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    • 102. 发明申请
    • Abrasive machine and method of abrading work piece
    • 研磨机和研磨工件的方法
    • US20030104766A1
    • 2003-06-05
    • US10303156
    • 2002-11-22
    • Toshiroh Doy
    • Toshiroh Doy
    • B24B001/00
    • B24B37/042B24B37/04B24B41/047
    • The abrasive machine of the present invention is capable of changing pressure applied to a work piece and easily defining optimum abrading conditions. The abrasive machine comprises: a pressure vessel capable of increasing and reducing inner pressure; an abrasive plate provided in the pressure vessel; a pressing plate provided on the abrasive plate, the pressing plate pressing the work piece onto the abrasive plate; a driving unit relatively moving the abrasive plate with respect to the pressing plate so as to abrade the work piece; and a pressure source connected to the pressure vessel, the pressure source increasing or reducing the inner pressure of the pressure vessel.
    • 本发明的研磨机能够改变施加到工件上的压力,并且能够容易地确定最佳研磨条件。 研磨机包括:能够增加和降低内部压力的压力容器; 设置在压力容器内的研磨板; 设置在所述研磨板上的压板,所述压板将所述工件压在所述研磨板上; 驱动单元,相对于所述压板相对地移动所述研磨板,以便研磨所述工件; 以及连接到压力容器的压力源,压力源增加或降低压力容器的内部压力。
    • 103. 发明授权
    • Hard polishing pad for chemical mechanical planarization
    • 用于化学机械平面化的硬抛光垫
    • US06551179B1
    • 2003-04-22
    • US09706336
    • 2000-11-03
    • David G. Halley
    • David G. Halley
    • B24B100
    • B24B37/26B24B37/24B24B41/047
    • The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a polishing surface to be placed on a target surface of the object to be polished. A pad drive member is connected to the pad to move the pad relative to the object to change a position of the polishing surface of the pad on the target surface of the object. The pad comprises a backing material having a modulus of elasticity of at least about 300,000 psi. In specific embodiments, the pad includes grooves on the polishing surface. The pad has a thickness between about 0.05 and about 0.1 inch. The pad back material comprises a ceramic material. A compliant layer may be disposed between the pad and the pad drive member. The compliant layer comprises an elastomeric material. In some embodiments, a drive support is movably coupled with the pad drive member to support the pad drive member for rotation relative to the drive support around a pivot point which is disposed substantially on the target surface of the object during polishing.
    • 本发明提供了用于化学机械平面化和其它类型抛光的改进的平面化或抛光装置,例如金属抛光和光学抛光。 在一个示例性实施例中,用于抛光物体的装置包括具有要放置在待抛光对象的目标表面上的抛光表面的焊盘。 衬垫驱动构件连接到衬垫以相对于物体移动衬垫,以改变衬垫的抛光表面在物体的目标表面上的位置。 垫包括具有至少约300,000psi的弹性模量的背衬材料。 在具体实施例中,垫在抛光表面上包括凹槽。 垫具有约0.05至约0.1英寸之间的厚度。 垫背材料包括陶瓷材料。 柔性层可以设置在垫和垫驱动构件之间。 顺应层包括弹性体材料。 在一些实施例中,驱动器支撑件与垫驱动构件可移动地联接以支撑衬垫驱动构件,用于相对于围绕枢转点的驱动支撑件旋转,该枢转点在抛光期间基本上设置在物体的目标表面上。
    • 105. 发明授权
    • Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
    • 用于化学机械平面化系统的垫调节器耦合和端部执行器及其方法
    • US06514126B1
    • 2003-02-04
    • US09586189
    • 2000-06-02
    • James F. Vanell
    • James F. Vanell
    • B24B700
    • B24B37/20B24B37/04B24B37/26B24B41/047B24B53/017B24B53/12
    • A pad conditioner coupling (58) holds an end effector (57) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling (58) comprises shoulder screws (50), polymer bearings (51), a static plate (52), a wave spring (54), and a floating plate (55). Wave spring (54) is placed between static plate (52) and floating plate (55). The shoulder screws (50) connect through the static plate (52) and fasten to the floating plate (55) to hold the wave spring (54) in a preloaded condition. The polymer bearings (51) prevent the shoulder screws (50) from contacting the static plate (52). Wave spring (54) allows the floating plate (55) to move in a non-parallel position to the static plate (52) for angular compensation in the pad conditioning process.
