专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

101. 发明申请

US20120068328A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVAL AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有主动表面除热的集成电路包装系统及其制造方法
公开(公告)号：US20120068328A1
公开(公告)日：2012-03-22
申请号：US12887681
申请日：2010-09-22
申请人： Kang Chen , Xusheng Bao , Rui Huang , Yung Kuan Hsiao , Hin Hwa Goh
发明人： Kang Chen , Xusheng Bao , Rui Huang , Yung Kuan Hsiao , Hin Hwa Goh
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/5389 , H01L21/568 , H01L23/13 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L24/14 , H01L24/16 , H01L24/73 , H01L24/92 , H01L24/96 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13024 , H01L2224/1403 , H01L2224/14051 , H01L2224/16245 , H01L2224/24155 , H01L2224/32245 , H01L2224/73209 , H01L2224/92133 , H01L2224/92135 , H01L2224/97 , H01L2924/01029 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing an interconnect structure having a structure bottom side, a structure top side, and a cavity, the structure bottom side electrically connected to the structure top side; mounting an integrated circuit entirely within the cavity, the integrated circuit having an active side coplanar with the structure top side; forming an encapsulation partially covering the interconnect structure and the integrated circuit, the encapsulation having an encapsulation top side coplanar with the structure top side and the active side; forming a top re-passivation layer over the structure top side and the encapsulation; and mounting a heat sink over the top re-passivation layer for removing heat from the active side.
摘要翻译：一种集成电路封装系统的制造方法，包括：提供具有结构底侧，结构顶侧和空腔的互连结构，所述结构底侧电连接到所述结构顶侧; 将集成电路完全安装在腔内，该集成电路具有与结构顶侧共面的有源侧; 形成部分覆盖所述互连结构和所述集成电路的封装，所述封装具有与所述结构顶侧和所述有源侧共面的封装顶侧; 在结构顶侧上形成顶部再钝化层和封装; 并将散热器安装在顶部再钝化层上，以从活动侧去除热量。

102. 发明授权

US5170179A Thermal printhead with improved resolution and inter-dot isolation 失效
标题翻译：热敏打印头具有改进的分辨率和点间隔离
公开(公告)号：US5170179A
公开(公告)日：1992-12-08
申请号：US649696
申请日：1991-02-01
申请人： Kang Chen , Nhut Chau
发明人： Kang Chen , Nhut Chau
IPC分类号： B41J2/34 , B41J2/345 , B41J2/36
CPC分类号： B41J2/345 , B41J2/34 , B41J2/36
摘要： Pulse fingers are disposed on a heat-generating material which fingers are pulsed to change the resistance of portions of the heat-generating material. By such change in the resistance of the heat-generating material, electrical current diffusion is prevented and heat diffusion is permitted between the changed resistance portion of the heat-generating material, thereby providing high resolution character printing and so-called "continuous" graphics printing.
摘要翻译：脉冲指状物设置在发热材料上，手指被脉冲以改变发热材料的部分电阻。通过发热材料的电阻的这种变化，防止了电流扩散，并且允许在发热材料的变化的电阻部分之间进行热扩散，从而提供高分辨率字符打印和所谓的“连续”图形印刷。

103. 发明授权

US09236278B2 Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof 有权
标题翻译：集成电路封装系统及其制造方法
公开(公告)号：US09236278B2
公开(公告)日：2016-01-12
申请号：US13242306
申请日：2011-09-23
申请人： Rui Huang , Xusheng Bao , Kang Chen , Yung Kuan Hsiao , Hin Hwa Goh
发明人： Rui Huang , Xusheng Bao , Kang Chen , Yung Kuan Hsiao , Hin Hwa Goh
IPC分类号： H01L21/58 , H01L23/14 , H01L23/498 , H01L23/31 , H01L21/56 , H01L23/00
CPC分类号： H01L21/568 , H01L21/563 , H01L23/147 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/814 , H01L2224/83104 , H01L2224/97 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2224/81 , H01L2924/00014 , H01L2924/014 , H01L2224/16225 , H01L2924/00012 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a dummy-die paddle having a first inactive side facing up, a second inactive side facing down; forming an insulator in a single continuous structure around and in direct contact with the first inactive side; and mounting an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供一个虚拟焊盘，其具有面朝上的第一无效侧，朝下的第二无效侧; 在与第一非活性侧直接接触的单一连续结构中形成绝缘体; 并且将集成电路安装在虚拟芯片桨和绝缘体，集成电路和虚拟模具板上，其具有与虚拟芯片桨相同的热膨胀系数。

