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    • 153. 发明授权
    • Precursor, thin layer prepared including the precursor, method of preparing the thin layer and phase-change memory device
    • 前体,薄层制备包括前体,制备薄层的方法和相变存储器件
    • US07371429B2
    • 2008-05-13
    • US11349135
    • 2006-02-08
    • Jung-Hyun LeeYoon-Ho Khang
    • Jung-Hyun LeeYoon-Ho Khang
    • C23C16/00C07C395/00
    • C23C16/305C07F7/10H01L27/2436H01L45/06H01L45/1233H01L45/144H01L45/1616
    • A Te precursor containing Te, a 15-group compound (for example, N) and/or a 14-group compound (for example, Si), a method of preparing the Te precursor, a Te-containing chalcogenide thin layer including the Te precursor, a method of preparing the thin layer; and a phase-change memory device. The Te precursor may be deposited at lower temperatures for forming a Te-containing chalcogenide thin layer doped with a 15-group compound (for example, N) and/or a 14-group compound (for example, Si). For example, the Te precursor may employ plasma enhanced chemical vapor deposition (PECVD) or plasma enhanced atomic layer deposition (PEALD) at lower deposition temperatures. The GST phase-change layer doped with a 15-group compound (for example, N) and/or a 14-group compound (for example, Si) formed by employing the Te precursor may have a decreased reset current, and thus when a memory device including the same is employed, its integration may be possible, and operation with higher capacity and/or higher speed may be possible.
    • 含有Te,15组化合物(例如N)和/或14组化合物(例如Si)的Te前体,制备Te前体的方法,含Te的硫族化物薄层,包括Te 前体,制备薄层的方法; 和相变存储器件。 可以在较低温度下沉积Te前体以形成掺杂有15族化合物(例如N)和/或14-基团化合物(例如Si)的含Te的硫族化物薄层。 例如,Te前体可以在较低的沉积温度下使用等离子体增强化学气相沉积(PECVD)或等离子体增强原子层沉积(PEALD)。 掺杂有通过使用Te前体形成的15族化合物(例如N)和/或14族化合物(例如Si)的GST相变层可能具有降低的复位电流,因此当 使用包括其的存储器件,其集成是可能的,并且具有更高容量和/或更高速度的操作可能是可能的。
    • 159. 发明申请
    • Method of fabricating lanthanum oxide layer and method of fabricating MOSFET and capacitor using the same
    • 制造氧化镧层的方法及使用其制造MOSFET和电容器的方法
    • US20070059447A1
    • 2007-03-15
    • US11599207
    • 2006-11-14
    • Jong-Pyo KimJung-Hyun LeeBum-Seok SeoJung-Hyoung Lee
    • Jong-Pyo KimJung-Hyun LeeBum-Seok SeoJung-Hyoung Lee
    • C23C16/00
    • H01L21/0228C23C16/40H01L21/02175H01L21/02192H01L21/022H01L21/28194H01L21/3141H01L21/31604H01L29/517
    • Methods of fabricating a lanthanum oxide layer, and methods of fabricating a MOSFET and/or a capacitor especially adapted for semiconductor applications using such a lanthanum oxide layer are disclosed. The methods include a preliminary step of disposing a semiconductor substrate into a chamber. Tris(bis(trimethylsilyl)amino)Lanthanum as a lanthanum precursor is then injected into the chamber such that the lanthanum precursor is chemisorbed on the semiconductor substrate. Then, after carrying out a first purge of the chamber, at least one oxidizer is injected into the chamber such that the oxidizer is chemisorbed with the lanthanum precursor on the semiconductor substrate. Then, the chamber is purged a second time. The described steps of injecting the lanthanum precursor into the chamber, first-purging the chamber, injecting an oxidizer into the chamber, and second-purging the chamber may be sequentially and repeatedly performed to form a lanthanum oxide layer of a desired thickness having enhanced semiconductor characteristics.
    • 公开了制造氧化镧层的方法以及特别适用于使用这种氧化镧层的半导体应用的MOSFET和/或电容器的制造方法。 所述方法包括将半导体衬底设置到腔室中的预备步骤。 然后将三(双(三甲基甲硅烷基)氨基)镧作为镧前体注入室中,使得镧前体在半导体衬底上被化学吸附。 然后,在进行室的第一次吹扫之后,至少一个氧化剂被注入到室中,使得氧化剂与半导体衬底上的镧前体化学吸附。 然后,房间被第二次清除。 将镧前体注入到室中,首先清洗室,将氧化剂注入到室中,以及对室进行第二次净化的所述步骤可以被顺序地和重复地进行,以形成具有增强的半导体的所需厚度的氧化镧层 特点
    • 160. 发明申请
    • Non-volatile semiconductor memory device having ion conductive layer and methods of fabricating and operating the same
    • 具有离子传导层的非易失性半导体存储器件及其制造和操作方法
    • US20070045728A1
    • 2007-03-01
    • US11508991
    • 2006-08-24
    • Jung-hyun Lee
    • Jung-hyun Lee
    • H01L29/76
    • H01L45/145H01L27/24H01L45/04
    • A non-volatile semiconductor memory device having an ion conductive layer, and methods of fabricating and operating the same are disclosed. The non-volatile memory device may include a substrate, a switching element formed in the substrate, and a storage node connected to the switching element, the storage node may include a lower electrode connected to the switching element, and used as an ion source; a data storage layer formed on the lower electrode, a portion thereof being spaced from the lower electrode; a side electrode spaced from the lower electrode, a side surface thereof being connected to a portion of the data storage layer spaced from the lower electrode; and an upper electrode formed on the data storage layer, or may include a lower electrode connected to the switching element, and used as an ion source; and a data storage layer formed on the lower electrode; an upper electrode formed on the data storage layer.
    • 公开了具有离子传导层的非易失性半导体存储器件及其制造和操作方法。 非易失性存储器件可以包括衬底,形成在衬底中的开关元件和连接到开关元件的存储节点,存储节点可以包括连接到开关元件的下电极,并用作离子源; 形成在所述下电极上的数据存储层,其一部分与所述下电极间隔开; 与所述下电极间隔开的侧电极,其侧表面与所述数据存储层的与所述下电极间隔开的部分连接; 以及形成在数据存储层上的上电极,或者可以包括连接到开关元件的下电极,并用作离子源; 和形成在下电极上的数据存储层; 形成在数据存储层上的上电极。