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11. 发明授权

US08280665B2 Calibration device for on-vehicle camera 有权
标题翻译：车载摄像机校准装置
公开(公告)号：US08280665B2
公开(公告)日：2012-10-02
申请号：US12552694
申请日：2009-09-02
申请人： Yoshihiro Nakamura , Etsuo Yamada
发明人： Yoshihiro Nakamura , Etsuo Yamada
IPC分类号： G01C17/38 , G06K9/32
CPC分类号： G06T7/80 , G06T2207/30208 , G06T2207/30252
摘要： A calibration device for an on-vehicle camera includes an image receiving portion receiving an image of an area around a vehicle taken by an on-vehicle camera, a viewpoint transformation portion performing a viewpoint transformation on the image to obtain a transformed image, a region setting portion setting a recognition target region on the transformed image according to coordinates of the calibration index set in accordance with vehicle models, where the recognition target region includes therein the calibration index, a calibration point detecting portion detecting a calibration point positioned within the calibration index included in the recognition target region, and a calibration calculating portion calibrating the on-vehicle camera in accordance with coordinates of the calibration point in a reference coordinate system and in accordance with coordinates of the calibration point in a camera coordinate system.
摘要翻译：一种用于车载照相机的校准装置包括：图像接收部分，接收由车载摄像机拍摄的车辆周围的区域的图像，对图像执行视点变换以获得变换图像的视点变换部分，区域设置部分根据根据车辆模型设置的校准索引的坐标来设置变换图像上的识别目标区域，其中识别目标区域包括校准索引，校准点检测部分，检测位于校准索引内的校准点包括在识别目标区域中的校准计算部分和校准计算部分，其根据参考坐标系中的校准点的坐标并且根据相机坐标系中的校准点的坐标来校准车载摄像机。

12. 发明申请

US20110102581A1 TARGET POSITION IDENTIFYING APPARATUS 有权
标题翻译：目标位置识别装置
公开(公告)号：US20110102581A1
公开(公告)日：2011-05-05
申请号：US13001061
申请日：2009-07-17
申请人： Yoshihiro Nakamura , Etsuo Yamada , Keiji Takagi , Masataka Chiba
发明人： Yoshihiro Nakamura , Etsuo Yamada , Keiji Takagi , Masataka Chiba
IPC分类号： H04N7/18 , G06K9/00
CPC分类号： H04N17/002 , G06T7/80 , G06T2207/10024
摘要： A target position identifying apparatus includes a color difference converting section for processing pixel values of an image of a target comprised of combination of a first color and a second color obtained from the target under influence of ambient light, thus generating a color component value of the first color, a color component value of the second color and a luminance value, a color region determining section for determining region of the first color and region of the second color, based on the first color component value and the second color component value, with using a determination condition based on either luminance of the captured image or the luminance value, a border detecting section for detecting border between the first color and the second color in the target based on result of the determination by the color region determining section and a target position calculating section for calculating the position of the target on the image based on result of the border detection by the border detecting section.
摘要翻译：目标位置识别装置包括：色差转换部分，用于处理由环境光影响下从目标获得的第一颜色和第二颜色的组合的目标图像的像素值，从而生成颜色分量值第一颜色，第二颜色的颜色分量值和亮度值，基于第一颜色分量值和第二颜色分量值，确定第一颜色和第二颜色的区域的区域的颜色区域确定部分，使用基于拍摄图像的亮度或亮度值的确定条件，基于由颜色区域确定部分确定的结果和目标来检测目标中的第一颜色和第二颜色之间的边界的边界检测部分位置计算部分，用于基于边界检测的结果计算图像上的目标的位置由边界检测部分进行。

