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    • 132. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体存储器件及其制造方法
    • US20090267136A1
    • 2009-10-29
    • US12498149
    • 2009-07-06
    • Akira GodaMitsuhiro Noguchi
    • Akira GodaMitsuhiro Noguchi
    • H01L29/792H01L21/336
    • H01L27/115H01L27/105H01L27/11568H01L27/11573
    • A semiconductor memory device having a memory cell region and a peripheral circuit region, and a method of manufacturing such a semiconductor memory device, are proposed, in which trench grooves are formed to be shallow in the memory cell region in order to improve the yield, and trench grooves are formed to be deep in the high voltage transistor region of the peripheral circuit region, in particular in a high voltage transistor region thereof, in order to improve the element isolation withstand voltage. A plurality of memory cell transistors having an ONO layer 15 serving as a charge accumulating insulating layer are provided in the memory cell region, where element isolation grooves 6 for these memory cell transistors are narrow and shallow. Two types of transistors, one for high voltage and the other for low voltage, having gate insulating layers 16 or 17, which are different from the ONO layer 15 in the memory cell region, are provided in the peripheral circuit region, where at least element isolation grooves 23 for high voltage transistors are wide and deep. In this way, it is possible to improve the degree of integration and yield in the memory cell region, and secure withstand voltage in the peripheral circuit region.
    • 提出了具有存储单元区域和外围电路区域的半导体存储器件以及制造这种半导体存储器件的方法,其中沟槽形成在存储单元区域中较浅以提高产量, 并且在周边电路区域的高电压晶体管区域,特别是在其高压晶体管区域中形成深沟槽,以便提高元件隔离耐受电压。 在存储单元区域中设置有多个具有作为电荷累积绝缘层的ONO层15的存储单元晶体管,其中用于这些存储单元晶体管的元件隔离槽6窄而浅。 在外围电路区域中设置两个类型的晶体管,一个用于高电压,另一个用于低电压,具有与存储单元区域中的ONO层15不同的栅极绝缘层16或17,其中至少元件 用于高压晶体管的隔离槽23宽而深。 以这种方式,可以提高存储单元区域的集成度和产量,并且确保外围电路区域中的耐受电压。
    • 135. 发明授权
    • Nonvolatile semiconductor memory
    • 非易失性半导体存储器
    • US07245534B2
    • 2007-07-17
    • US11135415
    • 2005-05-24
    • Akira GodaMitsuhiro NoguchiMinori KajimotoYuji Takeuchi
    • Akira GodaMitsuhiro NoguchiMinori KajimotoYuji Takeuchi
    • G11C11/34
    • G11C8/10G11C16/0483G11C16/08G11C16/10H01L27/115H01L27/11521
    • A nonvolatile semiconductor memory includes: a memory cell array constituted by word lines, bit lines, and electrically erasable/rewritable memory cell transistors, which have respective tunnel insulating films and are arranged at the intersections of the word lines and the bit lines; and a word line transfer transistor, which is separated by an element isolation region, has a source diffusion layer, a channel region, a gate insulating film on the channel region, and a drain diffusion layer, and is connected to a word line and a gate electrode formed on the gate insulating film via a word line contact plug formed in the drain diffusion layer. The channel width of the word line transfer transistor is at least six times width of the word line contact plug, and the distance in a second direction between the word line contact plug and corresponding element isolation region is greater than distance in a first direction between the word line contact plug and corresponding element isolation region where, the first direction denotes a direction from the source diffusion layer towards the drain diffusion layer, and the second direction denotes a direction perpendicular to the first direction.
    • 非易失性半导体存储器包括:由字线,位线和电可擦除/可重写存储单元晶体管构成的存储单元阵列,其具有相应的隧道绝缘膜并且布置在字线和位线的交点处; 并且由元件隔离区隔开的字线传输晶体管在沟道区上具有源极扩散层,沟道区,栅极绝缘膜和漏极扩散层,并且连接到字线和 栅极通过形成在漏极扩散层中的字线接触插塞形成在栅极绝缘膜上。 字线传输晶体管的沟道宽度是字线接触插塞的至少六倍宽度,并且字线接触插塞和对应元件隔离区域之间的第二方向上的距离大于第二方向上的距离 字线接触插塞和对应元件隔离区域,其中第一方向表示从源极扩散层朝向漏极扩散层的方向,第二方向表示与第一方向垂直的方向。
    • 137. 发明申请
    • Erase method for flash memory
    • 闪存的擦除方法
    • US20070047327A1
    • 2007-03-01
    • US11215940
    • 2005-08-31
    • Akira GodaSeiichi Aritome
    • Akira GodaSeiichi Aritome
    • G11C16/04
    • G11C16/16G11C8/08G11C16/08G11C16/107G11C16/3472
    • A non-volatile memory device and programming process is described that erases blocks of non-volatile memory cells by the application of differing word line erase voltages to selected word lines during an erase cycle. This facilitates for a faster on average erase operation, a tighter erased cell Vt distribution, an increase in memory device endurance and lifetimes due to a decrease in memory cell overerasure and overstress, and a more accurate match of word line voltages to the specific non-volatile memory array, the specific region or row being programmed, and any changes in programming characteristics due to device use and wear. In one embodiment of the present invention, the differing word line erase voltages are utilized to compensate for faster and slower erasing word lines. In another embodiment, different word line erase voltages are applied based on physical aspects of the word lines of the array.
    • 描述了非易失性存储器件和编程过程,其通过在擦除周期期间将不同的字线擦除电压施加到所选择的字线来擦除非易失性存储器单元的块。 这有助于更快的平均擦除操作,更严格的擦除单元Vt分布,由于存储器单元过度和过应力的降低而导致的存储器件耐久性和寿命增加,以及字线电压与特定非线性电压的更准确的匹配, 易失性存储器阵列,正在编程的特定区域或行,以及由于器件使用和磨损而导致的编程特性的任何变化。 在本发明的一个实施例中,利用不同的字线擦除电压来补偿更快和更慢的擦除字线。 在另一个实施例中,基于阵列的字线的物理方面来应用不同的字线擦除电压。