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    • 111. 发明授权
    • High fT and fmax bipolar transistor and method of making same
    • 高fT和fmax双极晶体管及其制造方法
    • US07038298B2
    • 2006-05-02
    • US10604045
    • 2003-06-24
    • Alvin Jose JosephQizhi Liu
    • Alvin Jose JosephQizhi Liu
    • H01L27/082
    • H01L29/66287H01L21/8249H01L27/0623H01L29/1004H01L29/732
    • A high fT and fmax bipolar transistor (100) includes an emitter (104), a base (120), and a collector (116). The emitter has a lower portion (108) and an upper portion (112) that extends beyond the lower portion. The base includes an intrinsic base (14) and an extrinsic base (144). The intrinsic base is located between the lower portion of the emitter and the collector. The extrinsic base extends from the lower portion of the emitter beyond the upper portion of the emitter and includes a continuous conductor (148) that extends from underneath the upper portion of the emitter and out from underneath the upper portion of the emitter. The continuous conductor provides a low electrical resistance path from a base contact (not shown) to the intrinsic base. The transistor may include a second conductor (152) that does not extend underneath the upper portion of the emitter, but which further reduces the electrical resistance through the extrinsic base.
    • 高电平和高压双极晶体管(100)包括发射极(104),基极(120)和集电极(116)。 发射器具有延伸超出下部的下部(108)和上部(112)。 基部包括内在基极(14)和外部基极(144)。 本征基极位于发射极的下部和集电极之间。 外部基极从发射器的下部延伸超过发射器的上部,并且包括从发射器的上部下方延伸并从发射器的上部下方延伸的连续导体(148)。 连续导体提供从底部触点(未示出)到本征基极的低电阻路径。 晶体管可以包括第二导体(152),其不延伸在发射极的上部下方,但是通过外部基极进一步减小电阻。
    • 114. 发明授权
    • Wide band gap bipolar transistor with reduced thermal runaway
    • 宽带双极晶体管具有减少的热失控
    • US06989581B2
    • 2006-01-24
    • US10497814
    • 2002-12-23
    • Timothy Jonathan Phillips
    • Timothy Jonathan Phillips
    • H01L27/082
    • H01L29/66318H01L29/1004H01L29/7371
    • A bipolar transistor with vertical geometry comprises a base region (1) provided with a base contact (21), emitter and collector regions (2,3) arranged to extract minority carriers from the base region, and an excluding structure for counteracting entry of minority carriers into the base region via the base contact, wherein the base region has a bandgap of greater than 0.5 eV and a doping level greater than 1017 cm−3. As shown the base includes an excluding heterojunction (4) preventing entry of carriers from the base contact (21), but alternatively the base region could comprise a “high-low” doping homojunction. The construction shows improved resistance to thermal runaway even in multi-finger transistors. It is particularly useful for high power, high frequency transistors, e.g. base on gallium indium arsenide. The collector region preferably has a heterostructure.
    • 具有垂直几何形状的双极晶体管包括设置有基极触点(21)的基极区域(1),布置成从基极区域提取少数载流子的发射极和集电极区域(2,3),以及用于抵消少数进入的排除结构 载体经由基极接触进入基极区域,其中基极区域具有大于0.5eV的带隙和大于10μS-3的掺杂水平。 如图所示,底座包括防止载体从基极触点(21)进入的排除异质结(4),但是也可选择地,基极区域可以包括“高 - 低”掺杂均质结。 该结构即使在多指状晶体管中也显示出改善的耐热失控性。 它对于大功率高频晶体管是特别有用的。 基于砷化铟镓。 收集区优选具有异质结构。
    • 115. 发明授权
    • Integrated device in emitter-switching configuration and related manufacturing process
    • 集成器件在发射极开关配置和相关制造过程中
    • US06979883B2
    • 2005-12-27
    • US10032289
    • 2001-12-21
    • Sergio Tommaso Spampinato
    • Sergio Tommaso Spampinato
    • H01L27/07H01L27/082H01L27/102H01L29/70H01L31/11
    • H01L27/0761
    • An integrated device in emitter-switching configuration is described. The device is integrated in a chip of semiconductor material of a first conductivity type which has a first surface and a second surface opposite to each other. The device comprises a first transistor having a base region, an emitter region and a collector region, a second transistor having a not drivable terminal for collecting charges which is connected with the emitter terminal of the first transistor, a quenching element of the first transistor which discharges current therefrom when the second transistor is turned off. The quenching element comprises at least one Zener diode made in polysilicon which is coupled with the base terminal of the first transistor and with the other not drivable terminal of the second transistor. The at least one polysilicon Zener diode is formed on the second surface of said chip and it comprises a polysilicon layer having at least one zone of the first conductivity type and at least one zone of a second conductivity type in order to form at least one P-N junction.
    • 描述了发射器 - 开关配置中的集成器件。 该器件集成在第一导电类型的半导体材料芯片中,该半导体材料具有彼此相对的第一表面和第二表面。 该器件包括具有基极区域,发射极区域和集电极区域的第一晶体管,具有用于收集与第一晶体管的发射极端子连接的电荷的不可驱动端子的第二晶体管,第一晶体管的猝灭元件, 当第二晶体管截止时,从其中释放电流。 淬火元件包括至少一个由多晶硅制成的齐纳二极管,其与第一晶体管的基极端子和第二晶体管的另一个不可驱动的端子耦合。 所述至少一个多晶硅齐纳二极管形成在所述芯片的第二表面上,并且其包括具有至少一个第一导电类型区域和至少一个第二导电类型区域的多晶硅层,以形成至少一个PN 交界处
    • 118. 发明申请
    • Transistor assembly and method for manufacturing same
    • 晶体管组件及其制造方法
    • US20050263851A1
    • 2005-12-01
    • US11127765
    • 2005-05-11
    • Jakob Huber
    • Jakob Huber
    • H01L21/331H01L21/8222H01L27/082H01L29/00H01L29/06H01L29/732
    • H01L29/7322H01L29/0692
    • A transistor assembly having a transistor includes a plurality of transistor regions, each of which has a vertical transistor structure having a collector semiconductor region, a base semiconductor region and an emitter semiconductor region, emitter contacting regions arranged above the transistor regions and base contacting regions connected to the base semiconductor regions via a polycrystalline semiconductor layer, wherein the polycrystalline semiconductor layer is structured such that the base contacting regions of transistor regions which are not part of the transistor are electrically isolated from base contacting regions of transistor regions which are part of the transistor.
    • 具有晶体管的晶体管组件包括多个晶体管区域,每个晶体管区域具有具有集电极半导体区域的垂直晶体管结构,基极半导体区域和发射极半导体区域,配置在晶体管区域上方的发射极接触区域和连接的基极接触区域 通过多晶半导体层到基底半导体区域,其中多晶半导体层被构造成使得不是晶体管的一部分的晶体管区域的基极接触区域与作为晶体管的一部分的晶体管区域的基极接触区域电隔离 。