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11. 发明申请

US20200170153A1 PORTION-WISE FILLING OF A RESERVOIR WITH BULK COMPONETS 审中-公开
公开(公告)号：US20200170153A1
公开(公告)日：2020-05-28
申请号：US16776616
申请日：2020-01-30
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Thomas ROSSMANN , Stefan SEITZ , Norbert HEILMANN , Johannes JUSTINGER , Stefan MAGG , Stefan GEIGER
IPC分类号： H05K13/02 , B65G65/32 , B65G65/23 , B65G65/00 , B65B15/04 , H05K13/00 , B65B25/00 , B65B57/06
摘要： A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

12. 发明授权

US10299386B2 Placement machine and method for equipping a substrate with unhoused chips 有权
公开(公告)号：US10299386B2
公开(公告)日：2019-05-21
申请号：US15222034
申请日：2016-07-28
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Martin Pruefer
IPC分类号： H05K3/30 , H01L21/67
摘要： A placement machine for equipping a substrate with unhoused chips is described. The placement machine has a chassis on which is mounted a feed device, providing a wafer which has a multiplicity of chips. A lifting device is mounted on the chassis, and a substrate-receiving device for receiving the substrate is mounted on the lifting device is movable relative to the chassis by the lifting device. The substrate-receiving device has a one-piece support element, which constitutes at least an upper part of the substrate-receiving device, wherein the substrate to be equipped can be laid on the one-piece support element; and a transport device for transporting the substrate on an upper side of the one-piece support element along a transport direction. The transport device is spatially integrated in the one-piece support element on the upper side of the one-piece support element.

13. 发明授权

US09832920B2 Method for equipping printed circuit boards 有权
公开(公告)号：US09832920B2
公开(公告)日：2017-11-28
申请号：US14932152
申请日：2015-11-04
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Franz Heuberger , Rudolf Kiener , Christian Meissner
IPC分类号： H05K3/30 , H05K13/04 , H05K13/00 , H05K13/08
CPC分类号： H05K13/0495 , H05K3/30 , H05K13/0015 , H05K13/0061 , H05K13/08 , H05K13/085 , Y10T29/49124 , Y10T29/49131
摘要： A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2).

14. 发明申请

US20170034921A1 PLACEMENT MACHINE AND METHOD FOR EQUIPPING A SUBSTRATE WITH UNHOUSED CHIPS 审中-公开
标题翻译：放置机器和方法，用于装备带有不可更换的基座的基板
公开(公告)号：US20170034921A1
公开(公告)日：2017-02-02
申请号：US15222034
申请日：2016-07-28
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Martin PRUEFER
IPC分类号： H05K3/30
CPC分类号： H05K3/30 , H01L21/67144
摘要： What is described is a placement machine (100, 300, 500) for equipping a substrate (190) with unhoused chips (282). The placement machine (100, 300, 500) has (a) a chassis (112); (b) a feed device (140) for providing a wafer (180) which has a multiplicity of chips (282), wherein the feed device (140) is mounted on the chassis (112); (c) a lifting device (513), which is mounted on the chassis (112); (d) a substrate-receiving device (130) for receiving the substrate (190) to be equipped, wherein the substrate-receiving device (130) is mounted on the lifting device (513) and can be moved relative to the chassis (112) along a z-direction by means of the lifting device (513); and (e) a placement head (120) for picking up chips (282) from the provided wafer (180) and for placing the picked-up chips (282) at predefined placement positions on the received substrate (190). The substrate-receiving device (130) has (d1) a one-piece support element (132, 332, 532), which constitutes at least an upper part of the substrate-receiving device (130), wherein the substrate (190) to be equipped can be laid on the one-piece support element (132, 332, 532); and (d2) a transport device (160) for transporting the substrate (190) on an upper side of the one-piece support element (132, 332, 532) along a transport direction (T). The transport device (160) is spatially integrated in the one-piece support element (132, 332, 532) on the upper side of the one-piece support element (132, 332, 532). A method for equipping a substrate (190) with unhoused chips (282) using a placement machine (100, 300, 500) of this type is also described.
摘要翻译：所描述的是用于为衬底（190）配备未被置换的芯片（282）的放置机器（100,300,500）。贴片机（100,300,500）具有（a）底盘（112）; （b）用于提供具有多个芯片（282）的晶片（180）的馈送装置（140），其中所述馈送装置（140）安装在所述底架（112）上; （c）安装在底盘（112）上的提升装置（513）; （d）用于接收待配备的基板的基板接收装置（130），其中所述基板接收装置（130）安装在提升装置（513）上并且可相对于底架（112）移动）通过提升装置（513）沿着z方向; 和（e）用于从所提供的晶片（180）拾取芯片（282）并用于将拾取的芯片（282）放置在接收的基板（190）上的预定的放置位置的放置头（120）。衬底接收装置（130）具有（d1）至少构成衬底接收装置（130）的上部的一体式支撑元件（132,332,532），其中衬底（190）至装备在一体的支撑元件（132,332,532）上; 以及（d2）用于沿着输送方向（T）在一体式支撑元件（132,332,532）的上侧输送基板（190）的输送装置（160）。运输装置（160）在一体式支撑元件（132,332,532）的上侧上的空间上整合在一体式支撑元件（132,332,532）中。还描述了使用这种类型的放置机器（100,300,500）来为衬底（190）装备未固定芯片（282）的方法。

