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91. 发明授权

US09490184B2 Light emitting device and manufacturing method thereof 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US09490184B2
公开(公告)日：2016-11-08
申请号：US14802095
申请日：2015-07-17
申请人： NICHIA CORPORATION
发明人： Tadaaki Miyata
IPC分类号： H01L33/00 , H01L21/66 , H01L33/08 , H01L33/46 , H01L33/48 , H01L33/56 , H01L33/50 , H01L25/075 , H01L33/54 , H01L33/62 , H05K3/22 , H05K3/28
CPC分类号： H01L22/22 , H01L25/0753 , H01L33/005 , H01L33/08 , H01L33/46 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/0025 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H05K3/225 , H05K3/284 , H05K2201/10106 , H01L2924/00
摘要： The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains alter removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.
摘要翻译：发光装置具有安装在基板上的一个或多个布线图案上的多个发光元件。替代有缺陷的元件的新的发光元件安装在安装有缺陷元件的相同布线图案上。缺陷元件或仍然改变去除缺陷元件的痕迹被新的发光元件密封的相同的密封构件密封。

92. 发明申请

US20160295703A1 RAPID PROTOTYPE EXTRUDED CONDUCTIVE PATHWAYS 审中-公开
公开(公告)号：US20160295703A1
公开(公告)日：2016-10-06
申请号：US15187836
申请日：2016-06-21
申请人： Savannah River Nuclear Solutions, LLC
发明人： John Thomas Bobbitt, III
IPC分类号： H05K3/10 , H05K3/12 , H05K3/22 , H05K1/09 , H05K1/02 , H05K3/00 , H05K3/14
CPC分类号： H05K3/10 , B29C64/106 , B29C64/112 , B29C64/124 , B29C64/135 , B29C64/153 , B29C64/165 , B29C67/0055 , B29C67/0059 , B29C67/0062 , B29C67/0066 , B29C67/0077 , B29C67/0081 , B29C70/885 , B33Y40/00 , B33Y80/00 , B82Y30/00 , H01R43/00 , H05K1/0284 , H05K1/09 , H05K3/0014 , H05K3/12 , H05K3/125 , H05K3/14 , H05K3/22 , H05K2203/013 , H05K2203/107 , Y10S977/734 , Y10S977/742
摘要： A process of producing electrically conductive pathways within additively manufactured parts and similar parts made by plastic extrusion nozzles. The process allows for a three-dimensional part having both conductive and non-conductive portions and allows for such parts to be manufactured in a single production step.

93. 发明申请

US20160287883A1 ENCAPSULATED FILTERED FEEDTHROUGH FOR IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：用于可植入医疗器械的封装过滤器
公开(公告)号：US20160287883A1
公开(公告)日：2016-10-06
申请号：US15080122
申请日：2016-03-24
申请人： Cardiac Pacemakers, Inc.
发明人： Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC分类号： A61N1/375 , H05K5/02 , H01G4/35 , H05K3/22 , H03H3/00 , H05K3/30 , H05K3/10 , H05K1/02 , H03H7/01
CPC分类号： A61N1/3754 , H01G4/35 , H03H3/00 , H03H7/17 , H05K1/0213 , H05K1/184 , H05K3/10 , H05K3/22 , H05K3/284 , H05K3/303 , H05K5/0247 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
摘要： An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
摘要翻译：一种用于可植入医疗装置的封装过滤的馈通组件，其包括套圈，耦合到套圈的电绝缘体，印刷电路板（PCB），延伸穿过电绝缘体和PCB的馈通导体以及耦合到PCB的电容器。封装过滤的馈通组件可以包括限定开口并且相对于印刷电路板定位的模具，使得电容器的至少一部分位于开口内。第一非导电材料可以对电容器进行底部填充，并且第二非导电材料可以回填到模具中以封装电容器。

