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91. 发明申请

US20030002268A1 Ultra-low impedance power interconnection system for electronic packages 审中-公开
公开(公告)号：US20030002268A1
公开(公告)日：2003-01-02
申请号：US10036957
申请日：2001-12-20
发明人： Joseph Ted Dibene II , David H. Hartke , Carl E. Hoge , Edward J. Derian
IPC分类号： H05K001/11
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L23/433 , H01L2224/16 , H01L2224/16225 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15192 , H01L2924/15312 , H01L2924/19105 , H01L2924/3011 , H01R4/64 , H01R12/52 , H01R12/7088 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036
摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

92. 发明授权

US06490160B2 Vapor chamber with integrated pin array 有权
公开(公告)号：US06490160B2
公开(公告)日：2002-12-03
申请号：US09921153
申请日：2001-08-02
申请人： Joseph T. Dibene, II , Farhad Raiszadeh
发明人： Joseph T. Dibene, II , Farhad Raiszadeh
IPC分类号： H05K720
CPC分类号： H05K7/1092 , F28D15/0233 , F28D15/04 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L2924/0002 , H01L2924/15192 , H01R4/64 , H01R12/52 , H01R12/7088 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.

93. 发明申请

US20020144841A1 High current SMD jumper 审中-公开
标题翻译：大电流SMD跳线
公开(公告)号：US20020144841A1
公开(公告)日：2002-10-10
申请号：US10117863
申请日：2002-04-04
申请人： Bel-Fuse, Inc.
发明人： Guichao Hua , Yi Jiang
IPC分类号： H05K007/06
CPC分类号： H01R12/7088 , H01R31/08 , H05K3/222
摘要： An SMD jumper for connection to a conductive trace on a printed circuit board, includes a conductive jumper element having a cross-sectional area substantially greater than that of the trace and at least two conductive terminals for connecting the jumper element to the trace. A single jumper element may be used or the jumper element may include at least two conductive layers separated by an insulator layer.
摘要翻译：用于连接到印刷电路板上的导电迹线的SMD跳线包括导电跳线元件，其横截面积基本上大于轨迹的横截面面积，以及用于将跳线元件连接到轨迹的至少两个导电端子。可以使用单个跳线元件，或者跳线元件可以包括由绝缘体层隔开的至少两个导电层。

94. 发明授权

US06447309B1 Suppressing power bus bouncing in a hot-swappable system 有权
标题翻译：在热插拔系统中抑制电源总线反弹
公开(公告)号：US06447309B1
公开(公告)日：2002-09-10
申请号：US09735116
申请日：2000-12-12
申请人： Han Y. Ko , Robert C. Cyphers , Tomonori Hirai , Keith Y. Oka , Alan D. Martin
发明人： Han Y. Ko , Robert C. Cyphers , Tomonori Hirai , Keith Y. Oka , Alan D. Martin
IPC分类号： H02H720
CPC分类号： H01R12/7088
摘要： An apparatus for suppressing power bus bouncing in a hot-swappable system has been developed. The apparatus includes a connection module with three interior pins for: the power return; the power supply; and the system ground. The system ground pin is shorter than the other two so that it makes contact with the power bus after the bouncing from the return and supply pins has subsided.
摘要翻译：已经开发了用于在热插拔系统中抑制电力总线弹跳的装置。该装置包括具有三个内部引脚的连接模块，用于：功率返回; 电源; 和系统地面。系统接地引脚短于另外两个引脚，使得在返回和反馈引脚退回后，电源总线接触电源总线已经消退。

95. 发明申请

US20020123253A1 Low inductance connector 审中-公开
标题翻译：低电感连接器
公开(公告)号：US20020123253A1
公开(公告)日：2002-09-05
申请号：US09798349
申请日：2001-03-02
发明人： Forrest Sass
IPC分类号： H05K001/00
CPC分类号： H05K1/0231 , H01R12/7088 , H01R13/6625 , H05K1/142 , H05K1/162 , H05K3/36 , H05K2201/09672 , H05K2201/10643
摘要： An electrical connector for connecting a power source with a load wherein the connector has a pair of conducting members interconnecting the power source with the load and having insert apparatus inserted between the pair of conducting members and separated from inner surfaces thereof by dielectric material wherein the insert apparatus reduces the inductance of the connector by reducing a magnetic field between the pair of conducting members generated by current flow in the conductors and stores electrical energy within the connector.
摘要翻译：一种用于将电源与负载连接的电连接器，其中连接器具有将电源与负载相互连接的一对导电构件，并且插入装置插入在一对导电构件之间并且通过电介质材料与其内表面分离，其中插入件装置通过减少由导体中的电流产生的一对导电构件之间的磁场，并将电能存储在连接器内，来减小连接器的电感。