    • 衬垫调节器联接器(58)保持用于研磨抛光介质表面的端部执行器(57)。 衬垫调理使抛光介质表面平坦化,去除微粒,并使研磨介质表面变粗糙以促进抛光浆料的输送。 衬垫调节器联接器(58)包括肩螺钉(50),聚合物轴承(51),静态板(52),波形弹簧(54)和浮动板(55)。 波形弹簧(54)放置在静态板(52)和浮板(55)之间。 肩部螺钉(50)通过静电板(52)连接并固定在浮动板(55)上,以将波形弹簧(54)保持在预加载状态。 聚合物轴承(51)防止肩部螺钉(50)接触静态板(52)。 波形弹簧(54)允许浮板(55)在不平行的位置移动到静态板(52),以在垫调节过程中进行角度补偿。
    • 109. 发明授权
    • Grinding machine
    • 磨床
    • US06443818B1
    • 2002-09-03
    • US09554416
    • 2000-07-10
    • Russell Graham Bent
    • Russell Graham Bent
    • B24B700
    • B24B27/0084B24B7/228B24B27/0053B24B41/04B24B41/047B24B49/02B24B49/10B24B49/16
    • A grinding machine, in particular a face grinder for grinding the faces of silicon wafers, has a grinding wheel spindle (20) and a work spindle (22) which are mounted so as to be pivotal about axes (A and B) respectively, each axis being perpendicular to the rotational axis of its respective spindle and being orthogonal to the rotation axis of the other spindle. Three sensors or probes (1 to 3) are provided to measure the position of one spindle relative to the other and to generate signals for controlling servo motors (26, 28) for adjusting the angular orientation of each spindle about its pivotal axis.
    • 研磨机,特别是用于研磨硅晶片表面的研磨机具有分别围绕轴线(A和B)枢转安装的砂轮主轴(20)和工作轴(22),每个 轴垂直于其相应主轴的旋转轴线并且与另一主轴的旋转轴线正交。 提供三个传感器或探头(1至3)以测量一个主轴相对于另一个的位置,并产生用于控制伺服电动机(26,28)的信号,用于调节每个心轴围绕其枢转轴线的角度定向。
    • 110. 发明授权
    • Polishing machine having a plurality of abrasive pads
    • 抛光机具有多个研磨垫
    • US06379228B2
    • 2002-04-30
    • US09728116
    • 2000-12-04
    • Muneyuki Matsumoto
    • Muneyuki Matsumoto
    • B24B700
    • B24B37/24B24B41/047
    • A polishing machine provided with a plurality of bases operative independently of each other; a plurality of abrasive pads respectively fixed to the plurality of bases and each having an abrasive surface for polishing a workpiece; and a base driving mechanism for individually operating the plurality of bases. The operations of the respective bases are individually controlled by controlling the base driving mechanism by means of a control circuit. The control circuit controls the base driving mechanism so that the workpiece is generally uniformly polished by the abrasive surfaces of the respective abrasive pads.
    • 一种抛光机,其具有彼此独立地操作的多个基座; 多个研磨垫分别固定在所述多个基座上并且各自具有用于抛光工件的研磨表面; 以及用于单独操作所述多个基座的基座驱动机构。 通过控制电路控制基座驱动机构,分别控制各个基座的动作。 控制电路控制基座驱动机构,使得工件通常由相应研磨垫的研磨表面均匀地抛光。