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101. 发明授权

US5972110A Resist processing system 失效
标题翻译：抗蚀加工系统
公开(公告)号：US5972110A
公开(公告)日：1999-10-26
申请号：US921716
申请日：1997-09-02
申请人： Masami Akimoto
发明人： Masami Akimoto
IPC分类号： H01L21/00 , H01L21/027 , H01L21/304 , H01L21/677 , B05C5/00
CPC分类号： H01L21/67754 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , Y10S414/135 , Y10S414/137 , Y10S414/141
摘要： A resist processing system includes a plurality of processing units each having a plurality of compartments stacked one upon the other in a vertical direction, a solution processing device arranged in a compartment positioned in a lower portion of the processing unit for applying a process solution to a substrate W while rotating the substrate, a heating device arranged in a compartment positioned in an upper portion of the processing unit for heating the substrate, a cooling device arranged in an intermediate compartment positioned between the compartment having the heating device arranged therein and the compartment having the solution processing device arranged therein for cooling the substrate, and a main arm mechanism arranged in each of the processing units and provided with a plurality of holders for transferring the substrate W into and out of each compartment, the holder being movable into and out of each of the compartments included in the processing unit, movable in a Z-axis direction, and swingable about the Z-axis by an angle .theta..
摘要翻译：抗蚀剂处理系统包括多个处理单元，每个处理单元具有在垂直方向上彼此堆叠的多个隔室;布置在位于处理单元的下部的隔室中的溶液处理装置，用于将处理溶液施加到衬底W，同时旋转衬底;布置在位于处理单元的上部的隔室中用于加热衬底的加热装置;布置在位于具有布置在其中的具有加热装置的隔室之间的中间室中的冷却装置，布置在其中用于冷却基板的溶液处理装置和布置在每个处理单元中的主臂机构，并且设置有多个保持器，用于将基板W输入和移出每个隔室，保持器可移动和移出包括在处理单元中的每个隔间可以在Z轴上移动方向，并且可绕Z轴摆动角度θ。

102. 发明授权

US5928390A Vertical processing apparatus 失效
标题翻译：垂直加工设备
公开(公告)号：US5928390A
公开(公告)日：1999-07-27
申请号：US787862
申请日：1997-01-23
申请人： Hidetami Yaegashi , Takayuki Toshima , Masami Akimoto , Eiji Yamaguchi , Junichi Kitano , Takayuki Katano , Hiroshi Shinya , Naruaki Iida
发明人： Hidetami Yaegashi , Takayuki Toshima , Masami Akimoto , Eiji Yamaguchi , Junichi Kitano , Takayuki Katano , Hiroshi Shinya , Naruaki Iida
IPC分类号： H01L21/00 , H01L21/68 , B23P21/00 , B65G49/07 , H01L21/027
CPC分类号： H01L21/67178 , H01L21/67196 , H01L21/67225 , H01L21/67742 , Y10T29/41
摘要： A processing apparatus comprises a plurality of process unit groups each including a plurality of process units for subjecting an object to a series of processes, the process units being arranged vertically in multiple stages, an object transfer space being defined among the process unit groups, and a transfer mechanism for transferring the object, the transfer mechanism having a transfer member vertically movable in the object transfer space, the transfer member being capable of transferring the object to each of the process units. The processing apparatus further comprises a mechanism for forming a downward air flow in the object transfer space, a mechanism for controlling the quantity of the downward air flow, and a mechanism for controlling the pressure in the object transfer space. Thus, a variation in condition of the object transfer space is reduced.
摘要翻译：处理装置包括多个处理单元组，每个处理单元组包括用于对象进行一系列处理的多个处理单元，处理单元以多级垂直排列，在处理单元组之间定义对象传送空间，以及用于传送物体的传送机构，传送机构具有可在物体传送空间中垂直移动的传送部件，传送部件能够将物体传送到每个处理单元。处理装置还包括用于在物体传送空间中形成向下的空气流的机构，用于控制向下的空气流量的机构，以及用于控制物体传送空间中的压力的机构。因此，物体传送空间的状态的变化减小。

103. 发明授权

US5858112A Method for cleaning substrates 失效
标题翻译：清洗基材的方法
公开(公告)号：US5858112A
公开(公告)日：1999-01-12
申请号：US818880
申请日：1997-03-17
申请人： Akira Yonemizu , Masami Akimoto
发明人： Akira Yonemizu , Masami Akimoto
IPC分类号： B08B1/04 , H01L21/00 , H01L21/306 , B08B1/00 , B08B3/04
CPC分类号： H01L21/67092 , B08B1/007 , B08B1/04 , H01L21/30625 , H01L21/67046 , H01L21/67051 , Y10S134/902
摘要： A substrate cleaning method in which the substrate is rotated and cleaned utilizing a brush which is brought into contact with the substrate. In accordance with one presently preferred aspect, the substrate is held between a stepped portion and a stopper portion at the fringe of the substrate, thereby preventing movement of the substrate as it is rotated and the brush is brought into contact with the substrate. In accordance with another aspect, a freely rotatable brush is brought into contact with the substrate so that the brush can rotate with the rotating substrate, and damage to the substrate can be minimized.
摘要翻译：一种基板清洗方法，其中使用与基板接触的刷子旋转和清洁基板。根据目前优选的一个方面，基板被保持在基板的边缘处的阶梯部分和止动部分之间，从而防止了基板旋转时的移动，并且刷子与基板接触。根据另一方面，使可自由旋转的刷子与基板接触，使得刷子可以与旋转的基板一起旋转，并且可以使对基板的损坏最小化。

