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131. 发明授权

US5872386A Wafer layout of semiconductor device 失效
标题翻译：半导体器件的晶圆布局
公开(公告)号：US5872386A
公开(公告)日：1999-02-16
申请号：US680982
申请日：1996-07-16
申请人： Keiji Sato , Yutaka Saito
发明人： Keiji Sato , Yutaka Saito
IPC分类号： H01L21/78 , H01L29/861 , H01L29/872 , H01L31/103 , H01L31/108 , H01L31/18 , H01L23/58
CPC分类号： H01L21/78 , H01L29/861 , H01L29/872 , H01L31/103 , H01L31/108 , H01L31/18 , Y10S257/926
摘要： A wafer layout for a multi-channel device for improving the yield of operative devices comprises a semiconductor wafer and a plurality of semiconductor devices formed in the semiconductor wafer, each device comprising a consecutive series of impurity regions formed in the semiconductor wafer, the impurity regions being arranged consecutively without separation between the respective semiconductor devices, such that each of the semiconductor devices is indistinguishable from the others, without regard to defective devices, and a single semiconductor device comprising a plurality of consecutive impurity regions formed in the semiconductor wafer may be cut from the wafer by cutting therefrom any of the plurality of consecutive impurity regions formed therein. The invention is particularly useful for the fabrication of strip diodes and the like.
摘要翻译：用于提高操作装置的产量的多通道装置的晶片布局包括半导体晶片和形成在半导体晶片中的多个半导体器件，每个器件包括在半导体晶片中形成的连续的一系列杂质区，杂质区在各半导体器件之间连续排列而不分离，使得每个半导体器件与其他半导体器件不可区别，而不考虑器件的缺陷，并且可以切割包括形成在半导体晶片中的多个连续杂质区域的单个半导体器件从晶片通过切割从其中形成的多个连续杂质区域中的任何一个。本发明对于制造带状二极管等特别有用。

132. 发明授权

US5778899A Smoking article 失效
标题翻译：吸烟文章
公开(公告)号：US5778899A
公开(公告)日：1998-07-14
申请号：US530105
申请日：1995-09-26
申请人： Yutaka Saito , Yuriko Anzai , Ryuichi Suzuki , Hiroshi Ichinose
发明人： Yutaka Saito , Yuriko Anzai , Ryuichi Suzuki , Hiroshi Ichinose
IPC分类号： A24B3/12 , A24B15/10 , A24B15/16 , A24F47/00 , A24B15/12
CPC分类号： A24F47/004 , A24B15/10 , A24B15/16 , A24B15/165
摘要： A smoking article has a flavor-generating material as a burnable smoking element. The flavor-generating material includes a flavoring component-holding material formed of a heat-irreversibly gelled glucan and a flavoring component held in the holding material, and is obtained by thermally gelling a mixture of ungelled glucan and the flavoring component added thereto. Since the flavoring component is firmly fixed and held within the three-dimensional network structure of the gelled glucan, the storage properties and release-durability of the flavoring component are improved.
摘要翻译： PCT No.PCT / JP95 / 00091 Sec。 371日期：1995年9月26日 102（e）1995年9月26日PCT PCT 1995年1月26日PCT公布。公开号WO95 / 20330 PCT 日期1995年8月3日吸烟制品具有作为可燃吸烟元件的发味材料。发泡材料包括由热不可逆胶凝葡聚糖形成的调味组分保持材料和保持在保持材料中的调味组分，并且通过将未凝胶化葡聚糖和加入其中的调味组分的混合物热胶凝获得。由于调味成分被牢固地固定并保持在胶凝葡聚糖的三维网状结构内，所以调味成分的保存性和耐久性提高。

