专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

111. 发明授权

US07660121B2 System of facilitating cooling of electronics racks of a data center employing multiple cooling stations 有权
标题翻译：使用多个冷却站的数据中心的电子机架的冷却系统
公开(公告)号：US07660121B2
公开(公告)日：2010-02-09
申请号：US12274459
申请日：2008-11-20
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.
摘要翻译：提供冷却系统和方法来冷却离开数据中心的一个或多个电子机架的空气。冷却系统包括与数据中心的至少一个相应的电子机架分离和独立的至少一个冷却站，并且被配置为用于设置与其相邻的电子机柜的空气出口侧，用于冷却从电子机架排出空气。冷却站包括从相应的电子机架分离和独立的框架结构，以及由框架结构支撑的空气对液体热交换组件。热交换组件包括入口和出口，其构造成分别耦合到冷却剂供应源和冷却剂返回管线，以便于冷却剂通过其中。空气 - 液体热交换组件的尺寸设定为在排出到数据中心之前冷却从相应的电子机架的空气出口侧排出的空气。

112. 发明授权

US07642914B2 Auto-locating system and method for data center mapping and monitoring 失效
标题翻译：用于数据中心映射和监控的自动定位系统和方法
公开(公告)号：US07642914B2
公开(公告)日：2010-01-05
申请号：US11855185
申请日：2007-09-14
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： G08B13/14
CPC分类号： G01S13/876
摘要： Automated locating of electronics racks within a data center room is provided. The automated approach employs n wireless identification units associated with respective electronics racks of the data center, and first and second transceiver units positioned within the data center along a common plane at known X,Y locations. A monitor unit is in communication with the transceiver units, and automatically determines X,Y location within the data center room of each respective electronics rack employing, in part, first time differentials between transmission of a first broadcast signal by the first transceiver unit and receipt of response signals from the wireless identification units, second time differentials between transmission of a second broadcast signal from the second transceiver unit and receipt of response signals thereto from the wireless identification units, and the known X,Y locations within the data center of the transceiver units.
摘要翻译：提供数据中心室内电子机架的自动定位。自动化方法采用与数据中心的相应电子机架相关联的n个无线识别单元，以及沿着已知X，Y位置处的公共平面定位在数据中心内的第一和第二收发器单元。监视器单元与收发器单元通信，并且自动地确定每个相应电子机架的数据中心室内的X，Y位置，其部分地采用第一收发器单元发送第一广播信号和接收之间的第一时差来自无线识别单元的响应信号，来自第二收发器单元的第二广播信号的传输和从无线识别单元接收的响应信号之间的第二时间差以及收发器的数据中心内的已知X，Y位置单位。

113. 发明授权

US07639499B1 Liquid cooling apparatus and method for facilitating cooling of an electronics system 失效
标题翻译：用于促进电子系统冷却的液体冷却装置和方法
公开(公告)号：US07639499B1
公开(公告)日：2009-12-29
申请号：US12168259
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.
摘要翻译：提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管，以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。

114. 发明授权

US07511957B2 Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled 失效
标题翻译：用于制造冷却的电子模块的方法，该冷却电子模块采用密封到待冷却表面的周边的导热返回歧管结构
公开(公告)号：US07511957B2
公开(公告)日：2009-03-31
申请号：US11420241
申请日：2006-05-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28C3/08 , F28F7/00 , H01L23/4735 , H01L2224/73253 , Y10S165/908
摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.
摘要翻译：使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面其中基面被密封到待冷却的表面。

115. 发明授权

US07486514B2 Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled 失效
标题翻译：冷却装置具有设置在模块外壳和要冷却的电子部件之间的分立冷板
公开(公告)号：US07486514B2
公开(公告)日：2009-02-03
申请号：US12054944
申请日：2008-03-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

116. 发明授权

US07477514B2 Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations 失效
标题翻译：促进采用多个冷却站的数据中心电子机架冷却的方法
公开(公告)号：US07477514B2
公开(公告)日：2009-01-13
申请号：US11744269
申请日：2007-05-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： A cooling method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.
摘要翻译：提供冷却方法来冷却离开数据中心的一个或多个电子机架的空气。冷却系统包括与数据中心的至少一个相应的电子机架分离和独立的至少一个冷却站，并且被配置为用于设置与其相邻的电子机柜的空气出口侧，用于冷却从电子机架排出空气。冷却站包括从相应的电子机架分离和独立的框架结构，以及由框架结构支撑的空气对液体热交换组件。热交换组件包括入口和出口，其构造成分别耦合到冷却剂供应源和冷却剂返回管线，以便于冷却剂通过其中。空气 - 液体热交换组件的尺寸设定为在排出到数据中心之前冷却从相应的电子机架的空气出口侧排出的空气。

117. 发明授权

US07459112B2 Method of fabrication for a thermal spreader using thermal conduits 失效
标题翻译：使用热导管的散热器的制造方法
公开(公告)号：US07459112B2
公开(公告)日：2008-12-02
申请号：US10953991
申请日：2004-09-29
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： B29C39/10
CPC分类号： H01L23/373 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/15312 , Y10T29/4935 , Y10T29/49368 , Y10T428/30 , Y10T442/2738
摘要： A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.
摘要翻译：在电子电路和散热器之间一次使用的散热装置包括具有平行的第一和第二表面的基板以及在表面之间延伸通过基板的导管。衬底材料在平行于面的方向上具有第一热导率值，并且在垂直于面的方向上具有第二热导率值，第二热导率值小于第一热导率值。导管材料具有与其相关联的热导率值，其热导率值大于衬底的第二热导率值。一种制造热扩散装置的方法包括：围绕棒径向地设置模制材料并硬化材料。其他方法包括压配合并将棒收缩配合到基底材料中。

118. 发明申请

US20080273307A1 LIQUID-BASED COOLING SYSTEM FOR COOLING A MULTI-COMPONENT ELECTRONICS SYSTEM 有权
标题翻译：用于冷却多组分电子系统的基于液体的冷却系统
公开(公告)号：US20080273307A1
公开(公告)日：2008-11-06
申请号：US12168267
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂输送管分配到冷板以除去由各自的电子元件。

119. 发明申请

US20080259567A1 CONDUCTIVE HEAT TRANSPORT COOLING SYSTEM AND METHOD FOR A MULTI-COMPONENT ELECTRONICS SYSTEM 失效
公开(公告)号：US20080259567A1
公开(公告)日：2008-10-23
申请号：US12144859
申请日：2008-06-24
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H05K7/20009 , H05K7/20772 , H01L2224/0401
摘要： A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

120. 发明授权

US07400504B2 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled 有权
标题翻译：冷却装置和方法采用分散的冷板，其顺应地耦合在待冷却的组件的公共歧管和电子部件之间
公开(公告)号：US07400504B2
公开(公告)日：2008-07-15
申请号：US11870667
申请日：2007-10-11
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/2079
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保良好的热界面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式