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111. 发明授权

US08149566B2 Laminated electronic component and manufacturing method therefor 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08149566B2
公开(公告)日：2012-04-03
申请号：US12781058
申请日：2010-05-17
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
IPC分类号： H01G4/008
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.
摘要翻译：层叠电子部件的制造方法包括以下步骤：制备具有层叠结构的部件主体，所述部件主体包括形成在其中的多个内部电极，所述内部电极部分地露出在所述内部电极的外表面上并且在所述部件主体的外表面上形成外部端子电极，使得所述外部端子电极与所述内部电极电连接。形成外部端子电极的步骤包括以下步骤：在组件主体的内部电极的暴露的表面上形成第一镀层，至少在第一镀层的表面上以及在第一镀层的表面上施加防水剂在第一镀层的端边缘所在的部件主体的外表面，然后在其上施加有防水剂的第一镀层上形成第二镀层。

112. 发明授权

US08139342B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08139342B2
公开(公告)日：2012-03-20
申请号：US12466393
申请日：2009-05-15
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
IPC分类号： H01G4/228
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

113. 发明授权

US08102640B2 Monolithic ceramic electronic component and method of manufacturing monolithic ceramic electronic component 有权
标题翻译：单片陶瓷电子元件及其制造方法
公开(公告)号：US08102640B2
公开(公告)日：2012-01-24
申请号：US12405405
申请日：2009-03-17
申请人： Makoto Ogawa , Akihiro Motoki , Tatsuo Kunishi , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Tatsuo Kunishi , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.
摘要翻译：单片陶瓷电子部件包括层压体，其包括多个层叠的陶瓷层和在陶瓷层之间延伸的多个内部电极，并且还包括设置在层叠体上的外部电极。内部电极部分地暴露在层压体的表面处并且与外部电极彼此电连接。外部电极包括第一镀层和第二镀层。第一镀层与内部电极直接接触。第二镀层位于第一镀层的外侧，并含有分散在其中的玻璃粒子。

114. 发明授权

US08094432B2 Multilayer ceramic electronic component and method for manufacturing the same 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08094432B2
公开(公告)日：2012-01-10
申请号：US12356648
申请日：2009-01-21
申请人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/06
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , H01G13/006
摘要： A method for manufacturing a multilayer ceramic electronic component includes a first substep of depositing precipitates primarily made of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated sublayer, and a second substep of heat-treating the laminate including the plated sublayer at a temperature of at least about 800° C., wherein a plated layer including a plurality of plated sublayers is formed by continuously performing at least two cycles of the first substep and the second substep.
摘要翻译：一种多层陶瓷电子部件的制造方法，其特征在于，在层叠体的规定表面露出的内部电极的一端形成沉积有特定金属的析出物的第一子步骤，使析出物凝集成连续的镀层，以及第二子步骤，其在至少约800℃的温度下对包含所述镀层的层压板进行热处理，其中通过连续地执行所述第一子步骤和所述第一子步骤的至少两个循环来形成包括多个电镀子层的镀层，第二子步。

115. 发明授权

US07765661B2 Method for manufacturing ceramic electronic component and planting bath 有权
标题翻译：制造陶瓷电子元件和种植浴的方法
公开(公告)号：US07765661B2
公开(公告)日：2010-08-03
申请号：US11909736
申请日：2006-02-01
申请人： Akihiro Motoki , Makoto Ogawa , Seiichi Matsumoto , Yoshihiko Takano , Tatsuo Kunishi
发明人： Akihiro Motoki , Makoto Ogawa , Seiichi Matsumoto , Yoshihiko Takano , Tatsuo Kunishi
IPC分类号： H01G7/00 , C25D5/00 , H01G4/008
CPC分类号： C25D5/54 , C25D3/30 , C25D11/34 , H01G4/005 , H01G4/1227 , H01G13/00 , Y10T29/42 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/4902
摘要： A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.
摘要翻译：提供了具有优异的可焊性的陶瓷电子部件的制造方法。在该方法中，钡从陶瓷电子部件的洗脱以及陶瓷电子部件在镀锡中的粘附性降低。制造陶瓷电子部件的方法包括以下步骤：提供含钡陶瓷的电子部件，并在电子部件的外表面上形成电极，电极用锡电镀。在该方法中，镀锡中使用的镀浴的锡离子浓度A为0.03〜0.51mol / L，硫酸根离子浓度B为0.005〜0.31mol / L，摩尔比B / A小于1，pH范围为6.1至10.5。

