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111. 发明申请

US20100266276A1 BROADBAND AND WAVELENGTH-SELECTIVE BIDIRECTIONAL 3-WAY OPTICAL SPLITTER 有权
标题翻译：宽带和波长选择性双向3路光学分路器
公开(公告)号：US20100266276A1
公开(公告)日：2010-10-21
申请号：US11962426
申请日：2007-12-21
申请人： Xuehze Zheng , Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Xuehze Zheng , Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H04J14/00
CPC分类号： G02B6/2804 , G02B6/29343 , G02B6/29352 , G02B6/43 , G02B2006/1215 , H04J14/0212 , H04Q2213/1301 , H04Q2213/13322
摘要： Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes.
摘要翻译：描述双向3路光分路器的实施例。这种双向3路光分路器包括具有：第一外部节点，第二外部节点，第三外部节点和第四外部节点的光分路器。在一种操作模式中，光分路器可以被配置为在第一外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。此外，在另一种操作模式中，光分路器可以被配置为在第三外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。

112. 发明授权

US07817880B1 Multi-chip systems using on-chip photonics 有权
标题翻译：使用片上光子学的多芯片系统
公开(公告)号：US07817880B1
公开(公告)日：2010-10-19
申请号：US11728845
申请日：2007-03-26
申请人： Robert J. Drost , Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Robert J. Drost , Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/10 , G02B6/12
CPC分类号： G02B6/43 , G02B6/35 , H04B10/803
摘要： Embodiments of a system are described. This system includes an array of single-chip modules (CMs), which includes a first CM and a second CM which are coupled to each other. A given CM, which can be either the first CM or the second CM, includes a semiconductor die that is configured to communicate data signals with other CMs by capacitively coupled proximity communication and optical proximity communication using proximity connectors. These proximity connectors are proximate to a surface of the semiconductor die, and the semiconductor die includes an optical signal path configured to communicate on-chip optical signals.
摘要翻译：描述系统的实施例。该系统包括单芯片模块（CM）的阵列，其包括彼此耦合的第一CM和第二CM。可以是第一CM或第二CM的给定CM包括被配置为通过电容耦合的邻近通信和使用接近连接器的光学邻近通信与其他CM通信数据信号的半导体管芯。这些接近连接器靠近半导体管芯的表面，并且半导体管芯包括被配置为传送片上光信号的光信号通路。

113. 发明申请

US20100213606A1 DIELECTRIC ENHANCEMENTS TO CHIP-TO-CHIP CAPACITIVE PROXIMITY COMMUNICATION 有权
标题翻译：芯片到芯片电容式接近通信的电介质增强
公开(公告)号：US20100213606A1
公开(公告)日：2010-08-26
申请号：US12391912
申请日：2009-02-24
申请人： Ashok Krishnamoorthy , John E. Cunningham
发明人： Ashok Krishnamoorthy , John E. Cunningham
IPC分类号： H01L23/29 , H01L21/02
CPC分类号： H01L23/66 , H01L25/0657 , H01L2225/06527 , H01L2924/0002 , H01L2924/00
摘要： A method for improving signal levels between capacitively-coupled chips in proximity communication (PxC) includes depositing a high permittivity dielectric material layer over a signal pad of a first chip, and placing a second chip in close proximity to the first chip such that faces of the signal pads align to enable for capacitive signal coupling. The high permittivity dielectric material layer that fills at least a portion of a gap between the first chip and the second chip, and improves capacitive coupling between signal pads of the first chip and the second chip by providing for an increased permittivity in the gap between the first chip and the second chip. The increased permittivity ensures that electric fields are substantially confined to a space between the signal pad of the first chip and the signal pad of the second chip.
摘要翻译：一种用于改善接近通信（PxC）中的电容耦合芯片之间的信号电平的方法包括在第一芯片的信号焊盘上沉积高介电常数介电材料层，并将第二芯片放置在第一芯片附近，信号焊盘对准以实现电容信号耦合。高介电常数介电材料层，其填充第一芯片和第二芯片之间的间隙的至少一部分，并且通过在第一芯片和第二芯片之间的间隙中提供增加的介电常数来改善第一芯片和第二芯片的信号焊盘之间的电容耦合第一芯片和第二芯片。增加的介电常数确保电场基本上限制在第一芯片的信号焊盘和第二芯片的信号焊盘之间的空间。

