会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 131. 发明授权
    • Method of fabricating semiconductor memory device
    • 制造半导体存储器件的方法
    • US07098104B2
    • 2006-08-29
    • US10822676
    • 2004-04-13
    • Junichi SuzukiKohji Kanamori
    • Junichi SuzukiKohji Kanamori
    • H01L21/336
    • H01L27/11521H01L27/115H01L29/42324H01L29/7885
    • A silicon layer doped with an impurity for a floating gate, a protective layer, a silicon nitride layer of a laminated hard mask and a first NSG layer are formed into a desired pattern, on which a second NSG layer is formed and left as a side wall. With the second NSG layer as a mask, the silicon nitride layer is etched. Using the remaining silicon nitride layer as a mask, the silicon layer is etched to form a silicon pattern whose surface is covered with a second protective layer, and the silicon nitride layer is etched out. Accordingly, it is possible to prevent a damage at the surface of the floating gate at the time of forming the floating gate using doped polysilicon.
    • 掺杂有用于浮置栅极,保护层,层叠硬掩模和第一NSG层的氮化硅层的杂质的硅层形成为期望的图案,其上形成有第二NSG层并且作为侧面 壁。 以第二NSG层作为掩模,蚀刻氮化硅层。 使用剩余的氮化硅层作为掩模,蚀刻硅层以形成其表面被第二保护层覆盖的硅图案,并且蚀刻氮化硅层。 因此,可以防止在使用掺杂多晶硅形成浮置栅极时在浮栅的表面处的损坏。
    • 140. 发明授权
    • Method for fabricating a laminated molded assembly
    • 制造层叠模制组件的方法
    • US06174488B1
    • 2001-01-16
    • US08108543
    • 1993-08-19
    • Nubuo UsuiJunichi SuzukiHiroyuki Shirozuka
    • Nubuo UsuiJunichi SuzukiHiroyuki Shirozuka
    • B29C3302
    • B29C51/14B29C33/46B29C35/04B29C35/045B29C43/184B29C51/08B29C70/78B29C2791/006B29L2031/3014
    • In a method and device for molding a laminated molded assembly by simultaneously forming a resin core member and integrally joining a surface skin member in a die assembly for mold press forming comprising an upper die and a lower die, the moldability of the surface skin member is improved by softening the surface skin member by blowing hot air against the surface skin member from air holes provided in the upper die which is associated with the surface skin member. As a result, the surface skin member can favorably conform to the surface contour of the die surface and the resin core member. Optionally, vacuum suction may be applied to the surface skin member to draw it against the corresponding die surface so as to eliminate the possibility of creating localized gaps between the surface skin member and the corresponding die surface. Further, by blowing air of either high temperature or ambient temperature from the air holes provided in the upper die to facilitate the removal of the laminated molded assembly from the upper die, the speed of the molding process can be increased, and the damages and deformation of the laminated molded assembly can be avoided.
    • 在通过同时形成树脂芯构件并且将表皮表面构件整体地连接到包括上模和下模的模压成形用模头组件中的模制叠层模制组件的方法和装置中,表皮表面构件的成型性为 通过从设置在与表面皮肤构件相关联的上模中的空气孔向表面皮肤构件吹热,从而软化表皮构件。 结果,表皮部件可以有利地符合模具表面和树脂芯部件的表面轮廓。 可选地,可以将真空抽吸施加到表面皮肤构件以将其吸附在相应的模具表面上,以便消除在表面皮肤构件和相应的模具表面之间产生局部间隙的可能性。 此外,通过从设置在上模中的气孔吹送高温或环境温度的空气,以便于从上模移除层叠的模制组件,可以提高成型工艺的速度,并且损坏和变形 可以避免层压模制组件。