116. 发明授权

US07719819B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US07719819B2
公开(公告)日：2010-05-18
申请号：US12043225
申请日：2008-03-06
申请人： Akihiro Motoki , Makoto Ogawa , Tatsuo Kunishi , Jun Nishikawa , Yoshihiko Takano , Shigeyuki Kuroda
发明人： Akihiro Motoki , Makoto Ogawa , Tatsuo Kunishi , Jun Nishikawa , Yoshihiko Takano , Shigeyuki Kuroda
IPC分类号： H01G4/06 , H01G7/00
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/232 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.
摘要翻译：进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。

117. 发明申请

US20080203710A1 AIRBAG MODULE 失效
标题翻译：安全气囊模块
公开(公告)号：US20080203710A1
公开(公告)日：2008-08-28
申请号：US12035051
申请日：2008-02-21
申请人： Ingo Kalliske , Friederike Keudel , Makoto Ogawa
发明人： Ingo Kalliske , Friederike Keudel , Makoto Ogawa
IPC分类号： B60R21/233
CPC分类号： B60R21/233 , B60R21/2338 , B60R2021/0044 , B60R2021/23382 , B60R2021/23386
摘要： An airbag module includes an airbag with two sections that can be inflated to restrain a vehicle occupant. The inflated airbag defines a gap separating the two sections from each other on a front side of the airbag facing the vehicle occupant. A maximum distance between the airbag sections is dependent on a degree the airbag is filled with the distance decreasing as the airbag is filled. The airbag module also includes a strap at least partially fastened to an outer skin of the airbag. The strap includes at least a first and a second section of variable length. The length of the first section increases or decreases to the extent the length of the second section decreases or increases. The length of the second section defines the maximum distance between the airbag sections.
摘要翻译：安全气囊模块包括具有两个部分的气囊，所述两个部分可以被充气以限制车辆乘员。膨胀的安全气囊限定了在面向车辆乘客的安全气囊的前侧上将两个部分彼此分开的间隙。安全气囊部分之间的最大距离取决于安全气囊被充满的程度，随着气囊的填充，距离减小。气囊模块还包括至少部分地紧固到气囊的外皮的皮带。该带包括至少一个可变长度的第一和第二部分。第一部分的长度增加或减小到第二部分的长度减小或增加的程度。第二部分的长度限定了气囊部分之间的最大距离。

118. 发明授权

US07076440B2 Business processing system employing a notice board business system database and method of processing the same 失效
标题翻译：业务处理系统采用通知板业务系统数据库和处理方法
公开(公告)号：US07076440B2
公开(公告)日：2006-07-11
申请号：US09798947
申请日：2001-03-06
申请人： Masato Tamaki , Yuji Tsusaka , Naofumi Hosoda , Eiji Takamatsu , Makoto Ogawa , Akiko Nagayama
发明人： Masato Tamaki , Yuji Tsusaka , Naofumi Hosoda , Eiji Takamatsu , Makoto Ogawa , Akiko Nagayama
IPC分类号： G06F17/60
CPC分类号： G06Q10/10 , G06Q10/06311 , G06Q10/06316
摘要： A notice board business system database stores therein collectively the contents of all the data heads relating to a series of business processes, and is held in common in the form of a notice board through clients by all the related persons in charge of the tasks. A status change rule sets the data head in which the data input should be completed with respect to each of the task processes. A status watcher refers to both the notice board business system database and the status change rule to make the task process change from the current task process to the next task process when the predetermined data input has been completed in the process in task so as to inform the related client of that the status change has occurred. In addition, the status watcher refers to a status change limit rule for setting the data input completion due date for each of the task processes so as to inform, when the processing due date is drawing near, the related client of that the processing due date is drawing near.
摘要翻译：公告板业务系统数据库共同存储与一系列业务流程相关的所有数据头的内容，并由负责任务的所有相关人员通过客户的形式通知客户。状态更改规则设置相对于每个任务进程完成数据输入的数据头。状态观察者指的是通知板业务系统数据库和状态变化规则，以使任务过程从当前任务过程改变到下一个任务过程，当预定数据输入在任务过程中完成时，通知相关客户发生了状态变更。此外，状态观察者参照用于设定每个任务处理的数据输入完成截止日期的状态变更限制规则，以便在处理到期日期近的情况下通知处理到期日的相关客户正在画近。

