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101. 发明授权

US08686569B2 Die arrangement and method of forming a die arrangement 有权
标题翻译：模具布置和形成模具布置的方法
公开(公告)号：US08686569B2
公开(公告)日：2014-04-01
申请号：US12967281
申请日：2010-12-14
申请人： Frank Daeche , Joachim Mahler , Anton Prueckl , Stefan Landau , Josef Hoeglauer
发明人： Frank Daeche , Joachim Mahler , Anton Prueckl , Stefan Landau , Josef Hoeglauer
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/495 , H01L23/02 , H01L23/04
CPC分类号： H01L24/19 , H01L23/3107 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/20 , H01L2224/04105 , H01L2224/06181 , H01L2224/19 , H01L2224/2105 , H01L2224/215 , H01L2224/221 , H01L2224/24145 , H01L2224/24245 , H01L2224/24246 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73217 , H01L2224/73267 , H01L2224/83801 , H01L2224/92244 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/1815 , H01L2924/00014 , H01L2224/83851 , H01L2224/29075 , H01L2924/00
摘要： A die arrangement includes a carrier having a first side and a second side opposite the first side, the carrier including an opening leading from the first side of the carrier to the second side of the carrier; a first die disposed over the first side of the carrier and electrically contacting the carrier; a second die disposed over the second side of the carrier and electrically contacting the carrier; and an electrical contact structure leading through the opening in the carrier and electrically contacting the second die.
摘要翻译：模具装置包括具有第一侧和与第一侧相对的第二侧的载体，载体包括从载体的第一侧引导到载体的第二侧的开口; 第一管芯，设置在载体的第一侧上并电接触载体; 设置在所述载体的第二侧上并与所述载体电接触的第二管芯; 以及引导通过载体中的开口并电接触第二管芯的电接触结构。

102. 发明申请

US20140021638A1 EMBEDDED INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFACTURING AN EMBEDDED INTEGRATED CIRCUIT PACKAGE 有权
标题翻译：嵌入式集成电路封装和制造嵌入式集成电路封装的方法
公开(公告)号：US20140021638A1
公开(公告)日：2014-01-23
申请号：US13551656
申请日：2012-07-18
申请人： Joachim Mahler , Edward Fuergut , Khalil Hosseini , Georg Meyer-Berg
发明人： Joachim Mahler , Edward Fuergut , Khalil Hosseini , Georg Meyer-Berg
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L23/49811 , H01L21/561 , H01L23/3121 , H01L23/3135 , H01L23/5389 , H01L24/06 , H01L24/19 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04105 , H01L2224/06181 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/83801 , H01L2224/8384 , H01L2224/92244 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2224/83 , H01L2224/82 , H01L2924/014 , H01L2924/00
摘要： A embedded integrated circuit package is provided, the embedded integrated circuit package including: at least one chip arranged over a chip carrier, the at least one chip including a plurality of chip contact pads; encapsulation material formed over the chip carrier and at least partially surrounding the at least one chip; a plurality of electrical interconnects formed through the encapsulation material, wherein each electrical interconnect is electrically connected to a chip contact pad; and a structure formed between the electrical interconnects of the embedded integrated circuit package, wherein the structure increases the creepage resistance between the electrical interconnects.
摘要翻译：提供一种嵌入式集成电路封装，所述嵌入式集成电路封装包括：至少一个布置在芯片载体上的芯片，所述至少一个芯片包括多个芯片接触焊盘; 形成在所述芯片载体上并且至少部分地围绕所述至少一个芯片的封装材料; 通过所述封装材料形成的多个电互连，其中每个电互连电连接到芯片接触焊盘; 以及形成在嵌入式集成电路封装的电互连之间的结构，其中该结构增加了电互连之间的耐爬电阻性。

