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121. 发明授权

US07026382B2 Conductive resin composition 有权
公开(公告)号：US07026382B2
公开(公告)日：2006-04-11
申请号：US10422011
申请日：2003-04-24
申请人： Hideki Akiba , Masachika Yoshino , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Hideki Akiba , Masachika Yoshino , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C08K5/54 , H01B1/24 , C08L77/00 , C08L79/00 , C08L63/00
CPC分类号： H01B1/22 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/28 , C08G77/70 , C08L83/04 , C08L83/14 , C08L101/00 , H05K3/321 , H05K2201/0212 , C08L2666/02 , C08L83/00
摘要： A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.

122. 发明授权

US06949294B2 Radiation curing silicone rubber composition and adhesive silicone elastomer film 有权
标题翻译：辐射固化硅橡胶组合物和粘性硅橡胶膜
公开(公告)号：US06949294B2
公开(公告)日：2005-09-27
申请号：US10366357
申请日：2003-02-14
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B25/20 , C08K5/54 , C08L83/06 , C08L83/14 , C08F2/46 , C08L83/00
CPC分类号： C08L83/06 , B32B25/20 , C08K5/54 , C08L83/14 , Y10T428/31663 , C08L83/00
摘要： A radiation curing silicone rubber composition is provided. This composition includes as a base polymer either a liquid polysiloxane with a (meth)acryloyl group and a hydrosilyl group, or a combination of a liquid polysiloxane with at least two (meth)acryloyl groups and a liquid polysiloxane with a hydrosilyl group. This composition is formed into a film, and then subjected to radiation curing, thereby producing an adhesive silicone rubber elastomer film with low elasticity, adequate heat resistance, powerful adhesion and good workability. This film is useful for bonding electronic components using methods such as die bonding.
摘要翻译：提供辐射固化硅橡胶组合物。该组合物作为基础聚合物包括具有（甲基）丙烯酰基和氢化硅烷基的液体聚硅氧烷，或具有至少两个（甲基）丙烯酰基的液体聚硅氧烷和具有氢甲硅烷基的液体聚硅氧烷的组合。将该组合物形成膜，然后进行辐射固化，由此制备具有低弹性，足够的耐热性，强大的附着力和良好的可加工性的粘合性硅橡胶弹性体膜。该膜可以使用诸如芯片粘合的方法来接合电子元件。

123. 发明申请

US20050129957A1 Epoxy/silicone mixed resin composition and light-emitting semiconductor device 有权
标题翻译：环氧/硅酮混合树脂组合物和发光半导体器件
公开(公告)号：US20050129957A1
公开(公告)日：2005-06-16
申请号：US10990959
申请日：2004-11-18
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L63/00 , C08G59/68 , C08K3/22 , C08L83/04 , C08L83/05 , C08L83/07 , H01L23/29 , H01L33/54 , H01L33/56 , H01L33/62 , B32B27/38 , C08L83/00
CPC分类号： C08L63/00 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/22 , C08L83/04 , H01L23/296 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/12044 , Y10T428/31511 , Y10T428/31663 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： An epoxy/silicone mixed resin composition comprising (A′) an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption.
摘要翻译：包含（A'）含有至少一个脂族不饱和一价烃基和至少一个硅原子键合羟基的有机硅化合物的环氧/硅氧烷混合树脂组合物，（B）含有至少一个环氧基的环氧树脂（C ）有机氢聚硅氧烷，（D）铂族金属类催化剂，（E）铝系固化催化剂用于封装发光半导体部件。发光半导体器件在热测试中几乎不发生变色，并且具有高发光效率，长寿命和降低的能量消耗。

124. 发明申请

US20050009244A1 Method for sealing semiconductor component 有权
标题翻译：密封半导体元件的方法
公开(公告)号：US20050009244A1
公开(公告)日：2005-01-13
申请号：US10885678
申请日：2004-07-08
申请人： Toshio Shiobara , Tsutomu Kashiwagi
发明人： Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： H01L23/28 , H01L21/44 , H01L21/56 , H01L23/12 , H01L23/31 , H01L33/50 , H01L33/56 , H01L33/62
CPC分类号： H01L23/3157 , H01L21/56 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In connection with a semiconductor component having a circuit region and electrodes formed on a substrate surface, the circuit region is sealed by (1) applying a resist material onto the substrate surface to form a resist layer, (2) selectively exposing the resist layer to radiation and developing the resist with a liquid developer for thereby removing only the portion of the resist layer which overlies the circuit region, (3) applying a resin sealant onto the circuit region and curing the resin sealant into a cured resin layer that covers the circuit region, and (4) removing the residual resist layer using a solvent.
摘要翻译：结合具有电路区域和形成在基板表面上的电极的半导体部件，通过（1）在基板表面上施加抗蚀剂材料以形成抗蚀剂层来密封电路区域，（2）将抗蚀剂层选择性地暴露于辐射并用液体显影剂显影抗蚀剂，从而仅去除覆盖电路区域的抗蚀剂层的部分，（3）将树脂密封剂施加到电路区域上并将树脂密封剂固化成覆盖电路的固化树脂层区域，（4）使用溶剂除去残留抗蚀剂层。

