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121. 发明申请

US20030198541A1 Semiconductor wafer processing apparatus 失效
公开(公告)号：US20030198541A1
公开(公告)日：2003-10-23
申请号：US10457944
申请日：2003-06-09
申请人： Semitool, Inc.
发明人： Jeffry A. Davis , Kert L. Dolechek , Gary L. Curtis
IPC分类号： B65G049/07
CPC分类号： H01L21/67754 , H01L21/67173 , H01L21/6732 , H01L21/67769 , H01L21/67772 , H01L21/67775 , H01L21/67778 , H01L21/67781 , H01L21/68707 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.

122. 发明授权

US06609877B1 Vacuum chamber load lock structure and article transport mechanism 有权
公开(公告)号：US06609877B1
公开(公告)日：2003-08-26
申请号：US09679498
申请日：2000-10-04
申请人： Bruce Gordon Ramsay
发明人： Bruce Gordon Ramsay
IPC分类号： B65G4907
CPC分类号： H01L21/67751 , H01L21/67126 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67739 , H01L21/67757 , H01L21/67766 , H01L21/68707 , Y02A50/412 , Y10S414/139 , Y10S414/14 , Y10S414/141
摘要： A vacuum chamber used for processing articles, such as integrated circuit wafers, display panels, and the like, has a small load lock chamber formed at an opening in a wall of the chamber by a moveable article supporting surface within the chamber and a cover outside of the chamber. The supporting surface and cover are sealed to the chamber wall when urged against it. Articles placed into the load lock chamber, when the cover is opened, are moved into the vacuum chamber for processing by moving the supporting surface away from the wall after the cover has been closed and a vacuum established in the load lock chamber. Articles are removed from the vacuum chamber in a reverse manner. Various mechanisms are describe for moving the articles, including a particular robotic device that simultaneously swaps the positions of two articles between the supporting surface and a processing location within the vacuum chamber by first pulling the articles together and then rotating them in a half-circle. Integrated circuit wafers are preferably carried on a domed surface formed of wedge shaped pieces fit together on a frame, where the wedge shaped pieces and their wafers are individually removable from the frame for transfer to another frame at a different location.

123. 发明申请

US20030123958A1 Wafer handling apparatus and method 失效
标题翻译：晶圆处理装置及方法
公开(公告)号：US20030123958A1
公开(公告)日：2003-07-03
申请号：US10307022
申请日：2002-11-27
发明人： Manny Sieradzki , Nicholas R. White
IPC分类号： B65G049/07
CPC分类号： H01L21/67745 , H01L21/67155 , H01L21/67778 , Y10S414/139
摘要： A high-speed wafer-processing apparatus and method that employs a vacuum chamber having at least two wafer transport robots and a process station. The vacuum chamber interfaces with a number of single-wafer load locks that are loaded and unloaded one wafer at a time by a robot in atmosphere. Four load locks are sized to allow for a gentle vacuum cycling of each wafer without significant pumpdown delays. The robots in the vacuum chamber move wafers sequentially from one of the load locks to a process station for processing and then to another one of the load locks for unloading by the atmospheric robot.
摘要翻译：采用具有至少两个晶片传送机器人的真空室和处理站的高速晶片处理设备和方法。真空室与多个单晶片负载锁相连接，一次由机器人在大气中装载和卸载一片晶片。四个负载锁的大小可以允许每个晶片的平缓的真空循环，而不会有明显的抽空延迟。真空室中的机器人将晶片顺序地从一个负载锁移动到处理站进行处理，然后再到另一个负载锁，以便由大气机器人卸载。

124. 发明申请

US20030113190A1 Compact apparatus and method for storing and loading semiconductor wafer carriers 审中-公开
标题翻译：用于存储和加载半导体晶片载体的紧凑的装置和方法
公开(公告)号：US20030113190A1
公开(公告)日：2003-06-19
申请号：US10348836
申请日：2003-01-22
申请人： Applied Materials, Inc.
发明人： Robert Z. Bachrach
IPC分类号： B65G001/00
CPC分类号： H01L21/67727 , H01L21/6773 , H01L21/67733 , H01L21/67736 , H01L21/67769 , H01L21/67772 , H01L21/67775 , H01L21/67781 , Y10S414/139 , Y10S414/14
摘要： An improved apparatus and method is provided for storing semiconductor wafer carriers, and for loading wafers or wafer carriers to a fabrication tool. The apparatus preferably provides an elevated port for receipt of wafer carriers from an overhead factory transport, allows for local interconnection among a plurality of the inventive apparatuses, and enables independent loading of the factory load port and the tool load port. An inventive wafer handling method which divides a lot of wafers into sublots and distributes the sublots among tools configured to perform the same process is also provided.
摘要翻译：提供了一种改进的装置和方法，用于存储半导体晶片载体，并将晶片或晶片载体装载到制造工具。该设备优选地提供用于从架空工厂运输接收晶片载体的升高端口，允许多个本发明设备之间的本地互连，并且使得能够独立地加载工厂装载端口和工具装载端口。还提供了一种本发明的晶片处理方法，其将大量晶片划分成子图并且在配置为执行相同处理的工具之间分配子图。