119. 发明申请

US20050219103A1 Apparatus and method of analog-to-digital conversion 失效
标题翻译：模数转换的装置和方法
公开(公告)号：US20050219103A1
公开(公告)日：2005-10-06
申请号：US11090192
申请日：2005-03-28
申请人： Makoto Ogawa
发明人： Makoto Ogawa
IPC分类号： H03M1/00 , H03M1/12
CPC分类号： H03M1/1225
摘要： An analog-to-digital conversion apparatus includes a register group, a selecting section and an A/D conversion section. The register group has a plurality of registers holding a plurality of channel specification data, respectively. The selecting section is connected with a plurality of analog channels, and sequentially selects the plurality of analog channels for analog-to-digital (A/D) conversion continuously without any idling time based on the plurality of channel specification data held by the plurality of registers. The A/D conversion section carries out the A/D conversion of an analog signal on each of the analog channels selected by the selecting section into a digital signal.
摘要翻译：模数转换装置包括寄存器组，选择部分和A / D转换部分。寄存器组具有分别保持多个通道指定数据的多个寄存器。选择部分与多个模拟通道连接，并且基于由多个模拟通道保持的多个通道指定数据，连续地依次选择用于模数（A / D）转换的多个模拟通道，而没有任何空转时间注册 A / D转换部分对由选择部分选择的每个模拟信道上的模拟信号进行A / D转换为数字信号。

120. 发明授权

US06849934B2 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device 有权
标题翻译：用于印刷电路板，多层印刷电路板和半导体器件的介电膜
公开(公告)号：US06849934B2
公开(公告)日：2005-02-01
申请号：US10382356
申请日：2003-03-05
申请人： Makoto Ogawa , Akira Urakami , Kazuhiko Ohashi
发明人： Makoto Ogawa , Akira Urakami , Kazuhiko Ohashi
IPC分类号： C09J7/02 , C09J7/04 , H01L23/12 , H01L23/14 , H01L23/498 , H05K1/03 , H05K3/46 , H01L23/02
CPC分类号： H05K3/4688 , C09J7/21 , C09J7/22 , C09J7/35 , C09J2400/263 , C09J2427/006 , H01L23/49894 , H01L2224/16 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K1/034 , H05K3/4605 , H05K2201/0116 , H05K2201/015 , H05K2203/1147 , Y10T428/24917 , Y10T428/249958
摘要： A dielectric film for a printed wiring board that has excellent heat resistance, moisture resistance, insulation properties, adhesiveness, ease of handling, ease of processing, and the like, and possesses low elasticity and high elongation as stress relief functions. The dielectric film has drawn porous polytetrafluoroethylene used as the base material; this is impregnated with an adhesive or fusible resin; the post-solidification tensile modulus of elasticity is 0.1 to 1.8 GPa; and the tensile elongation at break (at 25° C.) is at least 4.0%. A semiconductor device, comprising a multilayer printed board having a plurality of circuit layers, and a semiconductor element mounted on the multilayer printed board, this semiconductor device having an insulating/adhesive layer with a stress relief function between the outermost circuit layer of the multilayer board on the side of the semiconductor element, and the circuit layer adjacent thereto; and the insulating/adhesive layer is formed from the dielectric film. Also, a printed wiring board therefor.
摘要翻译：用于印刷电路板的电介质膜具有优异的耐热性，耐湿性，绝缘性，粘合性，易于操作，易于加工等优点，并且具有低弹性和高伸长率作为应力消除功能。电介质膜采用多孔聚四氟乙烯作为基材; 这是用粘合剂或可熔树脂浸渍的; 后凝固拉伸弹性模量为0.1〜1.8GPa; 拉伸断裂伸长率（25℃）至少为4.0％。一种半导体器件，包括具有多个电路层的多层印刷电路板和安装在多层印刷电路板上的半导体元件，该半导体器件具有在多层板的最外层电路层之间具有应力消除功能的绝缘/粘合层在半导体元件的一侧和与其相邻的电路层; 并且绝缘/粘合剂层由电介质膜形成。另外，也是印刷电路板。

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