125. 发明授权

US06806509B2 Light-emitting semiconductor potting composition and light-emitting semiconductor device 有权
标题翻译：发光半导体封装组合物和发光半导体器件
公开(公告)号：US06806509B2
公开(公告)日：2004-10-19
申请号：US10797139
申请日：2004-03-11
申请人： Masachika Yoshino , Toshio Shiobara
发明人： Masachika Yoshino , Toshio Shiobara
IPC分类号： H01L3300
CPC分类号： H01L33/56 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08K5/54 , C08L83/04 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/12044 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A potting composition comprising (A) an organopolysiloxane having a vinyl group at an end of its molecular chain, (B) an organohydrogenpolysiloxane, (C) a platinum group metal catalyst, and optionally, (D) an organosilicon compound having a silicon atom-bonded alkoxy group. The cured product of the composition has a refractive index of 1.41-1.56 at 25° C. and 589 nm (sodium D line). The composition is suited for the embedment and protection of light-emitting semiconductor members. A package in which a light-emitting semiconductor member is embedded and protected with the potting composition undergoes little discoloration and maintains a high emission efficiency in heating tests, thus offering a light-emitting semiconductor device featuring a long life and energy saving.
摘要翻译：一种灌封组合物，其包含（A）在其分子链末端具有乙烯基的有机聚硅氧烷，（B）有机氢聚硅氧烷，（C）铂族金属催化剂和任选的（D）具有硅原子的有机硅化合物，键合的烷氧基。组合物的固化产物在25℃和589nm（D线）的折射率为1.41-1.56。该组合物适用于发光半导体部件的嵌入和保护。通过灌封组合物嵌入和保护发光半导体部件的封装几乎不发生变色，并且在加热试验中保持高发光效率，因此提供了具有长寿命和节能的发光半导体器件。

126. 发明授权

US06709756B2 Optical device-related adhesive and optical device 有权
标题翻译：光器件相关胶粘剂和光学元件
公开(公告)号：US06709756B2
公开(公告)日：2004-03-23
申请号：US10151099
申请日：2002-05-21
申请人： Haruyoshi Kuwabara , Miyuki Wakao , Toshio Shiobara
发明人： Haruyoshi Kuwabara , Miyuki Wakao , Toshio Shiobara
IPC分类号： B32B2738
CPC分类号： H01B3/40 , Y10T428/26 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663
摘要： An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.
摘要翻译：液体环氧树脂组合物形式的粘合剂，其包含（A）液体环氧树脂，（B）基于平均粒度大于1μm至20μm的无机填料的整个组成为20至90重量％并且含有至多1重量％的粒径为至少45μm的颗粒的一部分，并且任选地，（C）硅氧烷改性树脂适合于将光学元件粘合在光学器件中。

127. 发明授权

US06709753B2 Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith 有权
标题翻译：硅氧烷改性的环氧树脂或酚醛树脂组合物和与其密封的半导体器件
公开(公告)号：US06709753B2
公开(公告)日：2004-03-23
申请号：US10079495
申请日：2002-02-22
申请人： Tsuyoshi Honda , Toshio Shiobara , Tatsuya Kanamaru
发明人： Tsuyoshi Honda , Toshio Shiobara , Tatsuya Kanamaru
IPC分类号： B32B2742
CPC分类号： H01L23/293 , C08G59/306 , C08G59/3254 , C08G77/42 , C08G81/00 , C08L61/06 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.
摘要翻译：提供一种树脂组合物，其包含通过具有特定结构单元的环氧树脂或酚醛树脂与有机聚硅氧烷反应而获得的硅氧烷改性环氧树脂或酚醛树脂。改性环氧树脂或酚醛树脂使得在改性环氧树脂或酚醛树脂单独或与另一种环氧树脂和/或酚醛树脂一起固化以形成固化产物后，有机聚硅氧烷组分在固化产物中不形成相分离结构。该组合物固化成具有环氧树脂或酚醛树脂的粘附性，耐热性和耐湿性特性以及有机硅树脂的柔韧性和耐冲击性特性的产品。