125. 发明授权

US06568899B1 Wafer processing system including a robot 失效
标题翻译：晶圆处理系统包括机器人
公开(公告)号：US06568899B1
公开(公告)日：2003-05-27
申请号：US09451678
申请日：1999-11-30
申请人： Hiromitsu Kuribayashi , Woo Sik Yoo
发明人： Hiromitsu Kuribayashi , Woo Sik Yoo
IPC分类号： B65G4907
CPC分类号： H01L21/67766 , Y10S414/135 , Y10S414/139
摘要： A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.
摘要翻译：通过使用垂直安装的模块（如反应堆，装载锁和冷却站），晶圆处理系统占地面积最小。通过使用采用旋转运动的装载站将晶片载体移动到装载锁中，可以进一步节省占地面积。晶片处理系统包括具有用于访问垂直安装的模块的延伸，旋转和垂直运动的机器人。机器人内部冷却并具有耐热的末端执行器，使机器人与高温半导体加工兼容。

126. 发明申请

US20030094059A1 Slide apparatus and its stage mechanism for use in vacuum 失效
标题翻译：滑动装置及其在真空中使用的舞台机构
公开(公告)号：US20030094059A1
公开(公告)日：2003-05-22
申请号：US10300338
申请日：2002-11-20
申请人： KYOCERA Corporation
发明人： Akira Higuchi , Takayuki Kato , Kenichi Iwasaki
IPC分类号： F16C032/06
CPC分类号： F16C32/06 , F16C29/025 , F16C2300/62 , G03F7/70716 , G03F7/70816 , G03F7/70841 , H01J37/20 , H01L21/68 , Y10S414/139 , Y10T74/20354
摘要： The XY stage mechanism comprises a Y slide shaft 2 penetrating through only one side surface of the wall surfaces of a vacuum chamber 1 for holding a stage base plate in a cantilevered manner, a Y air slide bearing 4 for guiding the Y slide shaft 2, an X air slide plate 5, a first air slide bearing 6 for supporting the X air slide plate 5, a coupling portion 8, and a second X air slide bearing 9 serving as the guide of the coupling portion 8, whereby, in a state where not only the Y slide shaft is floated up but also the X air slide plate and coupling portion are floated up, the XY stage is driven.
摘要翻译： XY平台机构包括Y型滑动轴2，Y滑动轴2仅穿过真空室1的壁面的一个侧面，用于以悬臂方式保持台架基座; Y空气滑动轴承4，用于引导Y滑动轴2; X空气滑动板5，用于支撑X空气滑动板5的第一空气滑动轴承6，联接部8和作为联接部8的引导件的第二X空气滑动轴承9，其中不仅Y滑动轴浮起，而且X空气滑板和联接部分浮起，XY台被驱动。

127. 发明申请

US20030091410A1 Reduced footprint tool for automated processing of microelectronic substrates 失效
标题翻译：减少微电子基板自动化处理的工具
公开(公告)号：US20030091410A1
公开(公告)日：2003-05-15
申请号：US10292147
申请日：2002-11-12
发明人： Robert E. Larson , Sean D. Simondet , David C. Zimmerman , Todd K. Maciej , Quirin W. Matthys
IPC分类号： B65G037/00
CPC分类号： H01L21/67161 , H01L21/67167 , H01L21/67173 , H01L21/67178 , H01L21/67196 , H01L21/67769 , H01L21/67781 , Y10S414/138 , Y10S414/139 , Y10S414/141
摘要： The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.
摘要翻译：本发明提供了处理微电子基板的工具和方法，其中工具保持高通量，但具有比传统工具显着更低的占地面积。在优选方面，本发明提供了新颖的工具设计，其中多种工具功能以新颖的方式在工具的x，y和/或z轴上重叠。

128. 发明申请

US20030091409A1 Integrated system for tool front-end workpiece handling 有权
标题翻译：用于刀具前端工件处理的集成系统
公开(公告)号：US20030091409A1
公开(公告)日：2003-05-15
申请号：US10194702
申请日：2002-07-12
发明人： Mark Danna , Roger G. Hine , Anthony C. Bonom
IPC分类号： B65G049/07
CPC分类号： H01L21/68707 , H01L21/67736 , H01L21/67766 , H01L21/67772 , H01L21/67775 , Y10S414/139
摘要： An integrated system is disclosed for workpiece handling and/or inspection at the front end of a tool. The system comprises a rigid member of unitary construction such as a metal plate which mounts to the front of a tool associated with a semiconductor process. The front end components, including the load port assemblies, prealigners and workpiece handling robot, are mounted to the plate to provide precise and repeatable positioning of the front end components with respect to each other.
摘要翻译：公开了一种用于工具前端的工件处理和/或检查的集成系统。该系统包括一体式结构的刚性构件，例如安装到与半导体工艺相关联的工具的前部的金属板。包括负载端口组件，预对准器和工件处理机器人的前端部件安装到板上，以提供前端部件相对于彼此的精确和可重复的定位。

