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    • 112. 发明申请
    • Image sensor and pixel including a deep photodetector
    • 图像传感器和像素包括深度光电探测器
    • US20090200580A1
    • 2009-08-13
    • US12028679
    • 2008-02-08
    • Howard E. RhodesHidetoshi NozakiSohei Manabe
    • Howard E. RhodesHidetoshi NozakiSohei Manabe
    • H01L27/148H01L31/18
    • H01L27/14609H01L27/14603H01L27/1464H01L27/14689
    • What is disclosed is an apparatus comprising a transfer gate formed on a substrate and a photodiode formed in the substrate next to the transfer gate. The photodiode comprises a shallow N-type collector formed in the substrate, a deep N-type collector formed in the substrate, wherein a lateral side of the deep N-type collector extends at least under the transfer gate, and a connecting N-type collector formed in the substrate between the deep N-type collector and the shallow N-type collector, wherein the connecting implant connects the deep N-type collector and the shallow N-type collector. Also disclosed is a process comprising forming a deep N-type collector in the substrate, forming a shallow N-type collector formed in the substrate, and forming a connecting N-type collector in the substrate between the deep N-type collector and the shallow N-type collector, wherein the connecting implant connects the deep N-type collector and the shallow N-type collector. A transfer gate is formed on the substrate next to the deep photodiode, wherein a lateral side of the deep N-type collector extends at least under the transfer gate. Other embodiments are disclosed and claimed.
    • 所公开的是一种装置,其包括形成在基板上的转移栅极和形成在基板旁边的光电二极管。 光电二极管包括形成在基板中的浅N型集电体,形成在基板中的深N型集电体,其中深N型集电极的侧面至少在传输栅极下延伸,并且连接N型 在深N型集电体和浅N型集电体之间的基板中形成的集电体,其中连接注入物连接深N型集电极和浅N型集电极。 还公开了一种方法,包括在衬底中形成深N型集电体,形成在衬底中形成的浅N型集电体,并且在深N型集电极和浅层之间的衬底中形成连接的N型集电体 N型集电器,其中连接注入件连接深N型集电器和浅N型集电器。 在靠近深度光电二极管的衬底上形成传输栅极,其中深N型集电极的侧面至少在传输栅极下方延伸。 公开和要求保护其他实施例。
    • 115. 发明申请
    • SINGLE POLY CMOS IMAGER
    • 单色CMOS图像
    • US20120001242A1
    • 2012-01-05
    • US13212649
    • 2011-08-18
    • Howard E. Rhodes
    • Howard E. Rhodes
    • H01L31/02
    • H01L27/14643H01L27/14689
    • More complete charge transfer is achieved in a CMOS or CCD imager by reducing the spacing in the gaps between gates in each pixel cell, and/or by providing a lightly doped region between adjacent gates in each pixel cell, and particularly at least between the charge collecting gate and the gate downstream to the charge collecting gate. To reduce the gaps between gates, an insulator cap with spacers on its sidewalls is formed for each gate over a conductive layer. The gates are then etched from the conductive layer using the insulator caps and spacers as hard masks, enabling the gates to be formed significantly closer together than previously possible, which, in turn increases charge transfer efficiency. By providing a lightly doped region on between adjacent gates, a more complete charge transfer is effected from the charge collecting gate.
    • 通过减小每个像素单元中的栅极之间的间隙和/或通过在每个像素单元中的相邻栅极之间提供轻掺杂区域,特别是至少在电荷之间,在CMOS或CCD成像器中实现更完整的电荷转移 收集门和下游的门到电荷收集门。 为了减小栅极之间的间隙,在导电层上为每个栅极形成在其侧壁上具有间隔物的绝缘体盖。 然后使用绝缘体盖和间隔物作为硬掩模,从导电层蚀刻栅极,使得栅极能够形成得比先前可能的显着更靠近在一起,这又增加了电荷转移效率。 通过在相邻栅极之间提供轻掺杂区域,从电荷收集栅极实现更完整的电荷转移。
    • 117. 发明授权
    • Buried conductor for imagers
    • 埋地导体成像仪
    • US08018015B2
    • 2011-09-13
    • US11168760
    • 2005-06-29
    • Howard E. Rhodes
    • Howard E. Rhodes
    • H01L27/146H01L31/062H01L31/113H01L31/00
    • H01L27/14683H01L27/14609H01L27/14636H01L27/14643
    • A pixel cell having a photo-conversion device at a surface of a substrate and at least one contact area from which charge or a signal is output or received. A first insulating layer is located over the photo-conversion device and the at least one contact area. The pixel cell further includes at least one conductor in contact with the at least one contact area. The conductor includes a polysilicon material extending through the first insulating layer and in contact with the at least one contact area. Further, a conductive material, which includes at least one of a silicide and a refractory metal, can be over and in contact with the polysilicon material.
    • 具有在基板的表面处的光转换装置的像素单元和输出或接收电荷或信号的至少一个接触区域。 第一绝缘层位于光转换器件和至少一个接触区域之上。 像素单元还包括与至少一个接触区域接触的至少一个导体。 导体包括延伸穿过第一绝缘层并与至少一个接触区域接触的多晶硅材料。 此外,包括硅化物和难熔金属中的至少一种的导电材料可以与多晶硅材料结合并接触。