133. 发明授权

US5744379A Semiconductor device composed of plural semiconductor chips and coupling means which couple the semiconductor chips together 失效
标题翻译：半导体器件由多个半导体芯片和将半导体芯片耦合在一起的耦合装置组成
公开(公告)号：US5744379A
公开(公告)日：1998-04-28
申请号：US491581
申请日：1995-06-06
申请人： Masaaki Mandai , Hitoshi Takeuchi , Yutaka Saito , Tomoyuki Yoshino
发明人： Masaaki Mandai , Hitoshi Takeuchi , Yutaka Saito , Tomoyuki Yoshino
IPC分类号： H01L21/98 , H01L23/538 , H01L25/18 , H01L21/18
CPC分类号： H01L25/50 , H01L23/5381 , H01L23/5385 , H01L25/18 , H01L2224/05553 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/01322 , H01L2924/10253
摘要： The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.
摘要翻译：多芯片安装型的半导体图像传感器装置被构造成使得在芯片之间同时进行电气和机械连接。耦合芯片4用于将多个半导体图像传感器芯片1彼此耦合，并且将一个半导体图像传感器芯片1耦合到驱动器基板3，驱动器基板3上安装用于驱动半导体图像传感器芯片1的半导体驱动芯片2。

134. 发明授权

US5722285A Caliper sensor 失效
标题翻译：卡尺传感器
公开(公告)号：US5722285A
公开(公告)日：1998-03-03
申请号：US688434
申请日：1996-07-30
申请人： Akihiko Tsuchiya , Yutaka Saito , Kazunori Onozawa
发明人： Akihiko Tsuchiya , Yutaka Saito , Kazunori Onozawa
IPC分类号： G01B7/06 , G01B7/00
CPC分类号： G01B7/107
摘要： A caliper sensor of the opposing contact type, wherein are provided target supporting spherical surfaces comprising at least three spherical surfaces disposed on a periphery of a target facing plane of a sliding surface and a plane determined by the tops of each spherical surface and in contact in parallel with a measurement reference plane above the target; and contact spherical surfaces for the reference plane outside the target facting plane of the sliding surface, whose number is equal to or greater than that of the relevant target supporting spherical surfaces and the tops of each spherical surface having a height about equal to the relevant target supporting spherical surfaces, so that contaminants are steered away from the tops of the spherical surfaces and the measurement process is thereby unaffected by the contaminants for a long period of time.
摘要翻译：相对接触型的卡尺传感器，其中设置有目标支撑球面，其包括设置在滑动表面的目标面对平面的周边上的至少三个球形表面和由每个球形表面的顶部确定并且接触的平面与目标上方的测量参考平面平行; 并且将滑动表面的目标实际平面外的参考平面的球面接触，其数量等于或大于相关的目标支撑球形表面的顶点，并且每个球形表面的顶部具有大约等于相关目标的高度支撑球形表面，使得污染物从球形表面的顶部转向远离，并且测量过程由此不被污染物长时间影响。

135. 发明授权

US5523252A Method for fabricating and inspecting semiconductor integrated circuit substrate, and semi-finished product used for the sustrate 失效
标题翻译：用于制造和检查半导体集成电路基板的方法以及用于所述基底的半成品
公开(公告)号：US5523252A
公开(公告)日：1996-06-04
申请号：US112618
申请日：1993-08-26
申请人： Yutaka Saito
发明人： Yutaka Saito
IPC分类号： H01L21/66 , H01L23/544 , H01L21/70
CPC分类号： H01L22/14 , H01L22/20 , H01L22/34
摘要： The turn around time required for fabricating a semiconductor integrated circuit from initial conception through packaging may be dramatically reduced by testing the electrostatic integrity of the integrated circuit during fabrication rather than after packaging. In such a method, an electrostatic test device is formed on the same substrate on which the integrated circuit is formed. The test element may or may not comprise a portion of the integrated circuit itself, and a plurality of such test elements may in fact be formed along scribe lines in the wafer. Prior to dicing of individual integrated circuits, the electrostatic withstand capacity of the test element is determined by locating the power required to destroy the test element. The electrostatic destruction withstanding value of the integrated circuit is then derived from the maximum nondestruct power of the test element. Thus, an inspection step for electrostatic withstand capacity may be performed during fabrication, and need not await final packaging.
摘要翻译：通过在制造过程中测试集成电路的静电完整性，而不是在封装之后，从初始概念到封装制造半导体集成电路所需的转折时间可能会大大降低。在这种方法中，在形成集成电路的同一基板上形成静电测试装置。测试元件可以或可以不包括集成电路本身的一部分，并且实际上可以沿着晶片中的划线形成多个这样的测试元件。在对各个集成电路进行切割之前，通过定位破坏测试元件所需的功率来确定测试元件的静电耐受能力。然后从测试元件的最大非破坏功率导出集成电路的静电破坏耐受值。因此，可以在制造期间执行用于静电耐受能力的检查步骤，并且不需要等待最终包装。