104. 发明申请

US20130075922A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY-DIE PADDLE AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：集成电路包装系统与基板嵌入式DUMMY-DIE PADDLE及其制造方法
公开(公告)号：US20130075922A1
公开(公告)日：2013-03-28
申请号：US13242306
申请日：2011-09-23
申请人： Rui Huang , Xusheng Bao , Kang Chen , Yung Kuan Hsiao , Hin Hwa Goh
发明人： Rui Huang , Xusheng Bao , Kang Chen , Yung Kuan Hsiao , Hin Hwa Goh
IPC分类号： H01L23/48 , H01L21/60 , H01L21/58
CPC分类号： H01L21/568 , H01L21/563 , H01L23/147 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/814 , H01L2224/83104 , H01L2224/97 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2224/81 , H01L2924/00014 , H01L2924/014 , H01L2224/16225 , H01L2924/00012 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a dummy-die paddle having a first inactive side facing up, a second inactive side facing down; forming an insulator in a single continuous structure around and in direct contact with the first inactive side; and mounting an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供一个虚拟焊盘，其具有面朝上的第一无效侧，朝下的第二无效侧; 在与第一非活性侧直接接触的单一连续结构中形成绝缘体; 并且将集成电路安装在虚拟芯片桨和绝缘体，集成电路和虚拟模具板上，其具有与虚拟芯片桨相同的热膨胀系数。

105. 外观设计

USD1017892S1 Cigar humidor 有权
公开(公告)号：USD1017892S1
公开(公告)日：2024-03-12
申请号：US29887612
申请日：2023-03-22
申请人： Kang Chen
设计人： Kang Chen
摘要： FIG. 1 is a front, right and top perspective view of a cigar humidor showing my new design;
FIG. 2 is a rear, left and bottom perspective view thereof;
FIG. 3 is a front, right and top perspective view of the cigar humidor in a case;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left view thereof;
FIG. 7 is a right view thereof;
FIG. 8 is a top plan view thereof; and,
FIG. 9 is a bottom plan view thereof.
The broken lines illustrate portions of the cigar humidor that form no part of the claimed design.

106. 发明授权

US08828394B2 Methods for treating IgE-mediated disorder 有权
标题翻译：治疗IgE介导的病症的方法
公开(公告)号：US08828394B2
公开(公告)日：2014-09-09
申请号：US13260008
申请日：2010-04-01
申请人： Andrea Cerutti , Kang Chen
发明人： Andrea Cerutti , Kang Chen
IPC分类号： A61K39/395 , A61K38/16 , C07K16/42
CPC分类号： A61K38/16 , A61K39/39566 , C07K16/4283 , C07K2317/24 , C07K2317/75 , Y10S424/805 , Y10S424/81 , Y10S530/862 , Y10S530/868
摘要： This invention relates to methods of treating IgE mediated disorders such as allergy and asthma based on activating surface-bound IgD molecules on basophils. The invention also relates to methods of making IgD, as well as methods of screening for antimicrobial agents from IgD-activated basophils.
摘要翻译：本发明涉及基于在嗜碱性粒细胞上激活表面结合的IgD分子来治疗IgE介导的病症如过敏和哮喘的方法。本发明还涉及制备IgD的方法，以及从IgD激活的嗜碱性粒细胞筛选抗微生物剂的方法。