103. 发明授权

US08618674B2 Semiconductor device including a sintered insulation material 有权
标题翻译：包括烧结绝缘材料的半导体器件
公开(公告)号：US08618674B2
公开(公告)日：2013-12-31
申请号：US12237968
申请日：2008-09-25
申请人： Ivan Nikitin , Joachim Mahler
发明人： Ivan Nikitin , Joachim Mahler
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/29 , H01L23/28 , H01L21/00 , H01L21/4763
CPC分类号： H01L23/3121 , H01L21/4846 , H01L23/3185 , H01L23/49861 , H01L23/5384 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/16 , H01L2224/24051 , H01L2224/24226 , H01L2224/32225 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/0106 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device includes a carrier and a first chip attached to the carrier. The semiconductor device includes a sintered insulation material over at least a portion of the carrier and the first chip.
摘要翻译：半导体器件包括载体和连接到载体的第一芯片。半导体器件包括在载体和第一芯片的至少一部分上的烧结绝缘材料。

104. 发明授权

US08569109B2 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module 有权
标题翻译：用于将金属表面附着到载体的方法，将芯片附接到芯片载体的方法，芯片封装模块和封装模块
公开(公告)号：US08569109B2
公开(公告)日：2013-10-29
申请号：US13172989
申请日：2011-06-30
申请人： Manfred Mengel , Joachim Mahler , Khalil Hosseini , Horst Theuss
发明人： Manfred Mengel , Joachim Mahler , Khalil Hosseini , Horst Theuss
IPC分类号： H01L21/50 , H01L23/48
CPC分类号： C23C24/04 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/83 , H01L2224/03416 , H01L2224/03505 , H01L2224/04026 , H01L2224/05551 , H01L2224/27332 , H01L2224/27505 , H01L2224/29198 , H01L2224/3201 , H01L2224/32225 , H01L2224/32503 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83205 , H01L2224/83365 , H01L2224/83385 , H01L2224/8384 , H01L2224/8385 , H01L2924/01327 , H01L2924/351 , Y10T29/49886 , Y10T428/249994 , H01L2924/00 , H01L2924/00012
摘要： A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.
摘要翻译：提供了将金属表面附着到载体上的方法，所述方法包括：在载体的金属表面和侧面中的至少一个上沉积多孔层; 以及通过将材料引入所述多孔层的孔中，将所述载体的金属表面和所述载体的所述至少一个附着到所述多孔层上，导致所述材料在所述金属表面和所述载体之间形成互连。

105. 发明申请

US20130249069A1 CIRCUIT PACKAGE, AN ELECTRONIC CIRCUIT PACKAGE, AND METHODS FOR ENCAPSULATING AN ELECTRONIC CIRCUIT 审中-公开
标题翻译：电路封装，电子电路封装以及封装电子电路的方法
公开(公告)号：US20130249069A1
公开(公告)日：2013-09-26
申请号：US13425589
申请日：2012-03-21
申请人： Khalil Hosseini , Joachim Mahler , Edward Fuergut
发明人： Khalil Hosseini , Joachim Mahler , Edward Fuergut
IPC分类号： H01L23/495 , H05K1/02 , H05K3/30 , H01L21/56
CPC分类号： H01L23/051 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L24/96 , H01L2224/04105 , H01L2224/27318 , H01L2224/2732 , H01L2224/2745 , H01L2224/291 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/32245 , H01L2224/331 , H01L2224/33181 , H01L2224/753 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83801 , H01L2224/8384 , H01L2224/83851 , H01L2224/96 , H01L2924/01327 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , Y10T29/49146 , H01L2924/00 , H01L2924/014 , H01L2924/00014 , H01L2224/83
摘要： A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.
摘要翻译：提供电路封装，电路封装包括：电子电路; 靠近电子电路的金属块; 电子电路与金属块之间的封装材料; 与所述电子电路的第一侧上的至少一个第一接触电接触的第一金属层结构; 与所述电子电路的第二侧上的至少一个第二接触电接触的第二金属层结构，其中所述第二侧与所述第一侧相对; 其中所述金属块通过导电介质与所述第一金属层结构和所述第二金属层结构电接触; 并且其中所述导电介质包括不同于所述第一和第二金属层结构的材料的材料或具有不同于所述第一和第二金属层结构的材料的材料结构。

