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141. 发明授权

US07829651B2 Lens-forming silicone resin composition and silicone lens 有权
标题翻译：透镜成型硅树脂组合物和硅胶透镜
公开(公告)号：US07829651B2
公开(公告)日：2010-11-09
申请号：US11437662
申请日：2006-05-22
申请人： Toshio Shiobara , Tsutomi Kashiwagi , Katsuyuki Imazawa
发明人： Toshio Shiobara , Tsutomi Kashiwagi , Katsuyuki Imazawa
IPC分类号： C08G77/00 , C08G77/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00
摘要： Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a platinum group metal base catalyst, and (D) a mold release agent cure into colorless, transparent, heat resistant parts which can be smoothly released from the mold and used as lenses in LED devices.
摘要翻译：硅氧烷树脂组合物，其包含（A）含有至少两个脂族不饱和键的有机聚硅氧烷，（B）分子中具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，（C）铂族金属碱催化剂和（D）脱模剂固化成无色，透明，耐热的部件，可以从模具中顺利释放并用作LED器件中的透镜。

142. 发明申请

US20100125116A1 HEAT-CURABLE RESIN COMPOSITION 有权
标题翻译：热固性树脂组合物
公开(公告)号：US20100125116A1
公开(公告)日：2010-05-20
申请号：US12617919
申请日：2009-11-13
申请人： Toshio Shiobara , Tsutomu Kashiwagi , Yusuke Taguchi
发明人： Toshio Shiobara , Tsutomu Kashiwagi , Yusuke Taguchi
IPC分类号： C08L83/00 , C08K3/22 , C08K3/36 , C08K3/18 , C08K3/30
CPC分类号： C08G59/306 , C08G59/3245 , C08G59/42
摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).
摘要翻译：产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分（C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。

143. 发明授权

US07714080B2 Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device 有权
标题翻译：用于半导体封装环氧树脂模塑料和半导体器件的底漆组合物
公开(公告)号：US07714080B2
公开(公告)日：2010-05-11
申请号：US11357988
申请日：2006-02-22
申请人： Hideki Akiba , Toshio Shiobara
发明人： Hideki Akiba , Toshio Shiobara
IPC分类号： C08L63/00 , H01L21/00 , C08G77/04
CPC分类号： C08G77/455 , C09D183/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , H01L2924/13034 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： A primer composition comprising an alkoxysilyl-containing polyamide-imide resin, an epoxy resin, a curing promoter, and an organic solvent forms a cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor members.
摘要翻译：包含含烷氧基甲硅烷基的聚酰胺酰亚胺树脂，环氧树脂，固化促进剂和有机溶剂的底漆组合物通过短暂的低温加热形成具有耐热性和耐水性的固化涂层，并且有助于将环氧树脂模塑料粘合到半导体元件。

144. 发明申请

US20100029887A1 RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT 有权
标题翻译：用于封装光学半导体元件的树脂组合物
公开(公告)号：US20100029887A1
公开(公告)日：2010-02-04
申请号：US12510491
申请日：2009-07-28
申请人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C09D183/04 , C08G77/04
CPC分类号： C08G59/306 , C08G59/3254 , C08L83/06
摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).
摘要翻译：一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2）两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

145. 发明申请

US20090123764A1 Silicone Resin for Protecting a Light Transmitting Surface of an Optoelectronic Device 有权
标题翻译：用于保护光电器件光透射表面的硅树脂
公开(公告)号：US20090123764A1
公开(公告)日：2009-05-14
申请号：US11937425
申请日：2007-11-08
申请人： Yasumasa Morita , Nicolaas Joseph Martin van Leth , Cheun Jye Yow , Wai Choo Chai , Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Yasumasa Morita , Nicolaas Joseph Martin van Leth , Cheun Jye Yow , Wai Choo Chai , Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B05D5/06 , B32B9/04 , C08F220/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , C09D183/04 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： A silicone resin composition and process for coating a light transmitting surface of an optoelectronic device is disclosed. The process involves applying a silicone resin to the light transmitting surface, and causing the silicone resin to cure to form a light transmitting protective coating on the light transmitting surface, the silicone resin having a sufficiently low proportion of organosiloxanes having molecular weights of up to about 1000, such that the protective coating includes less than about 10% of the organosiloxanes having molecular weights of up to about 1000.
摘要翻译：公开了一种有机硅树脂组合物和用于涂覆光电子器件的透光表面的方法。该方法包括将硅树脂施加到透光表面上，并使硅树脂固化以在透光表面上形成透光保护涂层，硅树脂具有足够低比例的分子量高达约 1000，使得保护性涂层包含小于约10％的分子量高达约1000的有机硅氧烷。

