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101. 发明申请

US20120227333A1 DUAL TAPERED SHAPED ABRASIVE PARTICLES 有权
标题翻译：双刃形抛光颗粒
公开(公告)号：US20120227333A1
公开(公告)日：2012-09-13
申请号：US13498636
申请日：2010-11-23
申请人： Negus B. Adefris , Ehrich J. Braunschweig , Steven J. Keipert
发明人： Negus B. Adefris , Ehrich J. Braunschweig , Steven J. Keipert
IPC分类号： C09K3/14 , A46B15/00
CPC分类号： C09K3/1409 , B24D3/00 , B24D11/00
摘要： Shaped abrasive particles comprising alpha alumina and having a first side, a second side, a maximum length along a longitudinal axis and a maximum width transverse to the longitudinal axis. The first side comprising a quadrilateral having four edges and four vertices with the quadrilateral selected from the group consisting of a rhombus, a rhomboid, a kite, or a superellipse. The shaped abrasive particles having an aspect ratio of the maximum length divided by the maximum width of 1.3 or greater.
摘要翻译：包含α氧化铝的成形磨料颗粒具有第一面，第二面，沿着纵向轴线的最大长度和横向于纵向轴线的最大宽度。第一侧包括具有四个边缘的四边形和四个顶点，四边形选自菱形，菱形，风筝或超椭圆形。具有最大长度的纵横比除以最大宽度1.3或更大的成形磨料颗粒。

102. 发明申请

US20120227331A1 ABRASIVE, METHOD OF POLISHING TARGET MEMBER AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 有权
标题翻译：抛光，抛光方法及其制造方法
公开(公告)号：US20120227331A1
公开(公告)日：2012-09-13
申请号：US13411196
申请日：2012-03-02
申请人： Masato YOSHIDA , Toranosuke Ashizawa , Hiroki Terazaki , Yuuto Ootuki , Yasushi Kurata , Jun Matsuzawa , Kiyohito Tanno
发明人： Masato YOSHIDA , Toranosuke Ashizawa , Hiroki Terazaki , Yuuto Ootuki , Yasushi Kurata , Jun Matsuzawa , Kiyohito Tanno
IPC分类号： C09G1/02
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , H01L21/31053
摘要： To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor which make use of this abrasive.
摘要翻译：为了在不刮擦表面的情况下以高速率抛光SiO 2绝缘膜等的抛光目标表面，本发明提供了一种研磨剂，其包含包含介质的浆料，并分散在其中的至少一种i）氧化铈颗粒，其至少由两个微晶并且具有晶界或堆积密度不高于6.5g / cm 3，和ii）具有孔的磨料颗粒。还提供了抛光目标构件的方法和利用该研磨剂制造半导体的方法。

103. 发明授权

US08262758B2 Method and equipment for making abrasive particles in even distribution, array pattern and preferred orientation 有权
标题翻译：使研磨颗粒均匀分布，阵列图案和优选取向的方法和设备
公开(公告)号：US08262758B2
公开(公告)日：2012-09-11
申请号：US12115474
申请日：2008-05-05
申请人： Weixing Gao
发明人： Weixing Gao
IPC分类号： B24D3/14 , C09C1/68 , C09K3/14 , B05C11/02
CPC分类号： B24D18/00 , B22F2998/00 , C09K3/1409 , C22C2202/02 , B22F1/02
摘要： An equipment for making abrasive particles in even distribution, array pattern and preferred orientation comprises an adsorbing releasing apparatus being composed of a plurality of acicular soft magnetic metallic sticks, an upper and a lower stators, and a plurality of windings. Each winding forms an electric circuit through a electrical source, a resistance, and a switch a plurality of blind holes being distributed on face of the blind hole feeding tropism board. Using electric current to form magnetic field for the acicular soft magnetic metallic sticks absorb or release abrasive particles plated with soft magnetic materials. The equipment is simple, convenient in operation, high in efficiency and reliability. The equipment makes abrasive particles in matrix with an ideal state in distributing density, uniformity, arrange, and tropism. Thereby, the function of the abrasive materials is fully exerted and the life of products is prolonged.
摘要翻译：用于制造均匀分布，阵列图案和优选取向的磨粒的设备包括由多个针状软磁金属棒，上下定子和多个绕组组成的吸附释放装置。每个绕组通过电源，电阻和开关形成电路，多个盲孔分布在盲孔馈电向对面板的表面上。针对软磁金属棒使用电流形成磁场吸收或释放镀有软磁材料的磨料颗粒。设备简单，操作方便，效率高，可靠性高。该设备使磨料颗粒在分布密度，均匀性，排列和向性方面具有理想状态的基质。从而充分发挥研磨材料的功能，延长产品的使用寿命。