104. 发明授权

US5772764A Coating apparatus 失效
标题翻译：涂装设备
公开(公告)号：US5772764A
公开(公告)日：1998-06-30
申请号：US729028
申请日：1996-10-09
申请人： Masami Akimoto
发明人： Masami Akimoto
IPC分类号： B05B12/14 , B05C11/08 , B05D1/40 , G03F7/16 , H01L21/027 , B05B13/02 , B05B7/16 , B05B13/04 , B05B15/02
CPC分类号： B05C11/08 , G03F7/162 , B05B12/14
摘要： A coating apparatus comprises a spin chuck for holding and rotating a substrate, a header unit movable along a linear line connecting a position just above a center-of-rotation of the substrate, to a home position of the unit, a plurality of nozzles included in the header unit for discharging coating liquids to the substrate held on the spin chuck, the first nozzles having their respective nozzle ports arranged in line along the linear line, and a plurality of coating liquid supply means for supplying the coating liquids to the first nozzles, respectively.
摘要翻译：涂覆装置包括用于保持和旋转衬底的旋转卡盘，可沿着连接刚好在衬底的旋转中心的位置的线性线移动到主体的主体位置的头部单元，包括多个喷嘴在用于将涂布液喷射到保持在旋转卡盘上的基板的头部单元中，第一喷嘴具有沿线性线排列成各自的喷嘴端口，以及多个涂布液供给装置，用于将涂布液供给到第一喷嘴，分别。

105. 发明授权

US5651160A Cleaning apparatus for cleaning substrates 失效
标题翻译：用于清洁基板的清洁装置
公开(公告)号：US5651160A
公开(公告)日：1997-07-29
申请号：US587485
申请日：1996-01-17
申请人： Akira Yonemizu , Masami Akimoto
发明人： Akira Yonemizu , Masami Akimoto
IPC分类号： B08B1/04 , H01L21/00 , H01L21/306 , H01L21/304
CPC分类号： H01L21/67092 , B08B1/007 , B08B1/04 , H01L21/30625 , H01L21/67046 , H01L21/67051 , Y10S134/902
摘要： The cleaning apparatus for cleaning a semiconductor wafer W as a substrate, has a holding mechanism for holding the wafer, a motor for rotating the wafer held by the holding mechanism, and a cleaning section provided on at least one side of the wafer held by the holding mechanism. The cleaning section includes at least one cleaning member provided so as to be brought into contact with the wafer W, and the cleaning member is movable along with the rotation of the substrate rotated by the motor while it is in contact with the wafer.
摘要翻译：用于清洁作为基板的半导体晶片W的清洁装置具有用于保持晶片的保持机构，用于使由保持机构保持的晶片旋转的电动机和设置在晶片保持的晶片的至少一侧的清洁部分保持机制。清洁部分包括设置成与晶片W接触的至少一个清洁部件，并且清洁部件可随着与电机接触而旋转的基板的旋转一起移动。

106. 发明授权

US5364222A Apparatus for processing wafer-shaped substrates 失效
标题翻译：用于处理晶片状基板的装置
公开(公告)号：US5364222A
公开(公告)日：1994-11-15
申请号：US14161
申请日：1993-02-05
申请人： Masami Akimoto , Kazutoshi Yoshioka , Naruaki Iida
发明人： Masami Akimoto , Kazutoshi Yoshioka , Naruaki Iida
IPC分类号： B65G1/00 , B65G1/07 , B65G49/07 , H01L21/677 , H01L21/683
CPC分类号： H01L21/67781 , H01L21/6838 , Y10S414/137 , Y10S414/141
摘要： An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.
摘要翻译：一种用于在晶片上涂覆和显影抗蚀剂的设备包括：载体站，设置有用于接收晶片和转印台的多个载体，具有多个处理单元的处理部分和设置在载体站和处理之间的传送机器人部分。机器人包括用于在载体和转印台之间传送晶片的板状臂，以及用于在处理单元和转印台之间转印晶片的两个马蹄形叉。机器人可以沿传送路径移动，以使臂和叉面向载体，处理单元和传送台。

107. 发明授权

US5002008A Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state 失效
标题翻译：将液体施加到半导体晶片的涂布装置和方法，包括在待机状态下选择喷嘴
公开(公告)号：US5002008A
公开(公告)日：1991-03-26
申请号：US357279
申请日：1989-05-26
申请人： Mitsuru Ushijima , Osamu Hirakawa , Masami Akimoto , Yoshio Kimura , Noriyuki Anai
发明人： Mitsuru Ushijima , Osamu Hirakawa , Masami Akimoto , Yoshio Kimura , Noriyuki Anai
IPC分类号： B05B15/02 , B05C11/08 , G03F7/16
CPC分类号： B05B15/025 , B05C11/08 , G03F7/162
摘要： Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.
摘要翻译：公开了一种将抗蚀剂或显影液施加到半导体晶片的涂布装置。该涂布装置包括从抗蚀剂源供给各种抗蚀剂的多个喷嘴，每个喷嘴适于将不同的溶液滴到晶片上，其中喷嘴保持待机的容器，同时将液体保持在预定状态喷嘴的排出口部分附近，当喷嘴不需要操作时，以及喷嘴操作机构，用于选择在容器中保持待机的喷嘴之一，并将所选择的喷嘴输送到晶片的位置，由此通过仅由喷嘴操作机构传送的喷嘴将抗蚀剂施加到晶片。

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