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    • 101. 发明授权
    • Dewing-trouble-prevented water-proof connector
    • 防雨防水连接器
    • US5800195A
    • 1998-09-01
    • US653477
    • 1996-05-24
    • Takayoshi EndoKazuhisa IshizakiSatoshi YamadaMitsuhiro Matsumoto
    • Takayoshi EndoKazuhisa IshizakiSatoshi YamadaMitsuhiro Matsumoto
    • H01R13/42H01R13/52
    • H01R13/5221
    • In a dewing-trouble-prevented water-proof connector assembly, its male connector is engaged with its female connector in such a manner that the front end portion of the inner housing of the male connector is engaged with the front end portion of the inner housing of the female connector in such a manner that the inner cylindrical surface of the front end portion of the male connector covers the outer cylindrical surface of the front end portion of the female connector, and the front end portion of the outer housing of the male connector is engaged with the front end portion of the outer housing of the female connector in such a manner that the front end portion of the outer housing of the male connector covers the front end portion of the outer housing of the female connector. In the connector assembly, an inner packing which is set in close contact with the inner cylindrical surface of the front end portion of the inner housing of the male connector is mounted on the outer cylindrical surface of the inner housing of the female connector, while an outer packing which is set in close contact with the inner cylindrical surface of the outer housing of the male connector is mounted on the outer cylindrical surface of the outer housing of the female connector.
    • 在防止排水故障的防水连接器组件中,其阳连接器与其阴连接器接合,使得阳连接器的内壳的前端部与内壳体的前端部接合 阴连接器的前端部的内圆筒面覆盖阴连接器的前端部的外圆筒形表面,并且阳连接器的外壳的前端部分 与阴连接器的外壳体的前端部分接合,使得阳连接器的外壳体的前端部分覆盖阴连接器的外壳体的前端部分。 在连接器组件中,与阴连接器的内壳体的前端部的内圆柱表面紧密接触的内部衬垫安装在阴连接器的内壳体的外圆柱表面上,而 与阳连接器的外壳体的内圆柱表面紧密接触的外包装安装在阴连接器的外壳体的外圆柱表面上。
    • 103. 发明授权
    • Semiconductor laser element and method for adjusting self-induced
oscillation intensity of the same
    • 半导体激光元件及其调节自身振荡强度的方法
    • US5592502A
    • 1997-01-07
    • US327452
    • 1994-10-21
    • Mitsuhiro MatsumotoKen Ohbayashi
    • Mitsuhiro MatsumotoKen Ohbayashi
    • H01S5/00H01S5/065H01S5/068H01S5/20H01S5/22H01S5/223H01S5/323H01S3/18
    • H01S5/2231H01S5/0658H01S5/2004H01S5/221H01S5/2232H01S5/32316
    • A semiconductor laser element includes: a semiconductor laminated structure for emitting a laser light, including an active layer interposed between a first cladding layer of a first-conductivity type and a second cladding layer of a second-conductivity type, the first cladding layer and the semiconductor layer having lower refractive indices than that of the active layer; and a current light confining means including a stripe-shaped semiconductor layer of the second-conductivity type formed on a surface of the second cladding layer on a side opposite to the active layer, for confining a laser driving current and the laser light in a region of the active layer corresponding to the stripe-shaped semiconductor layer, wherein the refractive index of the first cladding layer is larger than that of the second cladding layer in the semiconductor laminated structure, and the semiconductor laminated structure includes at least one semiconductor layer of the first-conductivity type having a lower refractive index than that of the first cladding layer, disposed between the first cladding layer and the active layer.