13. 发明授权

US06913951B2 Method of making a lead-on-chip device 失效
标题翻译：制造片上设备的方法
公开(公告)号：US06913951B2
公开(公告)日：2005-07-05
申请号：US10341462
申请日：2003-01-14
申请人： Etsuo Yamada , Kenji Nagasaki , Yasushi Shiraishi , Kazuhiko Sera
发明人： Etsuo Yamada , Kenji Nagasaki , Yasushi Shiraishi , Kazuhiko Sera
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L23/495 , H01L23/50 , H01L29/06 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/06 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L29/0657 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05647 , H01L2224/05655 , H01L2224/06136 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2224/854 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/01026 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor device which is sealed with a plastic sealing layer and whose thickness is regulated to be below a given value is known. Since the thickness of the device is small, and the thickness of the upper portion of the plastic sealing layer and the thickness of the lower portion thereof are different from each other, the plastic sealing layer becomes warped, thus causing a crack on the side of the semiconductor chip.To solve this problem, the semiconductor device according to the present invention comprises a semiconductor chip on which a plurality of grooves are defined. Consequently, the thickness of the lower portion of the plastic layer becomes greater, thereby preventing cracks from occurring on the semiconductor chip.
摘要翻译：已知用塑料密封层密封其厚度低于给定值的半导体器件。由于装置的厚度小，并且塑料密封层的上部的厚度及其下部的厚度彼此不同，所以塑料密封层变得翘曲，从而在半导体芯片。为了解决这个问题，根据本发明的半导体器件包括其上限定有多个沟槽的半导体芯片。因此，塑料层的下部的厚度变大，从而防止在半导体芯片上产生裂纹。

14. 发明授权

US6097083A Semiconductor device which is crack resistant 失效
标题翻译：耐裂纹的半导体器件
公开(公告)号：US6097083A
公开(公告)日：2000-08-01
申请号：US827693
申请日：1997-04-10
申请人： Shinji Ohuchi , Etsuo Yamada , Yasushi Shiraishi
发明人： Shinji Ohuchi , Etsuo Yamada , Yasushi Shiraishi
IPC分类号： H01L23/28 , H01L21/52 , H01L23/495 , H01L23/48
CPC分类号： H01L23/4951 , H01L24/32 , H01L24/73 , H01L24/743 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/743 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/181
摘要： A resin mold type semiconductor device, which is crack resistant and can be made relatively thin, includes a semiconductor chip, a lead member arranged in a manner such that an one side face of a head portion thereof touches a surface of the semiconductor chip, a wire for electrically connecting the surface of the semiconductor chip and another side face of the lead member, an adhesive member for adhering the one side face of the lead member and a peripheral face of the semiconductor chip, and a package for molding the semiconductor chip, a part of the lead, the wire and the adhesive member by synthetic resin. Further, the lead member may be provided with a concave portion in the one side face and possibly also a groove extending from the concave portion to an end of the lead.
摘要翻译：一种耐裂纹且相对较薄的树脂模具型半导体器件包括半导体芯片，以其头部的一个侧面接触半导体芯片的表面的方式配置的引线部件，用于将半导体芯片的表面与引线构件的另一个侧面电连接的导线，用于粘合引线构件的一个侧面和半导体芯片的外围面的粘合构件和用于模制半导体芯片的封装，导线的一部分，电线和合成树脂的粘合部件。此外，引线构件可以在一个侧面中设置有凹部，并且还可以在从凹部延伸到引线的端部的凹槽中设置凹部。

15. 发明授权

US5969410A Semiconductor IC device having chip support element and electrodes on the same surface 失效
标题翻译：具有芯片支撑元件和相同表面上的电极的半导体IC器件
公开(公告)号：US5969410A
公开(公告)日：1999-10-19
申请号：US848286
申请日：1997-04-29
申请人： Shinji Ohuchi , Hiroshi Kawano , Etsuo Yamada , Yasushi Shiraishi
发明人： Shinji Ohuchi , Hiroshi Kawano , Etsuo Yamada , Yasushi Shiraishi
IPC分类号： H01L23/495 , H01G1/14
CPC分类号： H01L23/49551 , H01L23/4951 , H01L24/32 , H01L24/48 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48599 , H01L2224/73215 , H01L24/45 , H01L2924/01005 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181
摘要： In a plastic packaged semiconductor device, a chip support formed on the same lead frame as leads is disposed so as to extend over the surface of a semiconductor element, the chip support is bonded and fixed to the surface of a polyimide wafer coat on the semiconductor element by means of an insulating tape, the leads are brought into contact with the polyimide wafer coat on the semiconductor element without being fixed, the leads and the electrodes of the semiconductor element are connected by means of gold wires, and these are packaged by a packaging material. Generation of crack in the sealing material thereby prevented, and the thickness of the plastic packaged semiconductor device is reduced.
摘要翻译：在塑料封装半导体器件中，形成在与引线相同的引线框架上的芯片支撑件设置成在半导体元件的表面上延伸，芯片支撑件被结合并固定在半导体上的聚酰亚胺晶片涂层的表面上通过绝缘带使引线与半导体元件上的聚酰亚胺晶片涂层接触而不固定，半导体元件的引线和电极通过金线连接，并且它们被封装在用于包装的材料。因此防止了密封材料中的裂缝的产生，并且塑料封装的半导体器件的厚度减小。

