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    • 124. 发明授权
    • Hydraulic device for stepless transmission
    • 液压装置用于无级变速
    • US08943818B2
    • 2015-02-03
    • US13256526
    • 2009-05-13
    • Yusuke OgataKoichi TanakaNobuaki TakahashiKenji MatsuoNaofumi Nishida
    • Yusuke OgataKoichi TanakaNobuaki TakahashiKenji MatsuoNaofumi Nishida
    • F16D31/02F16H61/00F16H61/02F16H61/662
    • F16H61/0031F16H61/0206F16H61/66259F16H2061/66286
    • A hydraulic device includes a switch-over valve 1140 provided at a section of a sub-passage 1105 located downstream of a location where a first bypass passage 1117 is connected and located upstream of a primary regulator 1110. The switch-over valve 1140 is switched between a blocked state, where supply of hydraulic oil to a section of the sub-passage 1105 located downstream of the switch-over valve 1140 is blocked, and a communication state, where supply of hydraulic oil to the section of the sub-passage 1105 located downstream of the switch-over valve 1140 is permitted. In the hydraulic device, when the switch-over valve 1140 is switched to the communication state, as a discharge performance of a main pump 1102 increases, a first check valve 1118 closes. Supply paths for hydraulic oil discharged from the sub-pump 1103 are automatically switched in accordance with the discharge performance of the main pump 1102. When the switch-over valve 1140 is switched to the blocked state, the first check valve 1118 opens and hydraulic oil discharged from the sub-pump 1103 is introduced into a main passage 1104.
    • 液压装置包括设置在位于第一旁通通道1117连接并位于主调节器1110的上游的位置下游的子通道1105的部分处的切换阀1140.切换阀1140被切换 在向位于切换阀1140下游的子通道1105的一部分供应液压油的堵塞状态之间,以及连通状态,其中向子通道1105的部分供应液压油 位于切换阀1140的下游。 在液压装置中,当切换阀1140切换到通信状态时,随着主泵1102的排出性能的增加,第一止回阀1118关闭。 从副泵1103排出的液压油的供给路径根据主泵1102的排出性能自动切换。当切换阀1140切换到阻塞状态时,第一止回阀1118打开,液压油 从副泵1103排出的空气被引入主通路1104。
    • 127. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08456019B2
    • 2013-06-04
    • US13461230
    • 2012-05-01
    • Masaya KawanoKoji SoejimaNobuaki Takahashi
    • Masaya KawanoKoji SoejimaNobuaki Takahashi
    • H01L23/42H01L23/52
    • H01L21/76898H01L23/481H01L2224/13H01L2224/13025H01L2224/14181
    • A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device 100 includes: a silicon substrate 101; a through electrode 129 extending through the silicon substrate 101; and a first insulating ring 130 provided in a circumference of a side surface of the through electrode 129 and extending through the semiconductor substrate 101. In addition, the semiconductor device 100 also includes a protruding portion 146, being provided at least in the vicinity of a back surface of a device-forming surface of the semiconductor substrate 101 so as to contact with the through electrode 129, and protruding in a direction along the surface of the semiconductor substrate 101 toward an interior of the through electrode 129.
    • 在不降低包括通孔的半导体器件的可靠性的情况下,抑制穿通电极的脱落。 半导体器件100包括:硅衬底101; 穿过硅衬底101的通孔电极129; 以及设置在贯通电极129的侧面的周围并延伸穿过半导体基板101的第一绝缘环130.此外,半导体器件100还包括突出部分146,其设置在至少在 半导体衬底101的器件形成表面的背表面与通孔129接触,并沿着半导体衬底101的表面朝向通孔129的内部突出。
    • 128. 发明申请
    • MANUFACTURING METHOD FOR ORGANIC ELECTROLUMINESCENT PANEL AND ORGANIC ELECTROLUMINESCENT PANEL MANUFACTURED USING THE SAME
    • 有机电致发光面板的制造方法及使用其制造的有机电致发光面板
    • US20130026910A1
    • 2013-01-31
    • US13640355
    • 2011-04-18
    • Masaaki MurayamaNobuaki TakahashiDaisuke Numakura
    • Masaaki MurayamaNobuaki TakahashiDaisuke Numakura
    • H05B33/10H05B33/14
    • H01L51/5246
    • A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.
    • 一种有机电致发光面板的简单制造方法,其中有机电致发光元件由密封胶布置和密封。 电致发光面板由于有机电致发光元件通过热固性粘合剂彼此粘合而具有优异的密封性和优异的耐久性。 该制造方法用于有机电致发光面板,其中至少第一电极,含有发光层的有机功能层,具有第二电极的有机电致发光元件和密封基板通过热量在基板上接合在一起 可固化粘合剂。 该方法包括在密封基板上形成热固性粘合剂层,对形成在密封基板上的热固性粘合剂层进行预热处理,将预热的可热固化粘合剂层接合到有机电致发光元件,以及 以给定的顺序对热固性粘合剂层进行热固化。
    • 130. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08183685B2
    • 2012-05-22
    • US12986716
    • 2011-01-07
    • Masaya KawanoKoji SoejimaNobuaki Takahashi
    • Masaya KawanoKoji SoejimaNobuaki Takahashi
    • H01L23/04H01L23/48
    • H01L21/76898H01L23/481H01L2224/13H01L2224/13025H01L2224/14181
    • A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device 100 includes: a silicon substrate 101; a through electrode 129 extending through the silicon substrate 101; and a first insulating ring 130 provided in a circumference of a side surface of the through electrode 129 and extending through the semiconductor substrate 101. In addition, the semiconductor device 100 also includes a protruding portion 146, being provided at least in the vicinity of a back surface of a device-forming surface of the semiconductor substrate 101 so as to contact with the through electrode 129, and protruding in a direction along the surface of the semiconductor substrate 101 toward an interior of the through electrode 129.
    • 在不降低包括通孔的半导体器件的可靠性的情况下,抑制穿通电极的脱落。 半导体器件100包括:硅衬底101; 穿过硅衬底101的通孔电极129; 以及设置在贯通电极129的侧面的周围并延伸穿过半导体基板101的第一绝缘环130.此外,半导体器件100还包括突出部分146,其设置在至少在 半导体衬底101的器件形成表面的背表面与通孔129接触,并沿着半导体衬底101的表面朝向通孔129的内部突出。