻出来，然后形成。在第二组中，承载连接元件的载体由可溶或可移除的材料制成，其作为焊接掩模同时作用，以防止焊料沿着元件的芯部芯吸。

15. 外观设计

USD579771S1 Lid with pull tab 有权
标题翻译：带拉片盖
公开(公告)号：USD579771S1
公开(公告)日：2008-11-04
申请号：US29286717
申请日：2007-05-16
申请人： Gabe Cherian
设计人： Gabe Cherian

16. 发明申请

US20070284706A1 NO-WICK(TM) 2 INTERCONNECTIONS 失效
标题翻译： NO-WICK（TM）2互连
公开(公告)号：US20070284706A1
公开(公告)日：2007-12-13
申请号：US11689558
申请日：2007-03-22
申请人： Gabe Cherian
发明人： Gabe Cherian
IPC分类号： H01L23/495
CPC分类号： H05K3/3426 , H01L21/4853 , H01L21/6835 , H01L23/49555 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/73 , H01L24/742 , H01L24/85 , H01L2224/0401 , H01L2224/0603 , H01L2224/1012 , H01L2224/11334 , H01L2224/1134 , H01L2224/11822 , H01L2224/1308 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13184 , H01L2224/13582 , H01L2224/136 , H01L2224/13655 , H01L2224/1403 , H01L2224/16 , H01L2224/1601 , H01L2224/16225 , H01L2224/16235 , H01L2224/45124 , H01L2224/45147 , H01L2224/4556 , H01L2224/45599 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73251 , H01L2224/73257 , H01L2224/81903 , H01L2224/85 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15331 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K3/308 , H05K2201/09418 , H05K2201/10318 , H05K2201/10424 , H05K2201/10689 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734 , H05K2201/10825 , H05K2201/10871 , H05K2201/10946 , H05K2201/10977 , H05K2203/0769 , Y02P70/613 , H01L2224/13099 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2924/00012 , H01L2224/72
摘要： The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.
摘要翻译：本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。更具体地说，涉及高密度电子设备。本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。对于含铅器件，引线面向设备的热中心及其与之相互作用的系统。对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。

17. 发明申请

US20070210816A1 MP3 MICRO PROBE 失效
公开(公告)号：US20070210816A1
公开(公告)日：2007-09-13
申请号：US11752942
申请日：2007-05-24
申请人： Gabe Cherian
发明人： Gabe Cherian
IPC分类号： G01R31/02
CPC分类号： G01R1/0735
摘要： Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods. In this divisional application, the emphasis is on the first group.
摘要翻译：描述了使用探针，用于与高密度芯片或类似电子器件进行电接触的方法。两组探头被覆盖。第一组包括在进行初始接触之后横向移动平行于被测设备的接触垫表面的探针。这是为了创造所需的擦拭或擦洗。第二组包括按吸盘原理操作的探头。当探头被推到被测设备上时，探头工作尖端向外伸展并产生理想的擦拭或擦洗。还描述了用于上述方法的探针本身。在这个分案申请中，重点是第一组。

18. 发明授权

US07121891B2 Interposer 失效
标题翻译：内插
公开(公告)号：US07121891B2
公开(公告)日：2006-10-17
申请号：US10953600
申请日：2004-09-28
申请人： Gabe Cherian
发明人： Gabe Cherian
IPC分类号： H01R1/00
CPC分类号： H01J5/54 , H01R33/22 , H01R33/9555
摘要： Three-Way Light Bulbs and Sockets can create a condition, where “light flicker” can occur. One way to correct the situation and to reduce the chance of having light flicker is described in this patent. It consists of introducing an “INTERPOSER”, between the light bulb and the socket. Several interposer designs and construction options are described in the patent, as well.
摘要翻译：三光灯泡和插座可以创建一种可以发生“轻闪烁”的状态。在该专利中描述了一种校正情况并减少轻微闪烁的机会的方法。它包括在灯泡和插座之间引入“INTERPOSER”。该专利还描述了几种插入件设计和构造选项。

19. 发明申请

US20060196875A1 Pull tab 有权
公开(公告)号：US20060196875A1
公开(公告)日：2006-09-07
申请号：US10941797
申请日：2004-09-14
申请人： Gabe Cherian
发明人： Gabe Cherian
IPC分类号： B65D17/34
CPC分类号： B65D51/22 , B65D17/4012 , B65D2517/0014 , B65D2517/0073 , B65D2517/0079 , Y10S220/906
摘要： The invention covers a number of alternative improvements to the prior art pull-tab used to open container such as soda cans. One improvement is by forming the nose of the pull tab at a certain angle to the body of the tab, thus allowing the user to tilt the tab thus lifting the pull tip higher and providing more room for the user to insert the finger tip under the pull tip thus making it easier to open the container. Another improvement is by rotating the pull tab a certain angle and making it follow a caming surface thus lifting the pull tip and again providing more room to insert the finger tip and making it easier to open the container.

20. 发明授权

US06979230B2 Light socket 失效
标题翻译：灯座
公开(公告)号：US06979230B2
公开(公告)日：2005-12-27
申请号：US10391417
申请日：2003-03-17
申请人： Gabe Cherian
发明人： Gabe Cherian
IPC分类号： G01R1/073 , H01J5/54 , H01R33/22 , H01R33/955 , H01R24/00
CPC分类号： H01J5/54 , H01R33/22 , H01R33/9555
摘要： Improvements to 3-way light bulbs and to their electrical sockets are shown. The major improvement is to replace the rigid middle contact element of the socket by an elastic contact spring. Other improvements are described, which can be applied to the bulbs as well. These include flattening and smoothing the solder joint that is located on the bulb middle contact ring. Also, some new add-ons inserts or adapters are described, which can be used together with the bulbs and sockets, to improve the performance of such bulbs.
摘要翻译：显示了对3路灯泡及其电气插座的改进。主要的改进是通过弹性接触弹簧代替插座的刚性中间接触元件。描述了其他改进，也可应用于灯泡。这些包括平坦化和平滑位于灯泡中间接触环上的焊点。此外，还描述了一些新的插件或适配器，可以与灯泡和插座一起使用，以提高这种灯泡的性能。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式