106. 发明申请

US20130134589A1 CHIP-PACKAGE AND A METHOD FOR FORMING A CHIP-PACKAGE 有权
标题翻译：芯片封装和形成芯片封装的方法
公开(公告)号：US20130134589A1
公开(公告)日：2013-05-30
申请号：US13304795
申请日：2011-11-28
申请人： Manfred Mengel , Thomas Wowra , Joachim Mahler , Khalil Hosseini
发明人： Manfred Mengel , Thomas Wowra , Joachim Mahler , Khalil Hosseini
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L23/3677 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/82039 , H01L2224/82101 , H01L2224/96 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/18162 , H01L2924/00 , H01L2224/82 , H01L2924/00014
摘要： A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in electrical connection with a chip back side; an insulation material including: a first insulation portion formed over a first chip lateral side; a second insulation portion formed over a second chip lateral side, wherein the first chip lateral side and the second chip lateral side each abuts opposite edges of the chip back side; and a third insulation portion formed over at least part of a chip front side, the chip front side including one or more electrical contacts formed within the chip front side; wherein at least part of the first insulation portion is arranged over the chip-carrier side and wherein the first insulation portion is configured to extend in a direction perpendicular to the first chip lateral side further than the chip-carrier.
摘要翻译：芯片组包括芯片载体，芯片载体被配置为承载芯片，芯片布置在芯片载体侧上，其中芯片载体侧被配置为与芯片背面电连接; 绝缘材料，包括：形成在第一芯片侧面上的第一绝缘部分; 形成在第二芯片侧面上的第二绝缘部，其中所述第一芯片侧面和所述第二芯片侧面各自邻接所述芯片背面的相对边缘; 以及第三绝缘部分，形成在芯片前侧的至少一部分上，所述芯片前侧包括形成在所述芯片前侧内的一个或多个电触头; 其中所述第一绝缘部分的至少一部分布置在所述芯片载体侧上，并且其中所述第一绝缘部分被配置为在垂直于所述第一芯片横向侧的方向上比所述芯片载体更远。

107. 发明申请

US20130120940A1 HOUSING FOR A CHIP ARRANGEMENT AND A METHOD FOR FORMING A HOUSING 有权
标题翻译：用于芯片布置的住房和形成住房的方法
公开(公告)号：US20130120940A1
公开(公告)日：2013-05-16
申请号：US13295134
申请日：2011-11-14
申请人： Stefan Landau , Joachim Mahler
发明人： Stefan Landau , Joachim Mahler
IPC分类号： H05K7/20 , H05K5/00 , H01S4/00
CPC分类号： H01L23/10 , H01L23/055 , H01L23/145 , H01L23/36 , H01L23/49811 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： A housing for a chip arrangement is provided, the housing including: a carrier including a first carrier side configured to receive a chip arrangement, a second carrier side and one or more through-holes extending from the first carrier side to the second carrier side; at least one electrical connector inserted through a through-hole, the at least one electrical connector arranged to extend from the second carrier side to the first carrier side; wherein the at least one electrical connector may include: a first portion on the first carrier side; a second portion on the first carrier side, wherein the first portion is configured to extend away from the first carrier side at an angle to the second portion; and a third portion on the second carrier side, wherein the third portion is configured to extend away from the second carrier side at an angle to the second portion.
摘要翻译：提供了一种用于芯片布置的壳体，所述壳体包括：载体，包括构造成容纳芯片布置的第一载体侧，第二载体侧和从所述第一载体侧延伸到所述第二载体侧的一个或多个通孔; 插入穿过通孔的至少一个电连接器，所述至少一个电连接器布置成从第二载体侧延伸到第一载体侧; 其中所述至少一个电连接器可以包括：第一载体侧的第一部分; 在所述第一载体侧上的第二部分，其中所述第一部分被构造成与所述第二部分成一角度地延伸离开所述第一载体侧; 以及在所述第二载体侧上的第三部分，其中所述第三部分构造成与所述第二部分成角度地延伸离开所述第二载体侧。