136. 发明授权

US5513387A Automatic gain control circuit 失效
标题翻译：自动增益控制电路
公开(公告)号：US5513387A
公开(公告)日：1996-04-30
申请号：US76847
申请日：1993-06-15
申请人： Yutaka Saito , Yasumi Imagawa
发明人： Yutaka Saito , Yasumi Imagawa
IPC分类号： H03G3/20 , H03G3/30 , H04B1/16
CPC分类号： H03G3/3052
摘要： In a receiver for effecting an intermittent reception operation, a reception unit including an antenna, a radio frequency amplifier, a local oscillator and a mixer, a received signal processing circuit for starting signal processing of a received signal from the reception unit after the passage of a predetermined time, a reception field level detection unit for detecting the level of the received signal and an automatic gain control unit for controlling the level of the received signal within the predetermined time and holding the controlled level after the passage of the predetermined time, are disposed in a plurality of stages.
摘要翻译：在用于进行间歇接收操作的接收机中，包括天线，射频放大器，本地振荡器和混频器的接收单元，用于在通过之后从接收单元开始对接收信号进行信号处理的接收信号处理电路预定时间，用于检测接收信号的电平的接收电平检测单元和用于在预定时间内控制接收信号的电平并且在经过预定时间后保持受控电平的自动增益控制单元是设置在多个阶段。

137. 发明授权

US5198161A Parison thickness control method 失效
标题翻译： PARISON厚度控制方法
公开(公告)号：US5198161A
公开(公告)日：1993-03-30
申请号：US664823
申请日：1991-03-05
申请人： Masashi Ogura , Yutaka Saito , Masayuki Akimoto , Minoru Oizumi
发明人： Masashi Ogura , Yutaka Saito , Masayuki Akimoto , Minoru Oizumi
IPC分类号： B29C47/92 , B29C49/04
CPC分类号： B29C47/92 , B29C2947/92076 , B29C2947/92409 , B29C2947/92647 , B29C2947/92904 , B29C47/0023 , B29C49/04
摘要： A parison thickness control system includes an extruder die and a mandrel which are movable relative to each other to change wall thickness of a parison extruded between the extruder die and the mandrel during an extrusion or forming cycle of the parison. A parison control pattern is derived by manually inputting master points each defined in terms of a target parison wall thickness and an elapsed time during the parison extrusion cycle. A further parison control pattern is derived by performing the spline interpolation to interpolate between the master points. A still further parison control pattern is derived by correcting the above-noted further parison control pattern to allow the maximum or minimum value of the master points to indicate a limit value for the target parison wall thickness during the parison extrusion cycle. The parison extrusion cycle is divided into a given number of equal time intervals to define cycle points. The target parison wall thickness is derived for each cycle point based on the above-noted still further parison control pattern. The relative movement between the extruder die and the mandrel is controlled based on the derived target parison wall thickness for each cycle point. At least one of the cycle points may be used for triggering operation of an associated device.

138. 发明授权

US5191072A Lipid A monosaccharide analogues 失效
标题翻译：脂肪单糖类似物
公开(公告)号：US5191072A
公开(公告)日：1993-03-02
申请号：US689770
申请日：1991-07-17
申请人： Akira Hasegawa , Makoto Kiso , Shinichi Uesato , Masanobu Suzuki , Tomio Ishida , Yutaka Saito
发明人： Akira Hasegawa , Makoto Kiso , Shinichi Uesato , Masanobu Suzuki , Tomio Ishida , Yutaka Saito
IPC分类号： A61K31/665 , A61K31/70 , A61K31/7024 , A61P35/00 , A61P37/04 , C07F9/655 , C07H13/06
CPC分类号： C07H13/06 , C07F9/6552 , Y02P20/55
摘要： Lipid A monosaccharide analogues of the following general formula: ##STR1## wherein R.sub.1 is a hydrogen atom or a hydroxyl group, 1 is an integer of 8-14, m is an integer of 11-17 integer, and n is 8-14 integer.

