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    • 11. 发明授权
    • Apparatus for testing an integrated circuit device
    • 用于测试集成电路器件的装置
    • US06294921B1
    • 2001-09-25
    • US09360151
    • 1999-07-26
    • Anthony R. BonaccioHoward J. Leighton
    • Anthony R. BonaccioHoward J. Leighton
    • G01R1073
    • G01R31/043
    • A method and apparatus for contact testing a plurality of devices under test, either sequentially or simultaneously. In a first test phase it is determined whether the test probe to each contact is shorted to the most negative rail. In a second phase it is determined whether the test probe has made proper contact, and whether ESD diodes on the devices under test are functional. In both test phases a negative pulse is generated on a tester bus and applied to the contact by the test probe. In the first test phase the positive rail of the device under test is grounded; in the second test phase the positive rail of the device under test is made positive. The negative rail of the device under test is connected to the negative rail of the tester. In both test phases, upon termination of the negative pulse, the bus is restored to a positive voltage which is dependent upon the condition of the contact and the condition of expected input devises at the contact. The bus voltage as measured in accordance with a logic which determines the condition of the contact and the condition of expected input devices at the contact. Data signals for functional testing of the device under test are can be applied to the bus through an isolating driver which preserves he bolt of the contact test.
    • 一种用于连续或同时接触测试多个待测器件的方法和装置。 在第一个测试阶段,确定每个触点的测试探针是否短接到最负的导轨。 在第二阶段,确定测试探针是否已正确接触,以及被测器件上的ESD二极管是否正常工作。 在两个测试阶段,在测试仪总线上产生负脉冲,并通过测试探头施加到触点。 在第一个测试阶段,被测器件的正极接地; 在第二个测试阶段,正在测试的器件的正极。 被测器件的负极线连接到测试仪的负极轨。 在两个测试阶段,在负脉冲终止时,总线恢复到正电压,这取决于接触条件和接触期间预期输入条件。 总线电压根据确定接触状态的逻辑和接点处的预期输入设备的状态来测量。 用于测试设备的功能测试的数据信号可以通过隔离驱动器应用于总线,该隔离驱动器保持接触测试的螺栓。
    • 16. 发明授权
    • Method and apparatus for storing circuit calibration information
    • 存储电路校准信息的方法和装置
    • US07454305B2
    • 2008-11-18
    • US11164040
    • 2005-11-08
    • Anthony R. BonaccioAllen P. HaarJoseph A. IadanzaDouglas W. StoutIvan L. Wemple
    • Anthony R. BonaccioAllen P. HaarJoseph A. IadanzaDouglas W. StoutIvan L. Wemple
    • G01R31/00G06F19/00
    • G01R31/2884G01R35/005
    • A method for altering circuit characteristics to make them independent of processing parameters of devices within an integrated circuit is disclosed. A process parameter is measured by a kerf or on-chip built-in test on a selective set of chip on a wafer, and the results are stored on a storage device within each respective chip. Then, for each of the remaining chips, a two-dimensional interpolation is performed to determine the process parameter value for the respective chip based on the measured value. The interpolated values are recorded along with the coordinates of the chip in an efuse control file. Such information is subsequently stored into an efuse module within the chip. On-chip digital control structures are used to adjust certain operational characteristics of a functional component within the chip based on the information stored in the efuse module.
    • 公开了一种用于改变电路特性以使它们与集成电路内的器件的处理参数无关的方法。 通过在晶片上的选择性芯片组上的切口或片上内置测试来测量工艺参数,并将结果存储在各个芯片内的存储装置上。 然后,对于剩余的每个芯片,执行二维内插,以基于测量值确定各个芯片的处理参数值。 内插值与芯片在efuse控制文件中的坐标一起被记录。 这样的信息随后被存储在芯片内的efuse模块中。 片上数字控制结构用于根据存储在efuse模块中的信息来调整芯片内的功能组件的某些操作特性。