146. 发明授权

US07521813B2 Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device 有权
标题翻译：硅橡胶组合物，发光半导体嵌入/保护材料和发光半导体器件
公开(公告)号：US07521813B2
公开(公告)日：2009-04-21
申请号：US10885670
申请日：2004-07-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： H01L23/29 , C08F283/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , H01L33/56 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/12044 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A silicone rubber composition comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organopolysiloxane of resin structure comprising SiO2 units, R3nR4pSiO0.5 units and R3qR4rSiO0.5 units wherein R3 is vinyl or allyl, R4 is a monovalent hydrocarbon group free of aliphatic unsaturation, n is 2 or 3, p is 0 or 1, n+p=3, q is 0 or 1, r is 2 or 3, q+r=3, (C) an organohydrogenpolysiloxane having at least two SiH groups, and (D) a platinum catalyst cures into a silicone rubber having excellent rubbery and strength properties and little surface tack.
摘要翻译：一种硅橡胶组合物，其包含（A）含有至少两个脂族不饱和键的有机聚硅氧烷，（B）包含SiO 2单元的树脂结构的有机聚硅氧烷，R3nR4pSiO0.5单元和R3qR4rSiO0.5单元，其中R3是乙烯基或烯丙基，R4是一价不含脂肪族不饱和键的烃基，n为2或3，p为0或1，n + p = 3，q为0或1，r为2或3，q + r = 3，（C）有机氢聚硅氧烷，至少两个SiH基团，和（D）铂催化剂固化成具有优异的橡胶强度和强度性能以及很小的表面粘性的硅橡胶。

147. 发明授权

US07498085B2 Epoxy/silicone mixed resin composition and light-emitting semiconductor device 有权
标题翻译：环氧/硅酮混合树脂组合物和发光半导体器件
公开(公告)号：US07498085B2
公开(公告)日：2009-03-03
申请号：US10990959
申请日：2004-11-18
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B9/04
CPC分类号： C08L63/00 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/22 , C08L83/04 , H01L23/296 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/12044 , Y10T428/31511 , Y10T428/31663 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： An epoxy/silicone mixed resin composition comprising (A′) an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption.
摘要翻译：包含（A'）含有至少一个脂族不饱和一价烃基和至少一个硅原子键合羟基的有机硅化合物的环氧/硅氧烷混合树脂组合物，（B）含有至少一个环氧基的环氧树脂（C ）有机氢聚硅氧烷，（D）铂族金属类催化剂，（E）铝系固化催化剂用于封装发光半导体部件。发光半导体器件在热测试中几乎不发生变色，并且具有高发光效率，长寿命和降低的能量消耗。

148. 发明申请

US20070293623A1 PHOSPHOR-FILLED CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF 有权
标题翻译：磷光填充固化硅树脂组合物及其固化产品
公开(公告)号：US20070293623A1
公开(公告)日：2007-12-20
申请号：US11762445
申请日：2007-06-13
申请人： Tsutomu KASHIWAGI , Toshio Shiobara
发明人： Tsutomu KASHIWAGI , Toshio Shiobara
IPC分类号： C08L83/04 , B32B27/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , C08K3/32 , C08L83/00
摘要： A phosphor-containing addition-curable silicone resin composition is provided. The composition is capable of forming a cured product which exhibits excellent crack resistance and shock resistance, and minimal surface tackiness. The composition includes (A) an organopolysiloxane including R1SiO1.5 units (T units), R22SiO units (D units), and R3aR4bSiO(4-a-b)/2 units (wherein, R1, R2 and R3 represent a methyl group or the like, R4 represents a vinyl group or allyl group, a represents an integer from 0 to 2, b represents 1 or 2, and a+b is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300; (B) an Si—H-containing polysiloxane including T units, D units, and R3cHdSiO(4-c-d)/2 units (wherein, c represents an integer from 0 to 2, d represents 1 or 2, and c+d is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300, in sufficient quantity that the molar ratio of Si-bonded hydrogen atoms within (B), relative to vinyl groups or allyl groups within (A), is within a range from 0.1 to 4.0; (C) a catalyst; and (D) a phosphor.
摘要翻译：提供含磷光体的可加成固化的有机硅树脂组合物。该组合物能够形成表现出优异的抗裂性和抗冲击性和最小表面粘性的固化产物。该组合物包括（A）包括R 1 SiO 2单元（T单元），R 2 2 O 2的有机聚硅氧烷， SiO单元（D单元）和R 3 S 4 S 4（4-ab））/ 2单元（其中，R 1，R 2，R 3和R 3代表甲基等， SUP> 4 代表乙烯基或烯丙基，a表示0至2的整数，b表示1或2，a + b为2或3），其中D的重复次数单位在5到300之间; （B）包含T单元，D单元和R 3 S H 2 SiO（4）的含Si-H的聚硅氧烷 -cd）/ 2个单元（其中，c表示0〜2的整数，d表示1或2，c + d为2或3），D单元的重复次数为（B）相对于乙烯基或烯丙基之间的与Si结合的氢原子的摩尔比在（A）中的摩尔比在0.1至4.0的范围内; （C）催化剂; 和（D）荧光体。

