专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

101. 发明申请

US20200262029A1 GRINDING APPARATUS 审中-公开
公开(公告)号：US20200262029A1
公开(公告)日：2020-08-20
申请号：US16791366
申请日：2020-02-14
申请人： DISCO CORPORATION
发明人： Shungo YOSHII , Souichi MATSUBARA , Nobuyuki FUKUSHI , Hidekazu NAKAYAMA
IPC分类号： B24B55/06 , B24B7/04 , H01L21/304 , H01L21/683 , B24B7/22 , B24B41/00 , B24B41/06
摘要： A grinding apparatus includes a loading unit for loading a wafer to a chuck table having a holding surface for holding the wafer, an unloading unit for unloading the wafer from the chuck table, and a cleaning unit for cleaning the holding surface of the chuck table or the upper surface of the wafer held on the holding surface of the chuck table. The cleaning unit includes a cleaning portion and a horizontal moving portion for horizontally moving the cleaning portion in a lateral direction of the grinding apparatus. The loading unit has a first holding portion for holding the wafer, and the unloading unit has a second holding portion for holding the wafer.

102. 发明授权

US10421172B2 Processing device 有权
公开(公告)号：US10421172B2
公开(公告)日：2019-09-24
申请号：US15777833
申请日：2016-11-28
申请人： TOKYO SEIMITSU CO., LTD
发明人： Makoto Shimoda , Masaki Kanazawa
IPC分类号： B24B37/04 , B24B7/04 , B24B7/22 , B24B41/02 , B24B41/047 , B24B27/00 , B24B37/30 , B24B47/14 , H01L21/67 , H01L21/02
摘要： [Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

103. 发明申请

US20180301367A1 ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS 审中-公开
公开(公告)号：US20180301367A1
公开(公告)日：2018-10-18
申请号：US15950989
申请日：2018-04-11
申请人： EBARA CORPORATION
发明人： Satoru YAMAKI , Makoto FUKUSHIMA , Keisuke NAMIKI , Osamu NABEYA , Shingo TOGASHI , Tomoko OWADA , Yoshikazu KATO
IPC分类号： H01L21/687 , B24B7/04
摘要： An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

104. 发明授权

US10046430B2 End face grinding method and end face grinding device 有权
公开(公告)号：US10046430B2
公开(公告)日：2018-08-14
申请号：US14989103
申请日：2016-01-06
申请人： NGK INSULATORS, LTD.
发明人： Toshihiro Fukui , Nobuyuki Umetsu , Nobuchika Noguchi
IPC分类号： B24B5/01 , B24B55/06 , B24B7/04 , B24B7/16 , B24B5/04
摘要： The end face grinding method includes a structure rotating step of rotating a honeycomb structure based on a rotation axis in a direction orthogonal to the end face of the honeycomb structure, a grinding wheel reverse rotating step of using a grinding wheel disposed so that a grinding surface faces the end face and rotating the grinding wheel in a reverse rotating direction to a rotating direction of the honeycomb structure based on a rotation axis in the direction orthogonal to the end face; and a dry type grinding step of bringing the grinding wheel rotating in the reverse direction close to the rotating honeycomb structure to perform the dry type grinding of the end face.