94. 发明申请

US20160278219A1 ELECTRONIC-CIRCUIT UNIT AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电子电路单元及其制造方法
公开(公告)号：US20160278219A1
公开(公告)日：2016-09-22
申请号：US15163978
申请日：2016-05-25
申请人： YAZAKI CORPORATION
发明人： Ken Ito
IPC分类号： H05K5/00 , H05K3/22 , H05K5/02
CPC分类号： H05K5/0034 , H05K3/22 , H05K3/284 , H05K5/0226 , H05K5/0239 , H05K5/0247 , H05K2201/09736 , H05K2201/09781 , H05K2201/0989 , H05K2201/09972 , H05K2201/2009 , H05K2203/1316 , H05K2203/1327
摘要： An electronic circuit unit in which a mold exclusion part, having a rear surface side covered by mold resin and a front surface side exposed from an outer case, is provided at a part of a plate surface of a circuit board which is mounted with electronic components and is covered by the outer case formed by the mold resin. The outer case is multi-material molded using plural kinds of resin having different fluidities. A rear wall of the outer case located on the rear surface side of the mold exclusion part is made of one of the plural kinds of the resin having a fluidity higher than a fluidity of another one of the plural kinds of the resin constituting the other portion of the outer case.
摘要翻译：一种电子电路单元，其具有被模制树脂覆盖的后表面侧和从外壳暴露的前表面侧的模具排除部分设置在安装有电子部件的电路板的板表面的一部分处并被由模制树脂形成的外壳覆盖。外壳使用具有不同流动性的多种树脂进行多材料成型。位于模具排除部的后表面侧的外壳的后壁由构成另一部分的多种树脂中的另一种的流动性高于多种树脂的多种树脂中的一种制成的外壳。

95. 发明授权

US09437489B2 Method of manufacturing a wiring substrate 有权
标题翻译：制造布线基板的方法
公开(公告)号：US09437489B2
公开(公告)日：2016-09-06
申请号：US14095182
申请日：2013-12-03
申请人： Seiko Epson Corporation
发明人： Tsuyoshi Yoda
IPC分类号： H01L21/768 , H05K3/40 , H05K3/22 , H05K3/32 , H05K3/42 , H05K3/46 , B81B7/00 , G01C19/56 , G01C19/5776 , H01L23/48
CPC分类号： H01L21/76898 , B81B7/0006 , B81B2201/0242 , B81B2201/0271 , G01C19/56 , G01C19/5776 , H01L21/76877 , H01L23/481 , H01L2924/00 , H01L2924/0002 , H05K3/225 , H05K3/321 , H05K3/4038 , H05K3/429 , H05K3/462 , Y10T29/49126 , Y10T29/49128 , Y10T29/49139
摘要： A method of manufacturing a wiring substrate including a step of forming a through hole that includes forming a first concave portion in a substrate that extends from a second surface to a first insulating layer without passing through the first insulating layer; forming a second insulating layer at least within the first concave portion; and forming a second concave portion through the second insulating layer and the first insulating layer to expose a surface of a pad electrode, wherein the second concave portion is formed within the first concave portion; and filling the first concave portion and the second concave portion with a conductive body or forming the conductive body to coat inner walls of the first concave portion and the second concave portion, and forming the through electrode such that it is connected to the pad electrode.
摘要翻译：一种制造布线基板的方法，包括形成通孔的步骤，所述通孔包括在不通过所述第一绝缘层的情况下从第二表面延伸到第一绝缘层的基板中形成第一凹部; 至少在所述第一凹部内形成第二绝缘层; 以及通过所述第二绝缘层和所述第一绝缘层形成第二凹部以暴露焊盘电极的表面，其中所述第二凹部形成在所述第一凹部内; 并且用导电体填充第一凹部和第二凹部，或者形成导电体以涂覆第一凹部和第二凹部的内壁，并且形成贯通电极，使其与焊盘电极连接。