16. 发明申请

US20100082281A1 CALIBRATION DEVICE FOR ON-VEHICLE CAMERA 有权
标题翻译：车载摄像机校准装置
公开(公告)号：US20100082281A1
公开(公告)日：2010-04-01
申请号：US12552694
申请日：2009-09-02
申请人： Yoshihiro Nakamura , Etsuo Yamada
发明人： Yoshihiro Nakamura , Etsuo Yamada
IPC分类号： G06F19/00
CPC分类号： G06T7/80 , G06T2207/30208 , G06T2207/30252
摘要： A calibration device for an on-vehicle camera includes an image receiving portion receiving an image of an area around a vehicle taken by an on-vehicle camera, a viewpoint transformation portion performing a viewpoint transformation on the image to obtain a transformed image, a region setting portion setting a recognition target region on the transformed image according to coordinates of the calibration index set in accordance with vehicle models, where the recognition target region includes therein the calibration index, a calibration point detecting portion detecting a calibration point positioned within the calibration index included in the recognition target region, and a calibration calculating portion calibrating the on-vehicle camera in accordance with coordinates of the calibration point in a reference coordinate system and in accordance with coordinates of the calibration point in a camera coordinate system.
摘要翻译：一种用于车载照相机的校准装置包括：图像接收部分，接收由车载摄像机拍摄的车辆周围的区域的图像，对图像执行视点变换以获得变换图像的视点变换部分，区域设置部分根据根据车辆模型设置的校准索引的坐标来设置变换图像上的识别目标区域，其中识别目标区域包括校准索引，校准点检测部分，检测位于校准索引内的校准点包括在识别目标区域中的校准计算部分和校准计算部分，其根据参考坐标系中的校准点的坐标并且根据相机坐标系中的校准点的坐标来校准车载摄像机。

17. 发明授权

US07402502B2 Method of manufacturing a semiconductor device by using a matrix frame 失效
标题翻译：通过使用矩阵框架制造半导体器件的方法
公开(公告)号：US07402502B2
公开(公告)日：2008-07-22
申请号：US10942799
申请日：2004-09-17
申请人： Etsuo Yamada
发明人： Etsuo Yamada
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301 , H01L21/30 , H01L21/44
CPC分类号： H01L21/565 , H01L21/4842 , H01L21/561 , H01L23/3107 , H01L23/49513 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a semiconductor device includes providing a matrix frame which includes a plurality of die pads, mounting a semiconductor chip on the respective die pads, and sealing the semiconductor chip in blocks. After the semiconductor chip is sealed by the sealing resin, inner leads which are extended from the sealing resin are punched by a punching blade. Then, the block is diced to individual semiconductor devices by a rotary blade.
摘要翻译：一种制造半导体器件的方法包括提供一种矩阵框架，其包括多个管芯焊盘，将半导体芯片安装在各个管芯焊盘上，并以半块形式密封半导体芯片。在半导体芯片被密封树脂密封之后，由密封树脂延伸的内部引线用冲压刀冲压。然后，通过旋转刀片将该块切割到各个半导体器件。