114. 发明授权

US07592707B2 Method and apparatus for facilitating proximity communication and power delivery 有权
标题翻译：用于促进邻近通信和电力传递的方法和装置
公开(公告)号：US07592707B2
公开(公告)日：2009-09-22
申请号：US11385445
申请日：2006-03-20
申请人： Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/48 , G02B6/12007 , G02B6/29341 , G02B6/43 , H01L24/10 , H01L24/13 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/05556 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/10135 , H01L2224/10165 , H01L2224/13 , H01L2224/13099 , H01L2224/1319 , H01L2224/2919 , H01L2224/81138 , H01L2224/81141 , H01L2224/81801 , H01L2224/83141 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/10157 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells configured to align with the etch pit wells of the first integrated circuit chip. A shaped structure is placed in an etch pit well of the first integrated circuit chip such that when the corresponding etch pit well of the second integrated circuit chip is substantially aligned with the etch pit well of the first integrated circuit chip, the shaped structure mates with both the etch pit well of the first integrated circuit chip and with the corresponding etch pit well of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip. Besides aiding in alignment, the shaped structure also creates a conductive connection between the first integrated circuit chip and the second integrated circuit chip.
摘要翻译：本发明的一个实施例提供了一种便于精确的芯片间对准以进行邻近通信和功率输送的系统。该系统包括第一集成电路芯片，其表面具有蚀刻凹坑。该系统还包括第二集成电路芯片，其表面具有配置为与第一集成电路芯片的蚀刻凹坑对准的相应蚀刻凹坑。成形结构放置在第一集成电路芯片的蚀刻凹坑中，使得当第二集成电路芯片的相应蚀刻凹坑与第一集成电路芯片的蚀刻凹坑基本对准时，成形结构与第一集成电路芯片的蚀刻凹坑以及第二集成电路芯片的相应蚀刻凹坑两者，从而将第一集成电路芯片与第二集成电路芯片精确对准。除了辅助对准之外，成形结构还在第一集成电路芯片和第二集成电路芯片之间形成导电连接。

115. 发明授权

US07574077B2 Optical imaging device for optical proximity communication 有权
标题翻译：用于光学邻近通信的光学成像设备
公开(公告)号：US07574077B2
公开(公告)日：2009-08-11
申请号：US11515207
申请日：2006-08-31
申请人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/42
CPC分类号： G02B6/12007 , G02B6/29341 , G02B6/43 , H01L23/48 , H01L24/10 , H01L24/13 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/0106 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10157 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： An assembly comprising first and second electronic devices and an optical coupling device that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. The first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device. Further, the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide. Thus, the optical coupling device optically couples the first optical waveguide to the second optical waveguide.
摘要翻译：一种组件，包括第一和第二电子设备以及将第一电子设备上的光波导光耦合到第二电子设备上的光波导的光耦合设备。以这种方式，设备之间的光学邻近通信是可能的。电子设备可以是集成电路芯片。第一光波导相对于光耦合装置定位，以将光信号引导到光耦合装置。此外，第二光波导相对于光耦合装置定位，以接收从光耦合装置指向第二光波导的光信号。因此，光耦合装置将第一光波导光学耦合到第二光波导。

116. 发明授权

US07486853B2 Resonator system for optical proximity communication 有权
标题翻译：用于光学邻近通信的谐振器系统
公开(公告)号：US07486853B2
公开(公告)日：2009-02-03
申请号：US11515085
申请日：2006-08-31
申请人： John E. Cunningham , Ashok V. Krishnamoorthy
发明人： John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02B6/42
CPC分类号： G02B6/12007 , G02B6/29341 , G02B6/43 , H01L23/48 , H01L24/10 , H01L24/13 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/0106 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/0665 , H01L2924/10157 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： An assembly comprising first and second electronic devices and an optical resonator that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. A first portion of an optical resonator is disposed in a pit of the first device to optically couple the optical resonator to the first optical waveguide. A second portion of the optical resonator is disposed in a pit of the second device to optically couple the optical resonator to the second optical waveguide. Thus, the optical resonator optically couples the first optical waveguide to the second optical waveguide.
摘要翻译：一种包括第一和第二电子器件的组件和将第一电子器件上的光波导光耦合到第二电子器件上的光波导的光学谐振器。以这种方式，设备之间的光学邻近通信是可能的。电子设备可以是集成电路芯片。光谐振器的第一部分设置在第一器件的凹坑中，以将光谐振器光学耦合到第一光波导。光谐振器的第二部分设置在第二器件的凹坑中以将光谐振器光学耦合到第二光波导。因此，光学谐振器将第一光波导光学耦合到第二光波导。

117. 发明申请

US20090010590A1 METHOD AND APPARATUS FOR COUPLING OPTICAL SIGNALS ONTO A SEMICONDUCTOR CHIP 有权
标题翻译：用于将光信号耦合到半导体芯片的方法和装置
公开(公告)号：US20090010590A1
公开(公告)日：2009-01-08
申请号：US11773520
申请日：2007-07-05
申请人： Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/12
CPC分类号： G02B6/1228 , G02B6/12007 , G02B6/305 , G02B2006/12107
摘要： A first optical coupler is configured to direct optical signals from an optical fiber onto one or more first optical channels located on a semiconductor chip, wherein the one or more first optical channels have dimensions that are within a specified tolerance of the dimensions of the optical fiber. One or more second optical couplers are configured to direct the optical signals from the one or more first optical channels to one or more second optical channels located on the semiconductor chip, wherein the one or more second optical channels have a specified sub-micron size.
摘要翻译：第一光耦合器被配置为将光信号从光纤引导到位于半导体芯片上的一个或多个第一光通道上，其中所述一个或多个第一光通道具有在光纤尺寸的规定公差内的尺寸。一个或多个第二光耦合器被配置为将光信号从一个或多个第一光通道引导到位于半导体芯片上的一个或多个第二光通道，其中一个或多个第二光通道具有指定的亚微米尺寸。