96. 发明申请

US20020062986A1 PRINTED CIRCUIT BOARD WITH BULLET CONNECTOR SOCKETS 有权
标题翻译：印刷电路板与BULLET连接器插座
公开(公告)号：US20020062986A1
公开(公告)日：2002-05-30
申请号：US09726364
申请日：2000-11-30
发明人： Darren Lopp , William Reuss , Gary Siegmund
IPC分类号： H05K001/00
CPC分类号： H01R12/585 , H01H1/5805 , H01H1/5866 , H01R12/7088
摘要： A printed circuit board having bushings attached thereto, the bushings having sockets for receiving bullet connectors on a circuit breaker.
摘要翻译：具有附接到其上的衬套的印刷电路板，衬套具有用于在断路器上接收子弹连接器的插座。

97. 发明申请

US20020049000A1 Battery connector 有权
标题翻译：电池连接器
公开(公告)号：US20020049000A1
公开(公告)日：2002-04-25
申请号：US09982428
申请日：2001-10-18
发明人： Kaoru Tanaka , Kazuaki Kodaira
IPC分类号： H01R024/00
CPC分类号： H01R12/7088 , H01R12/7005 , H01R12/716 , H01R24/60 , H01R2107/00 , H05K3/301
摘要： The invention relates to a battery connector equipped with an insulating housing. Contacts are attached to the housing and are soldered to a circuit board. Each of the contacts has a flat-plate-form base part and a pair of side wall parts that rise from both sides of the base part. A pair of contact arms extend, facing each other, from the side wall parts of the pair of side wall parts, and contact mating contacts. The bottom surface of the base part forms a soldering surface that is soldered to the circuit board. The invention increases the soldering strength of the contacts with respect to the circuit board so that separate reinforcing members are not required. The area occupied by the battery connector on the board is also reduced, and the balance of the soldering positions on the bottom surface of the connector is improved.
摘要翻译：本发明涉及一种配有绝缘外壳的电池连接器。接触件附接到壳体并焊接到电路板。每个触头具有平板形基部和从基部的两侧上升的一对侧壁部。一对接触臂从一对侧壁部分的侧壁部分彼此相对地延伸并且接触配合触点。基部的底面形成焊接到电路板的焊接表面。本发明增加了触点相对于电路板的焊接强度，使得不需要单独的加强构件。板上的电池连接器所占的面积也减小，连接器底面的焊接位置的平衡得到改善。

98. 发明授权

US06358094B1 Low inductance connector with enhanced capacitively coupled contacts for power applications 失效
标题翻译：低电感连接器，具有用于电源应用的增强的电容耦合触点
公开(公告)号：US06358094B1
公开(公告)日：2002-03-19
申请号：US09538698
申请日：2000-03-30
申请人： Yakov Belopolsky , Jenn Tsao
发明人： Yakov Belopolsky , Jenn Tsao
IPC分类号： H01R2400
CPC分类号： H05K1/148 , H01R12/7082 , H01R12/7088 , H01R13/658 , H05K2201/0792 , H05K2201/097 , H05K2201/10272 , H05K2201/1028 , H05K2203/1572
摘要： A low inductance power connector for reducing inductance in an electrical conductor is provided. An interface connector connects circuit boards together while reducing inductance and increasing current carrying capacity. The connector for connecting circuit boards comprises a first contact having a body, a first mating portion and a second mating portion, and a second contact having a body, a third mating portion and a fourth mating portion. The first and second mating portions are substantially parallel and disposed on opposite sides of the body of the first contact, and the third and fourth mating portions are substantially parallel and disposed on opposite sides of the body of the second contact.
摘要翻译：提供了用于降低电导体中的电感的低电感电源连接器。接口连接器将电路板连接在一起，同时减少电感和增加载流能力。用于连接电路板的连接器包括具有主体，第一配合部分和第二配合部分的第一触点和具有主体，第三配合部分和第四配合部分的第二触点。第一和第二配合部分基本上平行并且设置在第一接触件的主体的相对侧上，并且第三和第四配合部分基本上平行并且设置在第二接触件的主体的相对侧上。

