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    • 111. 发明申请
    • Shallow trench isolation (STI) based laterally diffused metal oxide semiconductor (LDMOS)
    • 基于横沟扩散金属氧化物半导体(LDMOS)的浅沟槽隔离(STI)
    • US20080246080A1
    • 2008-10-09
    • US12155628
    • 2008-06-06
    • Akira ItoHenry Kuo-Shun Chen
    • Akira ItoHenry Kuo-Shun Chen
    • H01L29/78
    • H01L29/7835H01L29/0653H01L29/086H01L29/0865H01L29/1083H01L29/456H01L29/66659
    • An apparatus is disclosed to increase a breakdown voltage of a semiconductor device. The semiconductor device includes a first heavily doped region to represent a source region. A second heavily doped region represents a drain region of the semiconductor device. A third heavily doped region represents a gate region of the semiconductor device. The semiconductor device further includes a shallow trench isolation (STI) region to increase the resistance from the drain region to the source region. The STI region includes a first side vertically aligned with a second side of the gate region. The STI region extends from the first side to a second side in contact with a second side of the drain region. The breakdown voltage of the n-type semiconductor device is directly proportional to a vertical length, or a depth, of the first side and/or the second side of the STI region. The horizontal length, or distance from the first side to the second side, of the STI region does not substantially contribute to the breakdown voltage of the semiconductor device. As a result, a conventional CMOS logic foundry technology may fabricate the STI region of the semiconductor device using a low operating voltage process minimum design rule.
    • 公开了一种用于增加半导体器件的击穿电压的装置。 半导体器件包括表示源极区的第一重掺杂区域。 第二重掺杂区域表示半导体器件的漏极区域。 第三重掺杂区域表示半导体器件的栅极区域。 半导体器件还包括浅沟槽隔离(STI)区域,以增加从漏区到源极区的电阻。 STI区域包括与栅极区域的第二侧垂直对准的第一侧面。 STI区从第一侧延伸到与漏区的第二侧接触的第二侧。 n型半导体器件的击穿电压与STI区域的第一侧和/或第二面的垂直长度或深度成正比。 STI区域的水平长度或从第一侧到第二侧的距离基本上不会有助于半导体器件的击穿电压。 结果,传统的CMOS逻辑铸造技术可以使用低工作电压工艺最小设计规则来制造半导体器件的STI区域。
    • 113. 发明申请
    • Interference power estimating device and interference power estimating method
    • 干扰功率估计装置和干扰功率估计方法
    • US20080130804A1
    • 2008-06-05
    • US11984258
    • 2007-11-15
    • Akira Ito
    • Akira Ito
    • H04B1/10
    • H04B17/26H04B17/345H04L1/0003H04L5/0048H04L25/067H04L27/0008
    • The present invention relates to an interference power estimating device that estimates interference power with high accuracy. The interference power estimating device includes a reference symbol acquiring unit acquiring a reference symbol corresponding to each of the pilot symbols included in a received signal by symbol-averaging a reference signal including the pilot symbol being allocated in positions near in terms of time to each of the pilot symbols and having the number less than the number of the pilot symbols within one slot, and an estimating unit estimating interference power of the received signal by power-valuing each difference between each of the pilot symbols and the reference symbol corresponding to each of the pilot symbols acquired by the reference symbol acquiring unit.
    • 本发明涉及以高精度估计干扰功率的干扰功率估计装置。 干扰功率估计装置包括:参考符号获取单元,通过对包括导频符号的参考信号进行符号平均,获取与包含在接收信号中的每个导频符号相对应的参考符号,所述参考信号被分配在每个 所述导频符号并且具有小于一个时隙内的导频符号的数量的数量,以及估计单元,通过对每个导频符号和对应于每个导频符号的参考符号之间的每个差异进行功率估值来估计接收信号的干扰功率 由参考符号获取单元获取的导频符号。
    • 114. 发明申请
    • Tape Printer and Tape Cassette
    • 磁带打印机和磁带盒
    • US20080038034A1
    • 2008-02-14
    • US11663686
    • 2005-09-26
    • Koshiro YamaguchiAkira ItoYoshio KuniedaTakahiro Miwa
    • Koshiro YamaguchiAkira ItoYoshio KuniedaTakahiro Miwa
    • B41J11/44
    • B41J15/044B41J3/4075
    • The CPU 81 of the tape printer 1, when the tape printer 1 is turned on, reads the “model name” and the power supply type of “drive power supply” corresponding to each “model name” of the parameter table 131 from the wireless tag circuit element 25 provided in the tape cassette 21 via the R/W module 93, and next, displays on the LCD 7 a request for selecting the model name and the drive power supply of the tape printer and wait for a selection of the model name and the drive power supply. Then, the CPU 81 reads the print control parameters corresponding to the selected model name and the drive power supply from the wireless tag circuit element 25 via the R/W module 93. If the print control parameter read from the wireless tag circuit element 25 is not stored in the ROM 83 or the EEPROM 84, the CPU 81 stores the print control parameter and executes print control based on the print control parameter (S1 to S9).
    • 带式打印机1的CPU81在带式打印机1打开的同时从无线装置读取与参数表131的各“型号名称”对应的“型号名称”和“驱动电源”的电源类型 标签电路元件25,经由R / W模块93设置在带盒21中,接下来,在LCD7上显示选择型号名称和带式打印机的驱动电源的请求,并等待该模型的选择 名称和驱动电源。 然后,CPU 81经由R / W模块93从无线标签电路元件25读取与所选型号名称对应的打印控制参数和驱动电源。 如果从无线标签电路元件25读取的打印控制参数未被存储在ROM 83或EEPROM 84中,则CPU 81存储打印控制参数,并根据打印控制参数执行打印控制(S 1至S 9) 。
    • 117. 发明授权
    • System and method for programming a memory cell
    • 用于编程存储器单元的系统和方法
    • US07211843B2
    • 2007-05-01
    • US10355260
    • 2003-01-31
    • Khim L. LowTodd L. BrooksAgnes WooAkira Ito
    • Khim L. LowTodd L. BrooksAgnes WooAkira Ito
    • H01L27/10
    • H01L23/5256H01L2924/0002H01L2924/00
    • The present invention relates to systems and methods for programming a memory cell. More specifically, the present invention relates to a controlled application of current to a memory cell over a controlled time period. The invention utilizes a current mirror configuration having a first transistor and a second transistor, wherein the second transistor is coupled to the memory cell. Programming of the memory cell includes applying a voltage to the first transistor, whereby a first current is generated in the first transistor. A gate of the second transistor is coupled to the first transistor, whereby a second current is generated in the second transistor. The second current is proportional to the first current. The second current is provided to the memory cell, whereby the second current programs the memory cell.
    • 本发明涉及用于编程存储器单元的系统和方法。 更具体地说,本发明涉及在受控时间段内对存储器单元的电流的受控应用。 本发明利用具有第一晶体管和第二晶体管的电流镜配置,其中第二晶体管耦合到存储单元。 存储单元的编程包括向第一晶体管施加电压,由此在第一晶体管中产生第一电流。 第二晶体管的栅极耦合到第一晶体管,由此在第二晶体管中产生第二电流。 第二电流与第一电流成比例。 第二电流被提供给存储器单元,由此第二电流对存储单元进行编程。