118. 发明申请

US20080031294A1 Structures and methods for adjusting the wavelengths of lasers via temperature control 有权
标题翻译：通过温度控制调节激光波长的结构和方法
公开(公告)号：US20080031294A1
公开(公告)日：2008-02-07
申请号：US11485594
申请日：2006-07-12
申请人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
发明人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
IPC分类号： H01S3/04 , H01S5/00 , G02B6/12
CPC分类号： H01S5/423 , H01S5/005 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0422 , H01S5/0612 , H01S5/18305 , H01S5/18327 , H01S5/4087
摘要： One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.
摘要翻译：本发明的一个实施例提供一种通过温度控制有助于调节激光器的波长的系统。该系统包括具有有源电路和信号焊盘所在的有源面的芯片。热控制机构提供安装在芯片的主动面上的两个激光器的局部热控制。通过单独控制激光器的温度，热控制机构控制由各个激光器发射的波长。通过产生导致两个或更多个激光器之间的温度差的温度梯度，该系统可以使激光器发射不同的波长。

119. 发明授权

US06434180B1 Vertical cavity surface emitting laser (VCSEL) 有权
标题翻译：垂直腔表面发射激光器（VCSEL）
公开(公告)号：US06434180B1
公开(公告)日：2002-08-13
申请号：US09740446
申请日：2000-12-19
申请人： John E Cunningham
发明人： John E Cunningham
IPC分类号： H01S5183
CPC分类号： H01S5/041 , B82Y20/00 , H01S5/0208 , H01S5/18311 , H01S5/18369 , H01S5/34306 , H01S5/426 , H01S2302/00
摘要： A vertical cavity surface emitting laser emitting at about 1.3 microns while being optically pumped by a vertical cavity surface emitting laser emitting at about 810 nanometers characterized in that the resonant cavities of the two lasers are coupled to increase the effectiveness of the pumping light to stimulate emission from the gain medium of the long-wavelength medium. The two lasers are formed in a multilayer stack of which all the layers are epitaxial except for the layers at the top of the stack that serve as a broad band output mirror and the upper bounding of the long wavelength laser.
摘要翻译：垂直腔表面发射激光器，其发射约1.3微米，同时由发射约810纳米的激光的垂直空腔表面光泵浦，其特征在于耦合两个激光器的谐振腔以增加泵浦光的有效性以刺激发射从长波长介质的增益介质。两个激光器形成为多层堆叠，其中所有层都是外延的，除了用作宽带输出反射镜的顶部的层和长波长激光器的上限之外。

120. 发明授权

US5784187A Wafer level integration of an optical modulator and III-V photodetector 失效
标题翻译：光调制器和III-V光电探测器的晶片级集成
公开(公告)号：US5784187A
公开(公告)日：1998-07-21
申请号：US685174
申请日：1996-07-23
申请人： John E. Cunningham , Joseph E. Ford , Keith Wayne Goossen , James A. Walker
发明人： John E. Cunningham , Joseph E. Ford , Keith Wayne Goossen , James A. Walker
IPC分类号： H01L21/8247 , G02B26/00 , H01L27/115 , H01L27/144 , H01L29/788 , H01L29/792 , G02F1/03
CPC分类号： H01L27/1443 , G02B26/00
摘要： A device having an optical modulation region and a photodetection region formed on a single wafer, and methods for making the device, are disclosed. In one configuration, the device consists of an off-axis nonpolar substrate that has, on one side, a region suitable for modulating an optical signal. The other side of the substrate has a region suitable for photodetection. The region suitable for modulating an optical signal includes a movable layer suspended over the substrate. As the movable layer moves under an applied voltage, the reflectivity of the modulation region changes. The photodetection region consists of a plurality of III-V layers. In a second configuration, the device consists of a III-V substrate that has a region for photodetection disposed on one surface. A region for optical modulation is disposed on the photodetection region.
摘要翻译：公开了具有形成在单个晶片上的光学调制区域和光电检测区域的装置及其制造方法。在一种配置中，该器件由离轴非极性衬底组成，该衬底在一侧具有适于调制光信号的区域。衬底的另一侧具有适于光电检测的区域。适于调制光信号的区域包括悬浮在衬底上的可移动层。随着移动层在施加的电压下移动，调制区域的反射率发生变化。光检测区域由多个III-V层组成。在第二种配置中，器件由具有设置在一个表面上的用于光电检测的区域的III-V衬底组成。用于光学调制的区域设置在光电检测区域上。

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