108. 发明申请

US20130113114A1 Device Including Two Power Semiconductor Chips and Manufacturing Thereof 有权
标题翻译：包括两个功率半导体芯片及其制造的器件
公开(公告)号：US20130113114A1
公开(公告)日：2013-05-09
申请号：US13289667
申请日：2011-11-04
申请人： Khalil Hosseini , Manfred Mengel , Joachim Mahler , Franz-Peter Kalz
发明人： Khalil Hosseini , Manfred Mengel , Joachim Mahler , Franz-Peter Kalz
IPC分类号： H01L23/52 , H01L21/60
CPC分类号： H01L24/83 , H01L23/051 , H01L23/3107 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/33 , H01L2224/0603 , H01L2224/32245 , H01L2224/33181 , H01L2224/83801 , H01L2224/8382 , H01L2224/8384 , H01L2224/8385 , H01L2924/01327 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the first face. The first contact pad is an external contact pad. The device further includes a first contact clip attached to the second face of the first power semiconductor chip. A second power semiconductor chip is attached to the first contact clip, and a second contact clip is attached to the second power semiconductor chip.
摘要翻译：一种器件包括第一功率半导体芯片，其具有第一面和与第一面相对的第二面，第一接触垫布置在第一面上。第一接触垫是外部接触垫。该装置还包括附接到第一功率半导体芯片的第二面的第一接触夹。第二功率半导体芯片附接到第一接触夹，第二接触夹附接到第二功率半导体芯片。

109. 发明授权

US08362617B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08362617B2
公开(公告)日：2013-01-29
申请号：US12113282
申请日：2008-05-01
申请人： Ivan Nikitin , Joachim Mahler
发明人： Ivan Nikitin , Joachim Mahler
IPC分类号： H01L23/48
CPC分类号： H01L25/16 , H01L23/49517 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82007 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01047 , H01L2924/0106 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/00
摘要： One embodiment provides a semiconductor device including a carrier, a first chip attached to the carrier, a structured dielectric coupled to the chip and to the carrier, and a conducting element electrically connected with the chip and extending over a portion of the structured dielectric. The conducting element includes a sintered region.
摘要翻译：一个实施例提供了一种半导体器件，其包括载体，附接到载体的第一芯片，耦合到芯片和载体的结构化介质，以及与芯片电连接并延伸到结构化电介质的一部分上的导电元件。导电元件包括烧结区域。

110. 发明申请

US20130001803A1 METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE 有权
标题翻译：用于将金属表面连接到载体的方法，用于将芯片连接到芯片载体的方法，芯片包装模块和包装模块
公开(公告)号：US20130001803A1
公开(公告)日：2013-01-03
申请号：US13172989
申请日：2011-06-30
申请人： Manfred Mengel , Joachim Mahler , Khalil Hosseini , Horst Theuss
发明人： Manfred Mengel , Joachim Mahler , Khalil Hosseini , Horst Theuss
IPC分类号： H01L23/48 , B23P25/00 , B32B3/26 , H01L21/50
CPC分类号： C23C24/04 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/83 , H01L2224/03416 , H01L2224/03505 , H01L2224/04026 , H01L2224/05551 , H01L2224/27332 , H01L2224/27505 , H01L2224/29198 , H01L2224/3201 , H01L2224/32225 , H01L2224/32503 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83205 , H01L2224/83365 , H01L2224/83385 , H01L2224/8384 , H01L2224/8385 , H01L2924/01327 , H01L2924/351 , Y10T29/49886 , Y10T428/249994 , H01L2924/00 , H01L2924/00012
摘要： A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.
摘要翻译：提供了将金属表面附着到载体上的方法，所述方法包括：在载体的金属表面和侧面中的至少一个上沉积多孔层; 以及通过将材料引入所述多孔层的孔中，将所述载体的金属表面和所述载体的所述至少一个附着到所述多孔层上，导致所述材料在所述金属表面和所述载体之间形成互连。

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