96. 发明申请

US20160242296A1 Additive Fabrication of Single and Multi-Layer Electronic Circuits 审中-公开
标题翻译：单层和多层电子电路的添加制造
公开(公告)号：US20160242296A1
公开(公告)日：2016-08-18
申请号：US15047350
申请日：2016-02-18
申请人： Optomec, Inc.
发明人： Francesco Edward DeAngelis
IPC分类号： H05K3/00 , H05K3/46 , H05K3/22 , H05K3/30 , H05K13/04 , H05K3/10 , H05K3/40
CPC分类号： H05K3/0005 , B33Y80/00 , H05K1/16 , H05K1/185 , H05K3/12 , H05K3/4644
摘要： A method and apparatus for the additive fabrication of single and multi-layer electronic circuits by using directed local deposition of conductive, insulating, and/or dielectric materials to build circuit layers incorporating conductive, insulating and/or dielectric features, including inter-layer vias and embedded electronic components. Different conductive, insulating, and/or dielectric materials can be deposited at different points in the circuit such that any section of the circuit may be tailored for specific electrical, thermal, or mechanical properties. This enables more geometric and spatial flexibility in electronic circuit implementation, which optimizes the use of space such that more compact circuits can be manufactured.
摘要翻译：一种用于通过使用导电，绝缘和/或介电材料的定向局部沉积来构建单个和多层电子电路的附加制造以构建结合导电，绝缘和/或电介质特征的电路层（包括层间通孔）的方法和装置和嵌入式电子元件。可以在电路中的不同点沉积不同的导电，绝缘和/或介电材料，使得电路的任何部分可以针对特定的电，热或机械性质而定制。这使得电子电路实现中的更多的几何和空间灵活性，这优化了空间的使用，使得可以制造更紧凑的电路。

97. 发明申请

US20160229184A1 METHOD FOR PRODUCING LIQUID-EJECTION-HEAD SUBSTRATE AND LIQUID-EJECTION-HEAD SUBSTRATE PRODUCED BY THE SAME 有权
标题翻译：用于生产液相喷射头基板和由其生产的液体喷射头基板的方法
公开(公告)号：US20160229184A1
公开(公告)日：2016-08-11
申请号：US15013780
申请日：2016-02-02
申请人： CANON KABUSHIKI KAISHA
发明人： Satoshi Ibe , Keiji Watanabe , Junya Hayasaka , Shiro Sujaku , Kouji Hasegawa
IPC分类号： B41J2/16 , H05K3/36 , B41J2/14 , H05K3/22
CPC分类号： B41J2/1607 , B41J2/14072 , B41J2/14201 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14491 , H05K3/361
摘要： A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
摘要翻译：一种液体喷射头基板的制造方法，其特征在于，提供具有能量产生元件和垫的基板，所述焊盘包括布线层，所述焊盘中的布线层具有相对厚的部分和相对薄的部分，并执行通过将接触探针施加到衬垫中的布线层的相对薄的部分进行电检查。

98. 发明申请

US20160170447A1 HIGHLY STRETCHABLE INTERCONNECT DEVICES AND SYSTEMS 审中-公开
标题翻译：高度可互连的互连设备和系统
公开(公告)号：US20160170447A1
公开(公告)日：2016-06-16
申请号：US14839933
申请日：2015-08-29
申请人： Washington State University
发明人： lndranath Dutta , Rahul Panat
IPC分类号： G06F1/16 , H05K1/03 , H05K3/46 , H05K3/14 , H05K3/22 , H05K1/02 , H05K1/09
CPC分类号： B22F3/1055 , B22F2003/1058 , B33Y10/00 , B33Y50/02 , G06F1/163 , H01F27/24 , H01F27/2804 , H01F41/0206 , H01F41/046 , H01G4/1218 , H01P11/001 , H05K1/028 , H05K1/0283 , H05K1/0296 , H05K1/0298 , H05K1/0313 , H05K1/0393 , H05K1/09 , H05K3/14 , H05K3/22 , H05K3/4644 , H05K2201/0162 , H05K2203/0522
摘要： Techniques for forming highly stretchable electronic interconnect devices are disclosed herein. In one embodiment, a method of fabricating an electronic interconnect device includes forming a layer of an adhesion material onto a surface of a substrate material capable of elastic and/or plastic deformation. The formed layer of the adhesion material has a plurality of adhesion material portions separated from one another on the surface of the substrate material. The method also includes depositing a layer of an interconnect material onto the formed layer of the adhesion material. The deposited interconnect material has regions that are not bonded or loosely bonded to corresponding regions of the substrate material, such that the interconnect material may be deformed more than the adhesion material attached to the substrate material. In certain embodiments, the interconnect material can also include a plurality of wrinkles on a surface facing away from the substrate material.
摘要翻译：本文公开了用于形成高度可拉伸的电子互连装置的技术。在一个实施例中，制造电子互连装置的方法包括在能够弹性和/或塑性变形的基底材料的表面上形成粘合材料层。粘合材料的形成层具有在基材表面上彼此分离的多个粘合材料部分。该方法还包括将互连材料层沉积到粘合材料的形成层上。沉积的互连材料具有未被结合或松散地结合到衬底材料的相应区域的区域，使得互连材料可能比附着到衬底材料的粘附材料变形更多。在某些实施例中，互连材料还可以包括在背离衬底材料的表面上的多个皱纹。

