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    • 123. 发明申请
    • Plasma-Polymerized Hydrogel Thin Films and Methods for Making the Same
    • 等离子体聚合水凝胶薄膜及其制备方法
    • US20070010596A1
    • 2007-01-11
    • US11456522
    • 2006-07-10
    • Dennis HessPrabhakar TamirisaJere Koskinen
    • Dennis HessPrabhakar TamirisaJere Koskinen
    • G02B1/04
    • C08F265/00C08F265/04C08L51/003C09D151/003C08L2666/02
    • Plasma-polymerized hydrogel thin films and methods for making the same are provided. According to some embodiments of the present invention, plasma polymerization can be utilized to fabricate thermoresponsive hydrogel films of N-isopropylacrylamide (NIPAAm) on a substrate in a single deposition step. For example, an embodiment of the present invention includes fabricating a crosslinked polymeric structure utilized to form a thin film hydrogel. The polymeric structure fabrication method can comprise vaporizing a monomer and polymerizing the monomer using a plasma reactor. Polymerizing the monomer can crosslink the monomer to form a polymer film, and the polymer film can be deposited onto a substrate. The crosslinked density of the polymeric structure can be varied or tailored by adjusting temperature, pressure, and power conditions within the plasma reactor. Other embodiments are also claimed and described.
    • 提供了等离子体聚合的水凝胶薄膜及其制备方法。 根据本发明的一些实施方案,可以利用等离子体聚合在单一沉积步骤中在衬底上制造N-异丙基丙烯酰胺(NIPAAm)的热反应性水凝胶膜。 例如,本发明的一个实施方案包括制备用于形成薄膜水凝胶的交联聚合物结构。 聚合物结构制造方法可以包括使单体蒸发并使用等离子体反应器聚合单体。 聚合单体可以使单体交联以形成聚合物膜,并且可以将聚合物膜沉积在基材上。 可以通过调节等离子体反应器内的温度,压力和功率条件来改变或调整聚合物结构的交联密度。 还要求保护和描述其它实施例。
    • 126. 发明申请
    • Water-borne resin composition for polyolefin and method of preparing the same
    • 聚烯烃水性树脂组合物及其制备方法
    • US20060235160A1
    • 2006-10-19
    • US11222839
    • 2005-09-12
    • Jong-Sook ParkSeung-Young ChoiChul-Yong Kim
    • Jong-Sook ParkSeung-Young ChoiChul-Yong Kim
    • C08F297/02
    • C09D151/003C08F259/02C08F220/00
    • A water-borne resin composition for polyolefin is obtained by graft polymerizing polypropylene chloride resin having a chlorine degree of about 10-40% and an acryl monomer. First, polypropylene chloride resin solution is prepared by mixing about 5-30 parts by weight of polypropylene chloride resin having a chlorine degree of about 10-40 and about 5-30 parts by weight of a hydrophilic solvent. Then, an acryl monomer solution is prepared by mixing about 70-95 parts by weight of an acryl monomer, a solvent and an initiator. The acryl monomer solution is dropped into the polypropylene resin solution at a temperature of about 80-130° C. and thus obtained product is neutralized and diluted. The composition has a good adhesiveness onto polyolefin, so that the composition may be applied as a water-borne paint composition for polyolefin-based substrate.
    • 通过接枝聚合具有约10-40%氯度的聚丙烯氯树脂和丙烯酸单体获得聚烯烃用水性树脂组合物。 首先,通过混合约5-30重量份的氯度为约10-40和约5-30重量份的亲水性溶剂的聚氯乙烯树脂来制备聚丙烯氯化物树脂溶液。 然后,通过混合约70-95重量份的丙烯酸单体,溶剂和引发剂来制备丙烯酸单体溶液。 将丙烯酸单体溶液在约80-130℃的温度下滴入聚丙烯树脂溶液中,由此得到的产物被中和并稀释。 该组合物对聚烯烃具有良好的粘附性,因此该组合物可以作为聚烯烃类基材的水性涂料组合物使用。
    • 129. 发明申请
    • Non-sticky water-based conformal coating material
    • 非粘性水性保形涂料
    • US20060178479A1
    • 2006-08-10
    • US11399468
    • 2006-04-07
    • Masashi HashimotoHideo Maeda
    • Masashi HashimotoHideo Maeda
    • C08F8/00
    • H05K3/285C08F265/04C09D151/003H05K3/284C08F212/08
    • A non-sticky water-based coating material in the form of a film applied to the face of a circuit board that is loaded with electronic parts; which comes into contact with the outside environment. The coating material can be formed into the film at room temperature without using a coalescence, does not contain a solvent and forms a membrane having flexibility, low Young's modulus, favorable adhesive properties, moisture resistance and insulating properties. Specifically, the non-sticky water-based conformal coating material includes a resin wherein a flexible acrylic resin having glass transition temperature of at most 0° C. is the main chain and a vinyl polymer having a glass transition temperature of at least 20° C. is grafted to the flexible acrylic resin; the content of the vinyl polymer being 10 to 70% by weight based on the flexible acrylic resin.
    • 将一种薄膜形式的非粘性水性涂料施加到装有电子部件的电路板的表面上; 这与外部环境接触。 涂层材料可以在室温下形成膜而不使用聚结,不含溶剂并形成具有柔软性,低杨氏模量,良好的粘合性,耐湿性和绝缘性的膜。 具体而言,非粘性水性保形涂敷材料包括玻璃化转变温度为0℃以下的柔性丙烯酸树脂为主链,玻璃化转变温度为20℃以上的乙烯基聚合物 接枝到柔性丙烯酸树脂上; 基于柔性丙烯酸树脂,乙烯基聚合物的含量为10〜70重量%。