128. 发明授权

US06383659B1 Epoxy resin composition, laminate film using the same, and semiconductor device 有权
标题翻译：环氧树脂组合物，使用其的层压膜和半导体器件
公开(公告)号：US06383659B1
公开(公告)日：2002-05-07
申请号：US09548614
申请日：2000-04-13
申请人： Tsuyoshi Honda , Miyuki Wakao , Toshio Shiobara
发明人： Tsuyoshi Honda , Miyuki Wakao , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： C08G59/3218 , C08G59/3254 , C08L63/00 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16 , H01L2224/73203 , H01L2224/83101 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/1532 , H01L2924/181 , Y10T428/12528 , Y10T428/31515 , C08L2666/14 , C08L2666/02 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of up to 1.7, an inorganic filler, a curing catalyst, a thermoplastic resin, and an optional phenolic resin and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. Owing to the thermoplastic resin added, the composition avoids the problem that when a semiconductor chip is sealed with an uncured film of the composition, the film will lose its original shape or entrapped voids will be formed near the chip.
摘要翻译：一种环氧树脂组合物，其包含含有0-10重量％的2-核化合物和50-100重量％组合并具有高达1.7分散度（Mw / Mn）的3至5个核化合物的环氧树脂，无机填料，固化催化剂，热塑性树脂和任选的酚醛树脂，并且在未固化状态下具有低于15℃的Tg，有效地形成易于在室温下加工的柔性膜。由于添加了热塑性树脂，所以组合物避免了当半导体芯片被组合物的未固化膜密封时，膜将失去其原始形状，或者在芯片附近形成夹带的空隙。

129. 发明授权

US06376100B1 Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device 有权
标题翻译：倒装型半导体器件底层填充材料和倒装芯片型半导体器件
公开(公告)号：US06376100B1
公开(公告)日：2002-04-23
申请号：US09590303
申请日：2000-06-09
申请人： Toshio Shiobara , Kazuaki Sumita
发明人： Toshio Shiobara , Kazuaki Sumita
IPC分类号： H01L2912
CPC分类号： H01L24/31 , C08K5/5435 , C08K7/00 , H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/73203 , H01L2224/83951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01033 , H01L2924/01045 , H01L2924/01087 , H01L2924/10253 , Y10T428/12528 , C08L63/00 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： A composition comprising (A) 100 parts of a liquid epoxy resin, (B) 100-300 parts of a spherical inorganic filler having a maximum particle size of up to 50 &mgr;m and a mean particle size of 0.5-10 &mgr;m, (C) 0.1-6 parts of a reactive functional group-containing silicone compound, and (D) 0.01-10 parts of a curing accelerator is suitable as an underfill material for flip-chip type semiconductor devices. The composition has improved thin film infiltration and eliminates voids and other defects.
摘要翻译：一种组合物，其包含（A）100份液体环氧树脂，（B）100-300份最大粒径达50μm，平均粒径为0.5-10μm的球形无机填料，（C） 0.1-6份含反应性官能团的硅氧烷化合物和（D）0.011-10份固化促进剂适用于倒装芯片型半导体器件的底部填充材料。该组合物具有改善的薄膜渗透并消除空隙和其它缺陷。

130. 发明授权

US06143423A Flame retardant epoxy resin compositions 失效
标题翻译：阻燃环氧树脂组合物
公开(公告)号：US06143423A
公开(公告)日：2000-11-07
申请号：US55301
申请日：1998-04-06
申请人： Toshio Shiobara , Satoshi Okuse , Takayuki Aoki , Hideto Kato
发明人： Toshio Shiobara , Satoshi Okuse , Takayuki Aoki , Hideto Kato
IPC分类号： C08L63/00 , H01L23/29 , H01L29/12
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528
摘要： An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.
摘要翻译：环氧树脂组合物含有（A）环氧当量至少为185的环氧树脂，其具有两个苯环直接或通过脂族不饱和双键相互结合的结构的骨架，具有原子的碳原子 SP2类型的轨道占碳数的至少50％，（B）羟基当量至少为160的酚醛树脂，具有Sp2类型的原子轨道的碳原子占碳数的至少85％（C）相对于100重量份组分（A）和（B）组合的量为1-20重量份的聚酰亚胺树脂，和（D）无机填料的整个组合物的70-85体积％。该组合物即使不含溴化合物和锑化合物，也可固化成具有阻燃性和高温可靠性的产品。

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