104. 发明申请

US20120174493A1 ROBUST BINDER BONDED GRINDING WHEEL 审中-公开
标题翻译：坚固的粘结砂轮
公开(公告)号：US20120174493A1
公开(公告)日：2012-07-12
申请号：US13339162
申请日：2011-12-28
申请人： Lingyu Li
发明人： Lingyu Li
IPC分类号： B24D3/28
CPC分类号： B24D3/34 , B24D3/28 , C09K3/1409
摘要： An abrasive tool includes a matrix material and an abrasive grain contained within the matrix material. The matrix material includes a binder and an block copolymer. The block copolymer including a binder miscible block and a binder immiscible block. The binder immiscible block of the block copolymer can form toughening domains within the matrix material. A method of forming an abrasive tool includes blending a binder powder, an block copolymer powder, and an abrasive grain to form a blended powder, shaping the blended powder, and curing the blended powder.
摘要翻译：研磨工具包括基体材料和包含在基体材料内的磨料颗粒。基质材料包括粘合剂和嵌段共聚物。嵌段共聚物包括粘合剂混溶块和粘合剂不混溶块。嵌段共聚物的粘合剂不混溶嵌段可在基体材料内形成增韧畴。形成研磨工具的方法包括混合粘合剂粉末，嵌段共聚物粉末和磨粒以形成混合粉末，使混合的粉末成形，并固化混合的粉末。

105. 发明授权

US08216326B2 High porosity vitrified superabrasive products and method of preparation 有权
标题翻译：高孔隙度玻璃化超级磨料产品及其制备方法
公开(公告)号：US08216326B2
公开(公告)日：2012-07-10
申请号：US12387796
申请日：2009-05-07
申请人： Rachana D. Upadhyay , Gilles Querel , Pradyumna Gupta , Richard W. J. Hall
发明人： Rachana D. Upadhyay , Gilles Querel , Pradyumna Gupta , Richard W. J. Hall
IPC分类号： B24D3/10
CPC分类号： B24D3/18 , C09K3/1409
摘要： A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed, wherein the vitrified bond component defines pores occupying greater than about 50% of the total volume of the vitrified superabrasive product. The vitrified superabrasive product can be in the form of a grinding tool, such as a grinding wheel. A superabrasive mixture includes a glass powder, a superabrasive grit, a binder and a silicon carbide. The mixture can be in the form of a green body, which is fired under an atmosphere and pressure, and at a temperature sufficient to form a porous vitrified superabrasive product.
摘要翻译：玻璃化超级磨料产品包括超磨料组分和其中分散有超级磨料组分的玻璃化粘合组分，其中玻璃化粘合组分限定占据玻璃化超级磨料产品总体积的约50％的孔。玻璃化的超级磨料产品可以是研磨工具的形式，例如砂轮。超级磨料混合物包括玻璃粉末，超磨料砂粒，粘合剂和碳化硅。混合物可以是生坯体的形式，其在气氛和压力下，在足以形成多孔玻璃化超级磨料产品的温度下进行烧制。

106. 发明授权

US08202445B2 Metal polishing composition and chemical mechanical polishing method 有权
标题翻译：金属抛光组合物和化学机械抛光方法
公开(公告)号：US08202445B2
公开(公告)日：2012-06-19
申请号：US12404353
申请日：2009-03-16
申请人： Sumi Takamiya , Tadashi Inaba , Atsushi Mizutani , Tomoo Kato , Toshiyuki Saie
发明人： Sumi Takamiya , Tadashi Inaba , Atsushi Mizutani , Tomoo Kato , Toshiyuki Saie
IPC分类号： C09K13/06
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1409
摘要： The invention provides a metal polishing composition that is used in chemical mechanical polishing in production of a semiconductor device, and includes an oxidizing agent, an abrasive grain, and at least one compound selected from compounds represented by the following formula (I) and the following formula (II). The invention also provides a chemical mechanical polishing method that uses the metal polishing composition. In formula (I), R1 represents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring. In formula (II), R2 represents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring.
摘要翻译：本发明提供一种用于制造半导体器件的化学机械抛光中的金属抛光组合物，包括氧化剂，磨粒和至少一种选自下式（I）表示的化合物和下述式式（II）。本发明还提供了使用金属抛光组合物的化学机械抛光方法。在式（I）中，R 1表示氢原子或烷基，Ph表示苯基。式（II）中，R 2表示氢原子或烷基，Ph表示苯基。