139. 发明授权

US5157499A High-speed video camera using solid-state image sensor 失效
标题翻译：使用固态图像传感器的高速视频摄像机
公开(公告)号：US5157499A
公开(公告)日：1992-10-20
申请号：US716630
申请日：1991-06-17
申请人： Kazuhiko Oguma , Yutaka Saito , Hiroshi Suzuki
发明人： Kazuhiko Oguma , Yutaka Saito , Hiroshi Suzuki
IPC分类号： H04N5/335
CPC分类号： H04N3/1562 , H04N3/1593 , H04N5/335
摘要： A high-speed video camera having a plurality of solid-state black-and-white image pickup elements to which same scene is projected, respectively, each of said image pickup elements consisting of a plurality of photoelectric conversion element rows, some of which are scanned at the same time. A high-speed color video camera having a plurality of solid-state black-and-white image pickup elements and a plurality of solid-state color image pickup elements to which same scene is projected, respectively, each of image pickup elements consisting of a plurality of photoelectric conversion element rows, some of which in the solid-state black-and-white image pickup elements are scanned at the same time so that a luminance signal component is obtained therefrom, and some of which in the solid-state color image pickup elements are scanned at the same time so that a color signal component is obtained therefrom. The luminance signal component and the color signal component are synthesized to form a color image.

140. 发明授权

US4712407A Apparatus for working surface of metal pipe 失效
标题翻译：金属管工作面设备
公开(公告)号：US4712407A
公开(公告)日：1987-12-15
申请号：US725275
申请日：1985-04-19
申请人： Naokazu Yoshiki , Yutaka Saito , Tsuneo Haba
发明人： Naokazu Yoshiki , Yutaka Saito , Tsuneo Haba
IPC分类号： B21C1/22 , B21B19/12 , B21C1/24 , B21C3/16 , B21C37/15 , B21C37/20 , B21H3/08 , F15B15/28
CPC分类号： B21C3/16 , B21C1/24 , B21C37/20 , B21C37/207 , B21H3/08 , F15B15/28 , B21B19/12
摘要： An apparatus for working a surface of a metal pipe is provided. The apparatus comprises a drawing unit for drawing a metal pipe to reduce a diameter thereof, and a working assembly for working the diameter-reduced metal pipe to form an inner surface and/or an outer surface thereof into a predetermined configuration. The working assembly includes a rolling unit and a driving mechanism therefor. The rolling unit includes a housing, a plurality of rolling rolls rotatably disposed within the housing and outside the metal pipe so that the rolling rolls have their respective axes extending at an inclination angle with respect to an axis of the metal pipe. The rolling rolls are respectively mounted on support shafts rotatably supported in the housing through thrust bearings. The driving mechanism drivingly rotates the rolling unit to revolve the rolling rolls around the metal pipe. The rolling unit is removably mounted on the driving mechanism.
摘要翻译：提供了一种用于加工金属管表面的设备。该装置包括用于拉伸金属管以减小其直径的拉伸单元，以及用于对直径减小的金属管进行加工以形成预定结构的内表面和/或外表面的工作组件。工作组件包括滚动单元及其驱动机构。滚动单元包括壳体，多个滚动辊，其可旋转地设置在壳体内并且在金属管外部，使得滚动辊具有相对于金属管的轴线倾斜倾斜的角度。轧辊分别安装在通过推力轴承可旋转地支撑在壳体中的支撑轴上。驱动机构使轧制单元驱动旋转，使轧制辊围绕金属管旋转。滚动单元可拆卸地安装在驱动机构上。

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