105. 发明授权

US09879536B2 Surface treatment of turbomachinery 有权
公开(公告)号：US09879536B2
公开(公告)日：2018-01-30
申请号：US14977365
申请日：2015-12-21
申请人： General Electric Company
发明人： Andrew Joseph Colletti , Bruce John Badding , Bryan Edward Williams
IPC分类号： B23C3/00 , F01D5/02 , B23P15/00 , B24B19/26 , B23D45/00 , B27C1/00 , B24B27/00 , B24B39/06 , B24B41/06 , B24C1/00 , B26D3/00 , B24B7/04 , B24B7/16 , F01D7/00 , F01D25/28 , B27C7/00 , B27C7/04 , B23D45/04
CPC分类号： F01D5/025 , B23C3/00 , B23D45/00 , B23D45/003 , B23D45/046 , B23P15/006 , B24B7/04 , B24B7/16 , B24B19/26 , B24B27/0038 , B24B27/0092 , B24B39/06 , B24B41/061 , B24B41/067 , B24C1/00 , B26D3/00 , B27C1/00 , B27C7/00 , B27C7/04 , F01D5/02 , F01D7/00 , F01D25/285 , F05D2230/10 , F05D2230/90 , F05D2240/20 , F05D2240/24 , F05D2300/13 , F05D2300/131 , F05D2300/132
摘要： Embodiments of the present disclosure provide surface treatment tools, methodologies, and/or treated turbomachine components. A surface treatment tool according to the present disclosure can include a lathe assembly having a lathe chuck for receiving a component thereon, wherein the lathe chuck rotates the component about a first axis of rotation, and wherein the component includes an exposed axial target surface; and a sander or burnishing tool coupled to the lathe assembly and including a sanding or burnishing surface thereon, coupled to a drive system, wherein the sanding or burnishing surface is oriented along a second axis substantially non-parallel with the first axis of rotation, such that the sanding or burnishing surface selectively contacts the target surface of the component to yield a polished target surface.

106. 发明授权

US09238288B2 Method for processing plate object 有权
标题翻译：板材加工方法
公开(公告)号：US09238288B2
公开(公告)日：2016-01-19
申请号：US14104761
申请日：2013-12-12
申请人： Disco Corporation
发明人： Tetsukazu Sugiya , Susumu Hayakawa
IPC分类号： B44C1/22 , B24B1/00 , B24B7/04
CPC分类号： B24B1/00 , B24B7/04
摘要： In a method for processing a plate object, etching is performed for a flat plate object by a predetermined etching method and the shape of the plate object after the etching is grasped in advance. In a grinding step, the plate object is ground into a grinding-finished shape that is a non-flat shape obtained by inverting the shape of the plate object after the etching to the reverse shape. When subsequent etching by the predetermined etching method is performed for a grinding-target surface, the plate object is formed into a flat shape with a uniform thickness.
摘要翻译：在用于处理平板物体的方法中，通过预定的蚀刻方法对平板物体进行蚀刻，并且预先掌握蚀刻后的板材的形状。在研磨步骤中，将板材研磨成通过将蚀刻后的板材的形状反转为反转形状而获得的非平坦形状的研磨成型。当对研磨对象表面进行通过预定蚀刻方法的后续蚀刻时，平板物体形成为具有均匀厚度的平坦形状。

107. 发明授权

US08888557B2 Method and apparatus for manufacturing a semiconductor device 有权
标题翻译：用于制造半导体器件的方法和装置
公开(公告)号：US08888557B2
公开(公告)日：2014-11-18
申请号：US13414925
申请日：2012-03-08
申请人： Yoko Tanaka
发明人： Yoko Tanaka
IPC分类号： B24B7/04
CPC分类号： H01L21/6838
摘要： A method of transporting a semiconductor wafer having a ring-shaped stiffening portion can include the steps of pressing the semiconductor wafer from the back surface side to the front surface side thereof on a place different from a place at which the semiconductor wafer is to be held, the step of pressing the semiconductor wafer being conducted before holding the semiconductor wafer having the ring-shaped stiffening portion. The method can include releasing the attachment by suction of the front surface of the semiconductor wafer by supplying a positive pressure onto the chuck table, releasing pressing the semiconductor wafer from the back surface side to the front surface side thereof on the place different from the place at which the semiconductor wafer is to be held and picking up the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer.
摘要翻译：输送具有环状加强部的半导体晶片的方法可以包括以下步骤：将半导体晶片从与要保持半导体晶片的位置不同的位置从背面侧按压到其前表面侧在保持具有环形加强部的半导体晶片之前按压被导通的半导体晶片的步骤。该方法可以包括通过向卡盘台上提供正压力而将半导体晶片的前表面吸附释放附件，在不同于该位置的位置将半导体晶片从背表面侧向其前表面侧释放在保持半导体晶片的同时保持半导体晶片并且从卡盘台拾取具有环形加强部的半导体晶片。