149. 发明授权

US07241823B2 Radiation curing silicone rubber composition, adhesive silicone elastomer film formed from same, semiconductor device using same, and method of producing semiconductor device 有权
标题翻译：辐射固化硅橡胶组合物，由其形成的粘合性硅氧烷弹性体膜，使用其的半导体器件，以及半导体器件的制造方法
公开(公告)号：US07241823B2
公开(公告)日：2007-07-10
申请号：US10732519
申请日：2003-12-11
申请人： Tsutomu Kashiwagi , Shinji Makikawa , Toshiyuki Sutou , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Shinji Makikawa , Toshiyuki Sutou , Toshio Shiobara
IPC分类号： C08K5/24
CPC分类号： C08L51/085 , C08K5/5425 , C08L53/00 , C08L83/00 , C08L83/06 , C08L2666/02 , C09J151/085 , C09J153/00 , C09J183/06 , C08L83/04
摘要： There are provided a radiation curing silicone rubber composition that is useful for the bonding of substrates, an adhesive silicone elastomer film formed from such a composition, a structural body in which two substrates are bonded via a cured layer formed from the composition, and a method of producing such a structural body. The composition includes: (a) an organohydrogenpolysiloxane containing at least one group selected from the group consisting of acryloyl groups and methacryloyl groups, and at least one hydrosilyl group; (b) a fluid organopolysiloxane with at least two groups which are each selected from the group consisting of acryloyl groups and methacryloyl groups, and with no hydrosilyl groups; (c) a compound selected from the group consisting of alkoxysilanes, partial hydrolysis-condensation products of alkoxysilanes, organosilane-modified isocyanurates and organosiloxane-modified isocyanurates; (d) a radiation sensitizer; and (e) a platinum group metal-based catalyst. The composition is of low elasticity, while also providing excellent heat resistance, adhesion, and workability.
摘要翻译：提供了一种可用于粘合基材的辐射固化硅橡胶组合物，由这种组合物形成的粘合性硅氧烷弹性体膜，其中两个基板通过由该组合物形成的固化层结合的结构体，以及一种方法生产这样的结构体。该组合物包括：（a）含有选自丙烯酰基和甲基丙烯酰基的至少一个基团的有机氢聚硅氧烷和至少一个氢化硅烷基; （b）具有至少两个基团的流体有机聚硅氧烷，其各自选自丙烯酰基和甲基丙烯酰基，且不具有氢化甲硅烷基; （c）选自烷氧基硅烷，烷氧基硅烷的部分水解缩合产物，有机硅烷改性的异氰脲酸酯和有机硅氧烷改性的异氰脲酸酯的化合物; （d）辐射敏化剂; 和（e）铂族金属基催化剂。该组合物具有低弹性，同时还提供优异的耐热性，粘合性和可加工性。

150. 发明申请

US20070099008A1 Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof 有权
标题翻译：生产高分子量有机聚硅氧烷的方法，包含高分子量有机聚硅氧烷的组合物和用其固化产物密封的光学半导体器件
公开(公告)号：US20070099008A1
公开(公告)日：2007-05-03
申请号：US11586525
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B27/00 , C08G77/04 , C08L83/04
CPC分类号： C08G77/04 , C08G77/06 , C08G77/08 , C08G77/14 , Y10T428/31663
摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
摘要翻译：本发明提供一种聚苯乙烯换算的重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有可水解基团的硅烷化合物经受水解性基团的有机聚硅氧烷首先水解和缩合，然后使该有机聚硅氧烷再次进行水解和缩合。高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

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