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    • 114. 发明授权
    • Drain select gate voltage management
    • 漏极选择栅极电压管理
    • US08767487B2
    • 2014-07-01
    • US12715530
    • 2010-03-02
    • Akira GodaPranav KalavadeDoyle Rivers
    • Akira GodaPranav KalavadeDoyle Rivers
    • G11C7/00
    • G11C16/12G11C16/04G11C16/0433
    • Some embodiments include apparatus, systems, and methods that operate to apply a first value of a drain select gate voltage during a first portion of a programming time period associated with programming a plurality of memory cells, and to apply a second value of the drain select gate voltage different from the first value during a second, subsequent portion of the programming time period. The drain select gate voltage may be changed between groups of programming pulses in a single programming cycle. The first and second portions may be determined according to the number of applied programming pulses, the number of memory cells that have been completely programmed, and/or other conditions. Additional apparatus, systems, and methods are disclosed.
    • 一些实施例包括在与编程多个存储器单元相关联的编程时间周期的第一部分期间操作以施加漏极选择栅极电压的第一值的装置,系统和方法,以及施加漏极选择的第二值 在第二编程时间段的后续部分中,栅极电压与第一值不同。 漏极选择栅极电压可以在单个编程周期中的编程脉冲组之间改变。 第一和第二部分可以根据应用的编程脉冲的数量,已经完全编程的存储器单元的数量和/或其他条件来确定。 公开了附加装置,系统和方法。
    • 119. 发明申请
    • APPARATUSES AND METHODS OF FORMING APPARATUSES USING A PARTIAL DECK-BY-DECK PROCESS FLOW
    • 使用部分DECK-BY-DECK工艺流程形成装置的装置和方法
    • US20130277731A1
    • 2013-10-24
    • US13450299
    • 2012-04-18
    • Akira GodaRoger W. Lindsay
    • Akira GodaRoger W. Lindsay
    • H01L27/088H01L21/8239H01L27/08H01L21/822
    • G11C16/0408H01L27/11556H01L27/11582
    • Various embodiments include methods and apparatuses, such as memory cells formed on two or more stacked decks. A method includes forming a first deck with first levels of conductor material and first levels of dielectric material over a substrate. Each level of the conductor material is separated from an adjacent level of conductor material by at least one of the first levels of dielectric material. A first opening is formed through the first levels of conductor material and dielectric material. A sacrificial material is formed at least partially filling the first opening. A second deck is formed over the first deck. The second deck has second levels of conductor material and second levels of dielectric material with each level of the conductor material being separated from an adjacent level of conductor material by at least one of the second levels of dielectric material. Additional apparatuses and methods are disclosed.
    • 各种实施例包括诸如形成在两个或更多个堆叠甲板上的存储单元的方法和装置。 一种方法包括在衬底上形成具有第一级导体材料和第一级电介质材料的第一层板。 导体材料的每个级别通过第一级介电材料中的至少一个与相邻级别的导体材料分开。 通过导体材料和电介质材料的第一层形成第一开口。 形成至少部分地填充第一开口的牺牲材料。 在第一层甲板上形成第二层甲板。 第二层具有第二层导体材料和第二层介质材料,其中导电材料的每一层通过至少一个第二层介质材料与相邻层的导体材料分开。 公开了附加的装置和方法。