99. 发明授权

US09351409B2 Method of manufacturing a thin support package structure 有权
标题翻译：制造薄支撑包装结构的方法
公开(公告)号：US09351409B2
公开(公告)日：2016-05-24
申请号：US13960123
申请日：2013-08-06
申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.
发明人： Hsueh-Ping Chien , Jun-Chung Hsu
IPC分类号： H05K3/00 , H05K3/40 , H05K3/46 , H05K3/22
CPC分类号： H05K3/4682 , H05K3/007 , H05K3/22 , H05K2201/2009 , H05K2203/0165 , H05K2203/0169 , H05K2203/162
摘要： A method of manufacturing a thin support package structure includes the steps of: preparing a support plate formed with a plurality of grooves adjacent to an outer rim thereof, forming a releasing material layer on the support plate; forming a first circuit layer on the releasing material layer so as to form a thin circuit board; forming a dielectric layer on the releasing material layer; forming a plurality of openings in the dielectric layer; forming a second circuit layer on the dielectric layer; forming connection plugs by filling the openings; forming a solder mask on the dielectric layer; forming a plurality of notches on the lower surface of the support plate to communicate with the grooves, respectively; and removing the central part of the support plate between the notches and the central part of the releasing material layer on the support plate.
摘要翻译：制造薄支撑包装结构的方法包括以下步骤：制备形成有与其外缘相邻的多个槽的支撑板，在支撑板上形成释放材料层; 在所述释放材料层上形成第一电路层以形成薄电路板; 在释放材料层上形成介电层; 在介电层中形成多个开口; 在所述电介质层上形成第二电路层; 通过填充开口形成连接插头; 在电介质层上形成焊料掩模; 在所述支撑板的下表面上分别形成多个凹槽以与所述凹槽连通; 并且在支撑板上的切口和释放材料层的中心部分之间移除支撑板的中心部分。

100. 发明申请

US20160133553A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20160133553A1
公开(公告)日：2016-05-12
申请号：US14936053
申请日：2015-11-09
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Sung Yeol PARK
IPC分类号： H01L23/498 , H05K3/22 , H01L21/768 , H05K3/06
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/49866 , H01L23/49894 , H01L2224/11 , H05K3/244 , H05K2201/09745 , H05K2201/099 , H05K2203/107
摘要： A printed circuit board includes: an insulation layer including circuit patterns, the circuit patterns having a groove formed therein; a metal protection layer (disposed in the groove; a solder resist layer disposed on the insulation layer and having an opening exposing the circuit patterns; and a solder bump disposed on the opening.
摘要翻译：印刷电路板包括：包括电路图案的绝缘层，其中形成有凹槽的电路图案; 金属保护层（设置在凹槽中;阻焊层设置在绝缘层上并具有露出电路图案的开口;以及设置在开口上的焊料凸块。

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