15. 发明申请

US20150237309A1 OPTICAL MEASUREMENT OF A COMPONENT HAVING STRUCTURAL FEATURES PRESENT AT OPPOSITE SIDES 有权
标题翻译：具有结构特征的组件的光学测量
公开(公告)号：US20150237309A1
公开(公告)日：2015-08-20
申请号：US14616815
申请日：2015-02-09
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Norbert HEILMANN
IPC分类号： H04N7/18 , G06K9/52 , H04N5/225 , G06T7/00
CPC分类号： H04N7/18 , G06K9/52 , H04N5/2258 , H05K13/046 , H05K13/0812
摘要： A method for mounting an electronic component (180) onto a component carrier (179) is described. The method comprises (a) optically capturing a first image from a first side of the component (180), at which first side a first structural feature (185) of the component (180) is discernible, by means of a first camera (120), (b) optically capturing a second image from a second side of the component (180), at which second side a second structural feature (186) of the component (180) is discernible, by means of a second camera (160), wherein the first side and the second side are situated opposite one another and wherein the second structural feature (186) is configured to be connected at a predetermined position on the component carrier (175), (c) orienting the electronic component (180) such that a center of the first structural feature (185) is aligned with a desired position relative to the component carrier (175), wherein the second structural feature (186) can be correspondingly offset from the predetermined position, and (d) mounting the electronic component (180) onto the component carrier (175), wherein the center of the first structural feature (185) is aligned relative to the component carrier (175), wherein the second structural feature (186) is offset from the predetermined position. Moreover, a method for checking the functionality of an optoelectronic component in advance of a population of a component carrier and an automatic placement machine for mounting an optically measured electronic component are also described.
摘要翻译：描述了将电子部件（180）安装到部件载体（179）上的方法。该方法包括：（a）从部件（180）的第一侧光学捕获第一图像，第一侧通过第一相机（120）识别部件（180）的第一结构特征（185）），（b）通过第二相机（160）从组件（180）的第二侧光学地捕获第二图像，在该第二侧，组件（180）的第二结构特征（186）可识别的第二侧，，其中所述第一侧和所述第二侧彼此相对定位，并且其中所述第二结构特征（186）构造成连接在所述分量载体（175）上的预定位置处，（c）使所述电子部件（180）使得第一结构特征（185）的中心与相对于分量载体（175）的期望位置对准，其中第二结构特征（186）可以相应地从预定位置偏移，以及（d）将电子元件（180）到组件上（175），其中所述第一结构特征（185）的中心相对于所述分量载体（175）对准，其中所述第二结构特征（186）从所述预定位置偏移。此外，还描述了用于检查组件载体和用于安装光学测量的电子部件的自动放置机之前的光电子部件的功能性的方法。

16. 发明授权

US11284550B2 Use of placeable marker components for a staged placement of components on a carrier 有权
公开(公告)号：US11284550B2
公开(公告)日：2022-03-22
申请号：US16211325
申请日：2018-12-06
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Martin Pruefer , Sylvester Demmel
IPC分类号： H05K13/08 , H05K13/00 , H05K13/04 , H01L21/67 , H01L21/68 , H01L21/683
摘要： A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.

17. 发明申请

US20190200496A1 USE OF PLACEABLE MARKER COMPONENTS FOR A STAGED PLACEMENT OF COMPONENTS ON A CARRIER 审中-公开
公开(公告)号：US20190200496A1
公开(公告)日：2019-06-27
申请号：US16211325
申请日：2018-12-06
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Martin PRUEFER , Sylvester DEMMEL
IPC分类号： H05K13/08 , H05K13/00 , H05K13/04 , H01L21/68 , H01L21/683 , H01L21/67
CPC分类号： H05K13/0812 , H01L21/67144 , H01L21/681 , H01L21/6838 , H05K13/0015 , H05K13/0061 , H05K13/0406 , H05K13/0409
摘要： A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.