99. 发明申请

US20020015288A1 High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications 审中-公开
标题翻译：用于高热通量和功率半导体应用的固定间隙参考的高性能热/机械接口
公开(公告)号：US20020015288A1
公开(公告)日：2002-02-07
申请号：US09910524
申请日：2001-07-20
发明人： Joseph T. Dibene II , David H. Hartke , Wendell C. Johnson , Farhad Raiszadeh , Edward J. Derian , Jose B. San Andres
IPC分类号： H05K007/20
CPC分类号： G06F1/182 , G06F1/18 , G06F1/189 , H01L23/427 , H01L23/433 , H01L24/72 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01074 , H01L2924/01082 , H01L2924/10253 , H01L2924/15192 , H01R12/52 , H01R12/7088 , H05K1/0263 , H05K3/368 , H05K2201/10325 , H05K2201/10704 , H01L2924/00 , H01L2224/0401
摘要： ? A thermal mechanical interface usable between a heatsink and a heat dissipating device is disclosed. In one embodiment, the thermal mechanical interface comprises a thermally conductive mechanically resilient member having a corrugated cross section and a first thermal conductance, disposed between the heat sink and the heat dissipating device and a thermal interface material having a second thermal conductance, disposed within the corrugated cross section.
摘要翻译：？公开了一种可用于散热器和散热装置之间的热机械接口。在一个实施例中，热机械界面包括导热机械弹性构件，其具有布置在散热器和散热装置之间的波纹状横截面和第一热导，以及具有第二热导率的热界面材料，波纹截面。

100. 发明授权

US06327157B1 High-current power bus system 有权
标题翻译：大电流总线系统
公开(公告)号：US06327157B1
公开(公告)日：2001-12-04
申请号：US09405935
申请日：1999-09-27
申请人： Kristina L Mann , Charles Henry Rock , Samuel M. Babb
发明人： Kristina L Mann , Charles Henry Rock , Samuel M. Babb
IPC分类号： H01R900
CPC分类号： G06F1/189 , H01R12/7088 , H05K7/1457
摘要： A two-piece bus bar electrically couples a printed circuit board to a power supply. The power supply is mounted to a chassis. A power supply bus bar extends from the power supply, defining a power supply bus bar plane. A first printed circuit board is mounted to the chassis and oriented in a plane that is not parallel with the power supply bus bar plane. A first printed circuit board bus bar extends from the first printed circuit board. At least one of the power supply bus bar or the first printed circuit board bus bar includes a bend that creates a parallel relationship between a mating portion of the power supply bus bar and a mating portion of the first printed circuit board bus bar. A first fastener couples the mating portions of the bus bars together. A second printed circuit board may be mounted to the chassis and oriented in a plane at right angles with the power supply bus bar plane. A second printed circuit board bus bar extends from the second printed circuit board and includes a 90-degree bend and a 180-degree bend such that a mating portion of the second printed circuit board bus bar is parallel with the power supply bus bar plane. A resilient conductive member having a convex surface is disposed within a channel formed in one of the bus bars to enhance electrical contact between the bus bars. Shock and short-circuit hazards are reduced with a removable insulating shield.
摘要翻译：两片式母线将印刷电路板电耦合到电源。电源安装在机箱上。一个电源总线从电源上延伸出来，定义一个电源母线平面。第一印刷电路板安装在底盘上并定向在与电源母线平面不平行的平面内。第一印刷电路板母线从第一印刷电路板延伸。电源母线或第一印刷电路板母线中的至少一个包括在电源母线的配合部分和第一印刷电路板母线的配合部分之间形成平行关系的弯曲部。第一紧固件将母线的配合部分连接在一起。第二印刷电路板可以安装到底盘并且在与电源母线平面成直角的平面中定向。第二印刷电路板母线从第二印刷电路板延伸并且包括90度弯曲和180度弯曲，使得第二印刷电路板母线的配合部分与电源母线平面平行。具有凸表面的弹性导电构件设置在形成在一个汇流条中的通道内，以增强母线之间的电接触。可拆卸的绝缘护罩减少了冲击和短路危险。

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