18. 发明授权

US07110498B2 Image reading apparatus and X-ray imaging apparatus 有权
标题翻译：图像读取装置和X射线成像装置
公开(公告)号：US07110498B2
公开(公告)日：2006-09-19
申请号：US10938429
申请日：2004-09-10
申请人： Etsuo Yamada
发明人： Etsuo Yamada
IPC分类号： H05G1/64
CPC分类号： G01T1/2928 , H04N5/32
摘要： An image reading apparatus includes a DC/DC power supply which supplies power to at least part of the apparatus, a photodetector array including two-dimensionally arranged photoelectric conversion elements, and a line selector and reading circuit which read signals from the photoelectric conversion elements for each row in the photodetector array as a unit. A line driving signal in the line selector is set to be synchronized with a reference clock for defining the oscillation frequency of the DC/DC power supply and have a period of an integer multiple of the reference clock. A sample/hold signal for determining the timing at which a signal read from the photodetector array is sampled/held is output at a predetermined phase timing of each period of the line driving signal.
摘要翻译：图像读取装置包括向至少部分设备供电的DC / DC电源，包括二维布置的光电转换元件的光电检测器阵列，以及从光电转换元件读取信号的行选择器和读取电路，光电检测器阵列中的每一行作为一个单元。线路选择器中的线路驱动信号被设置为与用于定义DC / DC电源的振荡频率的参考时钟同步，并且具有参考时钟的整数倍的周期。用于确定从光电检测器阵列读取的信号被采样/保持的定时的采样/保持信号在线驱动信号的每个周期的预定相位定时输出。

19. 发明申请

US20050058252A1 Image reading apparatus and X-ray imaging apparatus 有权
标题翻译：图像读取装置和X射线成像装置
公开(公告)号：US20050058252A1
公开(公告)日：2005-03-17
申请号：US10938429
申请日：2004-09-10
申请人： Etsuo Yamada
发明人： Etsuo Yamada
IPC分类号： A61B6/00 , G01N23/00 , G01T1/00 , G01T1/20 , G01T1/29 , G03B42/02 , H02M5/45 , H02M5/458 , H05G1/56
CPC分类号： G01T1/2928 , H04N5/32
摘要： An image reading apparatus includes a DC/DC power supply which supplies power to at least part of the apparatus, a photodetector array including two-dimensionally arranged photoelectric conversion elements, and a line selector and reading circuit which read signals from the photoelectric conversion elements for each row in the photodetector array as a unit. A line driving signal in the line selector is set to be synchronized with a reference clock for defining the oscillation frequency of the DC/DC power supply and have a period of an integer multiple of the reference clock. A sample/hold signal for determining the timing at which a signal read from the photodetector array is sampled/held is output at a predetermined phase timing of each period of the line driving signal.
摘要翻译：图像读取装置包括向至少部分设备供电的DC / DC电源，包括二维布置的光电转换元件的光电检测器阵列，以及从光电转换元件读取信号的行选择器和读取电路，光电检测器阵列中的每一行作为一个单元。线路选择器中的线路驱动信号被设置为与用于定义DC / DC电源的振荡频率的参考时钟同步，并且具有参考时钟的整数倍的周期。用于确定从光电检测器阵列读取的信号被采样/保持的定时的采样/保持信号在线驱动信号的每个周期的预定相位定时输出。

20. 发明授权

US06208021B1 Semiconductor device, manufacturing method thereof and aggregate type semiconductor device 失效
标题翻译：半导体装置及其制造方法以及集合型半导体装置
公开(公告)号：US06208021B1
公开(公告)日：2001-03-27
申请号：US08806614
申请日：1997-02-26
申请人： Shinji Ohuchi , Yasushi Shiraishi , Hiroshi Kawano , Etsuo Yamada
发明人： Shinji Ohuchi , Yasushi Shiraishi , Hiroshi Kawano , Etsuo Yamada
IPC分类号： H01L2348
CPC分类号： H01L24/02 , H01L23/3114 , H01L23/3185 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/181 , H01L2924/00
摘要： A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.
摘要翻译：树脂密封型半导体器件，其制造方法和封装结构能够使半导体器件小型化并实现高密度封装。为此，具有在外表面露出的引线的树脂密封型半导体器件具有粘附到半导体元件的电路形成表面的点引线，绝缘胶带插入其间，各自独立地排列并暴露于外部，设置在内部的半导体元件。

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