    • 半导体激光元件包括:发射激光的半导体层叠结构,包括介于第一导电类型的第一包层和第二导电类型的第二包层之间的有源层,第一包层和 半导体层的折射率低于有源层的折射率; 以及电流限制装置,包括在与有源层相反的一侧形成在第二包层的表面上的第二导电类型的条形半导体层,用于将激光驱动电流和激光限制在区域 所述半导体层叠结构中的所述第一包覆层的折射率比所述第二包层的折射率大,所述半导体层叠结构具有至少一个所述半导体层叠结构的半导体层, 第一导电型,其具有比第一包层更低的折射率,设置在第一包层和有源层之间。
    • 109. 发明授权
    • Method for the production of an optical phase-shifting board
    • 光学相移板的制造方法
    • US4780175A
    • 1988-10-25
    • US113003
    • 1987-10-26
    • Mototaka TaneyaMitsuhiro MatsumotoSadayoshi Matsui
    • Mototaka TaneyaMitsuhiro MatsumotoSadayoshi Matsui
    • G02B5/18G02B6/42H01S5/022B44C1/22C03C15/00C03C25/06
    • G02B6/4249G02B5/1871H01S5/005H01S5/02248
    • A method for the production of an optical phase-shifting board comprising laying two or more layer-elements with different etching rates therebetween upon a substrate and then subjecting the substrate to an etching treatment so as to remove given portions of the layer-element with the highest etching rate that is disposed on the top of the layer-elements, resulting in the optical phase-shifting board, and a method for the fixation of the optical phase-shifting board to the stem comprising disposing molten light-sensitive or thermosetting resin in or on a guiding rail of the stem positioned in front of the light-emitting face of a semiconductor laser device, placing the optical phase-shifting board in or on the guiding rail of the stem, sliding the optical phase-shifting board in or on the guiding rail along the guiding rail while the far-field pattern of the semiconductor laser device is being monitored, stopping the sliding of the optical phase-shifting board in or on the guiding rail at the position where the far-field pattern conforms to a desired pattern, and curing the molten resin in or on the guiding rail to fix the optical phase-shifting board to the stem at said position.
    • 一种用于制造光学相移板的方法,包括在衬底上铺设两个或更多个具有不同蚀刻速率的层元件,然后对衬底进行蚀刻处理,以便除去所述层元件的给定部分, 设置在层元件顶部的最高蚀刻速率,产生光学相移板,以及用于将光学相变板固定到杆的方法,包括将熔融的光敏或热固性树脂置于 或者在位于半导体激光装置的发光面前方的杆的导轨上,将光学相移板放置在杆的导轨中或导杆上,将光学相移板滑入或插入 沿着导轨的导轨,同时监视半导体激光装置的远场图案,停止光导相移板在导轨中或导轨上的滑动 在远场图案符合期望图案的位置处,并且使导轨内或上的熔融树脂固化,以将光学相变板固定在所述位置处的杆上。
    • 110. 发明授权
    • Semiconductor laser array device
    • 半导体激光阵列器件
    • US4764937A
    • 1988-08-16
    • US893226
    • 1986-08-05
    • Mitsuhiro MatsumotoSadayoshi MatsuiMototaka TaneyaHidenori Kawanishi
    • Mitsuhiro MatsumotoSadayoshi MatsuiMototaka TaneyaHidenori Kawanishi
    • H01S5/00H01S5/40H01S3/19
    • H01S5/4068
    • A semiconductor laser array device comprising two or more array portions, which are composed of a plurality of main parallel waveguides with an optical phase coupling in between, and one or more branching portions, each of which is positioned between the array portions and which are composed of two branching waveguides branching symmetrically with regard to the main waveguide direction from each of the main parallel waveguides of the array portions, each of the two branching waveguides positioned at the outer sides of each of the branching portions being disconnected with the adjacent branching waveguides and the other branching waveguides from the main parallel waveguides of one of the array portions being optically connected with the corresponding branching waveguides from the main parallel waveguides of the adjacent array portion.
    • 一种半导体激光器阵列器件,包括两个或更多个阵列部分,所述阵列部分由多个主平行波导组成,所述多个主平行波导之间具有光学相位耦合,以及一个或多个分支部分,每个分支部分位于阵列部分之间, 从阵列部分的每个主平行波导相对于主波导方向对称地分支的两个分支波导,位于每个分支部分的外侧的两个分支波导中的每一个分别与相邻的分支波导断开, 来自阵列部分之一的主平行波导的其它分支波导与相邻阵列部分的主平行波导的相应分支波导光学连接。