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    • 93. 发明授权
    • Method and device for regenerating tin-plating solutions
    • 镀锡溶液再生方法及装置
    • US6120673A
    • 2000-09-19
    • US74725
    • 1998-05-07
    • Ulrich ReiterWerner HarnischmacherKlaus FischwasserHans-Wilhelm LieberRalph BlittersdorfAnnette Heuss
    • Ulrich ReiterWerner HarnischmacherKlaus FischwasserHans-Wilhelm LieberRalph BlittersdorfAnnette Heuss
    • B01D61/44C02F1/461C02F1/469C23C18/16C25D21/22C25C1/14
    • C23C18/1617C25D21/22Y10S204/13
    • The invention relates to a method and a device for regenerating exhausted tin-plating solutions which contain tin and copper ions, free complexing agent and complexing agent bound to the copper ions, as well as expended and unexpended reducing agent. By means of a suitable rinsing technique, the rinse water of the tin-plating process is concentrated to a 10 to 15 percent dilution of the process solution. The regenerating solution thus produced is fed to an electrolytic cell. The electrolytic cell comprises a cathode chamber, a middle chamber and an anode chamber. The cathode chamber is separated from the middle chamber by an anion-exchange membrane and the anode chamber is separated from the middle chamber by a cation-exchange membrane. The regenerating solution is initially provided in the cathode chamber. Here, the interfering copper component is cathodically deposited. After an appropriate residence time, the regenerating solution, depleted of copper, is transferred by pumping into the middle chamber where tin enrichment is effected by tin ions diffused from the anode chamber through the cation-exchange membrane. The regenerated solution is subsequently fed back into the tin-plating process.
    • 本发明涉及一种用于再生含有锡和铜离子的排出的镀锡溶液的方法和装置,与铜离子结合的游离络合剂和络合剂,以及消耗和未用的还原剂。 通过合适的冲洗技术,将镀锡工艺的冲洗水浓缩至工艺溶液的10至15%稀释度。 将这样制作的再生溶液送入电解槽。 电解槽包括阴极室,中间室和阳极室。 阴极室通过阴离子交换膜与中间室分离,阳极室通过阳离子交换膜与中间室分离。 再生溶液最初设置在阴极室中。 这里,干扰铜组分被阴极沉积。 在适当的停留时间之后,通过泵送进入中间室来转移耗尽铜的再生溶液,其中通过阳离子交换膜从阳极室扩散的锡离子进行锡富集。 再生的溶液随后被反馈到镀锡过程中。
    • 97. 发明授权
    • Hydrogen assisted reduced oxide soldering system
    • 氢辅助还原氧化物焊接系统
    • US5411645A
    • 1995-05-02
    • US109136
    • 1993-08-19
    • D. Morgan Tench
    • D. Morgan Tench
    • C25C3/24B23K1/20B23K35/38C23C18/16C23G1/36C25C1/00C25C1/14C25C3/36C25D21/18C25F7/00
    • B23K1/206B23K35/38C23C18/1617C23G1/36C25D21/18B23K2201/42
    • A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components to be soldered in a fluxless soldering process. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode, which may evolve hydrogen gas. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte. Ideally, the anodic reaction is breakdown of water to form oxygen, which is vented, and protons that migrate across the ionic barrier to the catholyte replacing protons consumed in the ancillary process. The overall reaction in a fluxless soldering system is reduction of metallic oxides to metal, electrochemical regeneration of reducing agents, release of oxygen, and evolution of hydrogen to produce a reducing atmosphere in an enclosed chamber containing the fluxless soldering system.
    • 提供了用于再生用于辅助化学或电化学过程中的还原剂的系统,例如在无焊剂焊接工艺中恢复要焊接的电子部件的可焊性。 该系统包括阴极,阳极和电解质系统,其由半透性离子屏障分离成阴极电解液和阳极电解液。 阴极电解质包括氧化还原对的还原成员,其可以电化学地再生。 电解液系统的氧化还原电极像电池一样充电并在辅助过程中放电。 在阴极处实现氧化还原对的还原成员的再生,这可能产生氢气。 化学平衡通过半透性离子屏障保持,这允许质子从阳极电解液迁移到阴极电解液,但是作为阻止阳离子从阴极电解液到阳极电解液的扩散和迁移的屏障。 理想地,阳极反应是水的分解以形成被排出的氧,以及迁移穿过离子屏障到阴极电解液的质子代替在辅助过程中消耗的质子。 无助焊剂系统中的总体反应是将金属氧化物还原为金属,还原剂的电化学再生,氧的释放和氢的释放,以在包含无助焊剂系统的封闭室中产生还原气氛。