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    • 114. 发明授权
    • Image pickup device, image pickup module, and camera
    • 图像拾取装置,摄像模块和相机
    • US09111826B2
    • 2015-08-18
    • US13817755
    • 2011-08-05
    • Shin Hasegawa
    • Shin Hasegawa
    • H01L27/146H04N5/335H01L23/31
    • H01L27/14618H01L23/3128H01L2924/0002H04N5/335H01L2924/00
    • An image pickup device includes a transparent member, an image pickup element chip including a photodiode, and a fixing member arranged around the image pickup element chip, a space being surrounded by the transparent member, the image pickup element chip, and the fixing member. The image pickup element chip includes a semiconductor substrate including a penetrating electrode penetrating through a first main face of the semiconductor substrate on a side of the transparent member and a second main face of the semiconductor substrate opposite the first main face. In an orthogonal projection with respect to the transparent member, the penetrating electrode is arranged in a fixing area corresponding to the fixing member, and a boundary with an area where the thickness of the semiconductor substrate is smaller than that of the semiconductor substrate in a first area corresponding to the space is arranged within the fixing area.
    • 图像拾取装置包括透明构件,包括光电二极管的图像拾取元件芯片和布置在图像拾取元件芯片周围的固定构件,被透明构件,图像拾取元件芯片和固定构件包围的空间。 图像拾取元件芯片包括半导体衬底,该半导体衬底包括贯穿透明构件侧的半导体衬底的第一主面的穿透电极和与第一主面相对的半导体衬底的第二主面。 在相对于透明构件的正交投影中,穿透电极被布置在与固定构件相对应的固定区域中,并且与半导体衬底的厚度小于半导体衬底的厚度的区域的边界 对应于空间的区域被布置在固定区域内。