108. 发明授权

US08740673B2 CMP retaining ring with soft retaining ring insert 有权
标题翻译： CMP固定环带软固定环插入
公开(公告)号：US08740673B2
公开(公告)日：2014-06-03
申请号：US13252897
申请日：2011-10-04
申请人： William J. Kalenian , Larry Spiegel
发明人： William J. Kalenian , Larry Spiegel
IPC分类号： B24B7/04
CPC分类号： B24B37/32
摘要： A wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.
摘要翻译：适用于进一步降低边缘效应并允许晶片在整个表面上被均匀抛光的晶片载体，其中由非常硬的材料（例如PEEK，PET或聚碳酸酯）制成的保持环的硬度范围为80至85 Shore D，而内表面或插入物由聚氨酯或其他硬度为85至95肖氏硬度的材料制成。

109. 发明授权

US08337281B2 Self-aligning rotary blade holder for sharpener 有权
标题翻译：用于磨刀机的自调心旋转刀架
公开(公告)号：US08337281B2
公开(公告)日：2012-12-25
申请号：US12488393
申请日：2009-06-19
申请人： Clark A. Levsen
发明人： Clark A. Levsen
IPC分类号： B24B7/04 , B24B9/04
CPC分类号： B24B3/46 , B24B41/06 , B26B25/002
摘要： A universal blade sharpening machine is operable to securely hold and sharpen any one of multiple variously sized circular blades. The machine includes a blade-sharpening drive with an adjustable blade sharpener and also includes a universal blade holder that is rotatably powered by the drive. The blade holder includes a blade-receiving chassis that holds the blade during sharpening and is rotatable about a rotation axis of the blade holder. The chassis includes a plurality of radially spaced blade-retaining sections each associated with a respective one of the circular blades.
摘要翻译：通用刀片磨边机可操作地牢固地固定和磨削多个不同尺寸的圆形刀片中的任何一个。该机器包括具有可调节刀片磨刀机的刀片磨刀驱动器，并且还包括由驱动器可旋转地供能的通用刀片保持器。刀片保持器包括刀片接收底盘，其在刃磨期间保持刀片并且可围绕刀片保持器的旋转轴线旋转。底盘包括多个径向隔开的叶片保持部分，每个与相应的一个圆形叶片相关联。

110. 发明申请

US20110014853A1 POLISHING METHOD, POLISHING PAD AND POLISHING SYSTEM 有权
标题翻译：抛光方法，抛光垫和抛光系统
公开(公告)号：US20110014853A1
公开(公告)日：2011-01-20
申请号：US12691184
申请日：2010-01-21
申请人： YU-PIAO WANG
发明人： YU-PIAO WANG
IPC分类号： B24D11/00 , B24B1/00 , B24B7/04 , B24D7/18
CPC分类号： B24B37/26
摘要： A polishing method, a polishing pad and a polishing system are provided. In the invention, the polishing pad is used to polish a polishing article. The polishing pad includes a polishing layer and a surface pattern disposed in the polishing layer. The polishing layer includes a polishing surface, a rotating central region, and a peripheral region. The surface pattern includes many grooves distributed from near the rotating central region and extending outward to near the peripheral region. The grooves include many groove cross sections along a circumferential direction of a same radius. Each of the groove cross sections has a left sidewall and a right sidewall. An included angle is formed by the polishing surface and one of a group of the left sidewalls and a group of the right sidewalls. The included angle is an obtuse angle.
摘要翻译：提供抛光方法，抛光垫和抛光系统。在本发明中，抛光垫用于抛光抛光制品。抛光垫包括抛光层和布置在抛光层中的表面图案。抛光层包括抛光表面，旋转中心区域和周边区域。表面图案包括从旋转中心区域附近分布并向外延伸到周边区域附近的许多凹槽。凹槽包括沿相同半径的圆周方向的许多凹槽横截面。每个槽横截面具有左侧壁和右侧壁。夹角由抛光表面和一组左侧壁和一组右侧壁中的一个形成。夹角是钝角。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式