107. 发明授权

US08142891B2 Dish-shaped abrasive particles with a recessed surface 有权
标题翻译：具凹陷表面的碟形磨料颗粒
公开(公告)号：US08142891B2
公开(公告)日：2012-03-27
申请号：US12336961
申请日：2008-12-17
申请人： Scott R. Culler , Dwight D. Erickson , Negus B. Adefris , John T. Boden , John D. Haas
发明人： Scott R. Culler , Dwight D. Erickson , Negus B. Adefris , John T. Boden , John D. Haas
IPC分类号： B24D3/00 , B32B5/16
CPC分类号： B24D11/00 , C09K3/1409 , Y10T428/24364 , Y10T428/2982
摘要： Abrasive particles comprising dish-shaped abrasive particles each having a sidewall; each of the shaped abrasive particles comprising alpha alumina and having a first face and a second face separated by a thickness, t; and wherein either the first face or the second face is recessed or concave.
摘要翻译：研磨颗粒包括各自具有侧壁的碟形磨料颗粒; 每个成形磨料颗粒包含α氧化铝，并且具有分开厚度t的第一面和第二面; 并且其中所述第一面或所述第二面都凹入或凹入。

108. 发明申请

US20120058037A1 BORON CARBIDE AND METHOD FOR MAKING SAME 失效
标题翻译：碳硼化物及其制备方法
公开(公告)号：US20120058037A1
公开(公告)日：2012-03-08
申请号：US12595680
申请日：2008-04-09
申请人： Yann Le Godec , Mohamed Mezouar , Denis Andrault , Vladimir Solozhenko , Oleksandr Kurakevych
发明人： Yann Le Godec , Mohamed Mezouar , Denis Andrault , Vladimir Solozhenko , Oleksandr Kurakevych
IPC分类号： C01B31/36
CPC分类号： C09K3/1409 , C01B32/956
摘要： The invention relates to boron carbide and to a method for making the same, as well as to a super-abrasive material and a machine device including said boron carbide. The boron carbide of the invention has the following formula BC5 and has a diamond-type cubic structure with a mesh parameter a=3.635±0.006 Å. The boron carbide of the invention can particularly be used in the field of machining.
摘要翻译：本发明涉及碳化硼及其制造方法，以及涉及超研磨材料和包括所述碳化硼的机器装置。本发明的碳化硼具有下列公式BC5，并且具有网格参数a = 3.635±0.006的金刚石型立方结构。本发明的碳化硼可以特别用于机械加工领域。

109. 发明申请

US20120052682A1 POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：抛光浆和使用其制造半导体器件的方法
公开(公告)号：US20120052682A1
公开(公告)日：2012-03-01
申请号：US13204862
申请日：2011-08-08
申请人： Sang-Kyun Kim , Jong-Won Lee , Eui-Hoon Jung , Bo-Un Yoon , Sang-Hyun Park , Seung-Jae Lee , Yun-Jeong Kim
发明人： Sang-Kyun Kim , Jong-Won Lee , Eui-Hoon Jung , Bo-Un Yoon , Sang-Hyun Park , Seung-Jae Lee , Yun-Jeong Kim
IPC分类号： H01L21/302 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing slurry for polishing an aluminum film includes an abrasive agent, an oxidizing agent, an anti-corrosion agent, and a removal rate reducing agent that is an anionic compound exhibiting a negative charge in the slurry. The polishing slurry can be used in a method of manufacturing a semiconductor device.
摘要翻译：用于抛光铝膜的抛光浆料包括研磨剂，氧化剂，防腐蚀剂和作为在浆料中显示负电荷的阴离子化合物的去除速率还原剂。抛光浆料可用于制造半导体器件的方法中。

110. 发明授权

US08114178B2 Polishing composition for semiconductor wafer and polishing method 失效
标题翻译：半导体晶圆抛光组合物及抛光方法
公开(公告)号：US08114178B2
公开(公告)日：2012-02-14
申请号：US12081829
申请日：2008-04-22
申请人： Masahiro Izumi , Shinsuke Miyabe , Kuniaki Maejima , Hiroaki Tanaka
发明人： Masahiro Izumi , Shinsuke Miyabe , Kuniaki Maejima , Hiroaki Tanaka
IPC分类号： B24D3/02 , C09C1/68 , C09K3/14
CPC分类号： H01L21/02024 , B24B37/044 , C09K3/1409 , C09K3/1463
摘要： The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor wafer comprises colloidal silica consisting of non-spherical silica particles having a ratio of long axis to short axis of 1.5 to 15. The polishing method for a semiconductor wafer uses the polishing composition. The polishing composition can provide a remarkably high polishing rate compared with a polishing composition using spherical colloidal silica, and can provide good mirror-polishing without causing scratches. In addition, small alkali metal content enables reduction of adverse effects on a semiconductor wafer, such as residual abrasives after polishing.
摘要翻译：本发明涉及抛光性优异的半导体晶片用研磨用组合物及研磨方法。用于半导体晶片的抛光组合物包括由长轴与短轴的比率为1.5至15的非球形二氧化硅颗粒组成的胶体二氧化硅。半导体晶片的抛光方法使用抛光组合物。抛光组合物与使用球形胶体二氧化硅的抛光组合物相比可以提供非常高的抛光速率，并且可以提供良好的镜面抛光而不会产生划痕。此外，小的碱金属含量可以减少半导体晶片的不利影响，例如抛光后的残留磨料。

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