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    • 18. 发明申请
    • Method and apparatus for producing particles using supercritical fluid
    • 使用超临界流体生产颗粒的方法和装置
    • US20040200774A1
    • 2004-10-14
    • US10789422
    • 2004-02-27
    • Ferro Corporation
    • Boris Y. ShekunovPratibhash ChattopadhyayJeffrey S. SeitzingerRobert W. Huff
    • B01D011/04
    • B01D11/0407
    • The present invention provides a method of producing particles via a supercritical fluid processing technique, an apparatus for carrying out the method and the particles produced thereby. The method includes: (1) providing: a supercritical fluid; a first solvent that is soluble in the supercritical fluid; a second solvent that is substantially insoluble in the supercritical fluid and is at least partially soluble in or miscible with the first solvent; and a solute that is soluble in the first solvent and is substantially insoluble in the second solvent and the supercritical fluid; (2) contacting the first solvent, the second solvent and the solute together to form a solution; and (3) contacting the solution with the supercritical fluid to extract the first solvent from the solution and precipitate the solute in the form of particles that are suspended in the second solvent.
    • 本发明提供一种通过超临界流体处理技术生产颗粒的方法,用于实施该方法的装置和由其制备的颗粒。 该方法包括:(1)提供:超临界流体; 可溶于超临界流体的第一种溶剂; 基本上不溶于超临界流体并且至少部分可溶于第一溶剂或与第一溶剂混溶的第二溶剂; 和溶解在第一溶剂中且基本上不溶于第二溶剂和超临界流体的溶质; (2)将第一溶剂,第二溶剂和溶质接触在一起形成溶液; 和(3)使溶液与超临界流体接触以从溶液中萃取出第一溶剂,并以悬浮在第二溶剂中的颗粒形式沉淀溶质。
    • 20. 发明申请
    • Method of fabricating a copper damascene structure
    • 铜镶嵌结构的制作方法
    • US20030098434A1
    • 2003-05-29
    • US10266169
    • 2002-10-07
    • Ferro Corporation
    • Yuzhuo LiJason Keleher
    • E04B001/74
    • C09G1/02C23F3/00
    • The present invention provides a chemical-mechanical polishing slurry for use in removing copper overlaying a tantalum-based barrier layer during the fabrication of a copper damascene structure, and a method of retarding the corrosion of copper lines during the chemical-mechanical polishing of a copper damascene structure using the slurry. The slurry according to the invention includes an oxidizing agent that releases free radicals and a non-chelating free radical quencher that is effective to retard the corrosion of the copper lines during chemical-mechanical polishing. Preferred oxidizing agents that release free radicals used in the slurry according to the invention include peroxides, peroxydiphosphates, and persulfates. Preferred non-chelating free radical quenchers used in the slurry according to the invention include ascorbic acid, thiamine, 2-propanol, and alkyl glycols, with ascorbic acid being most preferred.
    • 本发明提供了一种用于在铜镶嵌结构的制造期间去除覆盖钽基阻挡层的铜的化学机械抛光浆料,以及在铜化学机械抛光期间延缓铜线腐蚀的方法 大马士革结构使用浆料。 根据本发明的浆料包括释放自由基的氧化剂和非化学自由基猝灭剂,其在化学机械抛光期间有效地延缓铜线的腐蚀。 根据本发明的用于释放浆料中的自由基的优选氧化剂包括过氧化物,过氧二磷酸酯和过硫酸盐。 用于根据本发明的浆料中的优选的非螯合自由基猝灭剂包括抗坏血酸,硫胺素,2-丙醇和烷基二醇,其中抗坏血酸是最优选的。