107. 外观设计

USD984968S1 Outdoor electrical box 有权
公开(公告)号：USD984968S1
公开(公告)日：2023-05-02
申请号：US29863875
申请日：2022-12-23
申请人： Kang Chen
设计人： Kang Chen

108. 外观设计

USD957731S1 Cigar humidor assembly 有权
公开(公告)号：USD957731S1
公开(公告)日：2022-07-12
申请号：US29796586
申请日：2021-06-25
申请人： Kang Chen
设计人： Kang Chen

109. 发明授权

US07564183B2 Organic electroluminescent display panel with dummy areas 失效
标题翻译：有虚拟区域的有机电致发光显示面板
公开(公告)号：US07564183B2
公开(公告)日：2009-07-21
申请号：US11443051
申请日：2006-05-31
申请人： Tzeng-Cherng Luo , Cheng-Fan Lin , Meng-Chieh Liao , Chi-Chung Chen , Kang Chen
发明人： Tzeng-Cherng Luo , Cheng-Fan Lin , Meng-Chieh Liao , Chi-Chung Chen , Kang Chen
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L27/3288 , H01L27/3223
摘要： An organic electroluminescent display panel, which comprises a substrate, at least one display structure area, at least one first dummy area, and at least one second dummy area. The display structure area comprises at least one encapsulation area, at least one pixel area, a first conducting area, a second conducting area, a wiring area, a first connecting area, and a second connecting area. The wiring area and the first dummy area connect the first connecting area, and the two conducting areas and the second dummy area connect the second connecting area. Besides, the first and the second connecting areas overlap a selected part of the encapsulation area of a neighboring display structure area. Accordingly, the number and capacity of display structure areas on the organic electroluminescent display panel are increased to obtain a uniform brightness during a lighting test.
摘要翻译：一种有机电致发光显示面板，其包括基板，至少一个显示结构区域，至少一个第一虚拟区域和至少一个第二虚拟区域。显示结构区域包括至少一个封装区域，至少一个像素区域，第一导电区域，第二导电区域，布线区域，第一连接区域和第二连接区域。布线区域和第一虚拟区域连接第一连接区域，并且两个导电区域和第二虚拟区域连接第二连接区域。此外，第一和第二连接区域与相邻显示结构区域的封装区域的选定部分重叠。因此，增加有机电致发光显示面板上的显示结构区域的数量和容量，以在点亮测试期间获得均匀的亮度。

110. 发明申请

US20120074560A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有加热控制的集成电路包装系统及其制造方法
公开(公告)号：US20120074560A1
公开(公告)日：2012-03-29
申请号：US12890161
申请日：2010-09-24
申请人： Hin Hwa Goh , Xusheng Bao , Yung Kuan Hsiao , Kang Chen , Rui Huang
发明人： Hin Hwa Goh , Xusheng Bao , Yung Kuan Hsiao , Kang Chen , Rui Huang
IPC分类号： H01L23/04 , H01L21/50
CPC分类号： H01L23/544 , H01L23/055 , H01L23/10 , H01L23/552 , H01L23/562 , H01L24/16 , H01L2224/81005 , H01L2224/81007 , H01L2924/14 , H01L2924/16152 , H01L2924/16235 , H01L2924/167 , H01L2924/1676 , H01L2924/3511 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a carrier; mounting an integrated circuit device having component connectors directly on the carrier; placing a restraint structure over the integrated circuit device for controlling warpage of the integrated circuit device during bonding of the component connectors to the carrier causing some of the component connectors to separate from the carrier; and bonding all of the component connectors to the carrier.
摘要翻译：一种集成电路封装系统的制造方法，包括：提供载体; 将具有部件连接器的集成电路装置安装在载体上; 在所述集成电路装置上放置约束结构，用于控制所述部件连接器与所述载体接合期间所述集成电路装置的翘曲，从而使所述部件连接器中的一些与所述载体分离; 并将所有组件连接器连接到载体上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式