129. 发明授权

US06551044B1 Bellows isolation for index platforms 有权
标题翻译：波纹管隔离指数平台
公开(公告)号：US06551044B1
公开(公告)日：2003-04-22
申请号：US09395795
申请日：1999-09-14
申请人： Ronald R. Stevens
发明人： Ronald R. Stevens
IPC分类号： B65G4907
CPC分类号： H01L21/67017 , H01L21/67126 , Y10S414/139
摘要： A loadlock chamber for a semiconductor processing apparatus comprises an index platform or registration plate, a shaft extending through a wall of the chamber to actuate the platform, and a bellows located on the outside of the chamber to isolate the shaft from the external environment. A seal is placed between the bottom of the registration plate and the wall of the chamber so as to isolate the space under the registration plate and within the bellows from the remainder of the chamber when the platform is in a fully lowered position. A gutter is formed in a wall of the chamber below the registration plate to catch particulate matter, such as broken wafer particles. A method of accessing the interior of a loadlock chamber limits exposure of the space within the bellows to the external environment.
摘要翻译：一种用于半导体处理设备的负荷锁定室包括一个折射平台或配准板，一个延伸穿过该室的壁以致动该平台的轴，以及一个位于该室外侧的波纹管，以将轴与外部环境隔离开来。密封件放置在对齐板的底部和室的壁之间，以便当平台处于完全降低的位置时，隔离该对准板下面的空间和波纹管内的空间。在对准板下方的腔室的壁中形成沟槽以捕获诸如破碎的晶片颗粒的颗粒物质。访问负载锁定室的内部的方法限制波纹管内的空间暴露于外部环境。

130. 发明授权

US06550158B2 Substrate handling chamber 有权
标题翻译：基板处理室
公开(公告)号：US06550158B2
公开(公告)日：2003-04-22
申请号：US09727736
申请日：2000-12-01
申请人： Allan Doley , Dennis Goodwin , Kenneth O'Neill , Gerben Vrijburg , David Rodriguez , Ravinder Aggarwal
发明人： Allan Doley , Dennis Goodwin , Kenneth O'Neill , Gerben Vrijburg , David Rodriguez , Ravinder Aggarwal
IPC分类号： F26B300
CPC分类号： C30B29/14 , C23C16/4401 , C23C16/4408 , C30B25/08 , Y10S414/139
摘要： An apparatus and method for reducing particles in reactors. The apparatus includes an enclosure with a wafer handling chamber connected by an isolation gate valve to a processing chamber. Pipes deliver purge gas into the wafer handling chamber to eliminate particles from the enclosure. A pilot operated back pressure regulator regulates the delivery and removal of the purge gas. The apparatus actuates the isolation gate valve in a controlled rate to reduce disturbances from the purge gas entering into the enclosure. A Bernoulli wand is provided for lifting and holding a single semiconductor wafer. A dome loaded regulator actuated by a pilot gas is used to control the ramp rates of gas to the Bernoulli wand. The ramping rates of the Bernoulli wand gas can be controlled by restrictions and check valves in the pilot gas line. The apparatus also utilizes ionizers in the purge gas lines entering the wafer handling chamber and load locks. Through the use of an alpha particle emission source in the purge gas line prior to the load lock and wafer handling chamber, the purged gas molecules are ionized. The ionized gas is conductive and therefore discharges static so that wafers are no longer attracted to each other by electrostatic force. In addition, the apparatus includes means for reducing gas flow turbulence when switching valves within the reactor.
摘要翻译：用于还原反应器中的颗粒的装置和方法。该装置包括具有通过隔离闸阀连接到处理室的晶片处理室的外壳。管道将净化气体输送到晶片处理室中以消除外壳中的颗粒。先导操作的背压调节器调节吹扫气体的输送和去除。该设备以受控的速率驱动隔离闸阀，以减少进入外壳的吹扫气体的干扰。提供伯努利棒用于提升和保持单个半导体晶片。使用由先导气体驱动的圆顶加载式调节器来控制伯努利魔杖的气体斜坡速率。伯努利魔杖气体的斜率可以通过先导气体管线中的限制和止回阀来控制。该设备还在进入晶片处理室的清洗气体管线和负载锁定中使用电离器。通过在负载锁定和晶片处理室之前在吹扫气体管线中使用α粒子发射源，将净化的气体分子电离。电离气体是导电的，因此放电静电，使得晶片不再被静电力彼此吸引。另外，该设备包括当在反应器内切换阀时减少气流湍流的装置。

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