18. 发明申请

US20190124803A1 MODULAR-DESIGN COMPONENT HANDLING DEVICE WITH COMPONENT GRIPPING TOOLS PROTRUDING FROM A ROTATION AXIS 审中-公开
公开(公告)号：US20190124803A1
公开(公告)日：2019-04-25
申请号：US16161929
申请日：2018-10-16
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Sebastian LOHMEIER , Thomas ROSSMANN , Michele TRIGIANI
IPC分类号： H05K13/04 , H05K13/00
摘要： A holding and drive device including a frame; a rotation structure which is attached to the frame in such a manner that it can rotate around a rotation axis; a rotation drive for rotating the rotation structure around the rotation axis; and a rotation structure interface attached to or formed on the rotation structure, to which a tool device including a plurality of sleeves can be detachably attached, which are configured for the detachable attachment of a respective component holding device protruding from the rotation axis with a radial direction component or of another tool element. A corresponding tool device, a corresponding supplementary tool device, and a component handling device constructed from these components. A method for the application-specific configuration of such a component handling device.

19. 发明授权

US09774828B2 Optical measurement of a component having structural features present at opposite sides 有权
公开(公告)号：US09774828B2
公开(公告)日：2017-09-26
申请号：US14616815
申请日：2015-02-09
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Norbert Heilmann
IPC分类号： H04N7/18 , G06K9/52 , H04N5/225
CPC分类号： H04N7/18 , G06K9/52 , H04N5/2258 , H05K13/046 , H05K13/0812
摘要： A method for mounting an electronic component (180) onto a component carrier (179) is described. The method comprises (a) optically capturing a first image from a first side of the component (180), at which first side a first structural feature (185) of the component (180) is discernible, by means of a first camera (120), (b) optically capturing a second image from a second side of the component (180), at which second side a second structural feature (186) of the component (180) is discernible, by means of a second camera (160), wherein the first side and the second side are situated opposite one another and wherein the second structural feature (186) is configured to be connected at a predetermined position on the component carrier (175), (c) orienting the electronic component (180) such that a center of the first structural feature (185) is aligned with a desired position relative to the component carrier (175), wherein the second structural feature (186) can be correspondingly offset from the predetermined position, and (d) mounting the electronic component (180) onto the component carrier (175), wherein the center of the first structural feature (185) is aligned relative to the component carrier (175), wherein the second structural feature (186) is offset from the predetermined position. Moreover, a method for checking the functionality of an optoelectronic component in advance of a population of a component carrier and an automatic placement machine for mounting an optically measured electronic component are also described.

20. 发明申请

US20160143197A1 METHOD FOR EQUIPPING PRINTED CIRCUIT BOARDS 有权
标题翻译：装备印刷电路板的方法
公开(公告)号：US20160143197A1
公开(公告)日：2016-05-19
申请号：US14932152
申请日：2015-11-04
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Franz HEUBERGER , Rudolf KIENER , Christian MEISSNER
IPC分类号： H05K13/04 , H05K13/08 , H05K13/00 , H05K3/30
CPC分类号： H05K13/0495 , H05K3/30 , H05K13/0015 , H05K13/0061 , H05K13/08 , H05K13/085 , Y10T29/49124 , Y10T29/49131
摘要： A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2). According to the method, first printed circuit boards (5) of the first length are stored temporarily in a buffer region (6) of the equipping section (2), and consequently have a shorter transport path to an equipping post (4) of the equipping section (2) than from the input section (1).
摘要翻译：一种用于将印刷电路板装配在装备机器上的方法，所述印刷电路板具有第一长度，并且所述装备机器被实现为装备第二长度的印刷电路板，所述第二长度是所述第一长度的两倍以上长度。装备机具有输入部分（1）和装备部分（2），装备部分（2）在印刷电路板的输送方向（F）之后设置在输入部分（1）之后，输入部分（1）沿着印刷电路板的传送方向，第一长度的印刷电路板和第二长度的印刷电路板在其纵向方向上从输入部分（1）输送到装备站（2）。根据该方法，将第一长度的第一印刷电路板（5）临时存储在装备部分（2）的缓冲区域（6）中，因此具有较短的到达装备部分（4）的输送路径装备部分（2）比输入部分（1）。

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