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91. 发明授权

US09096423B1 Methods of manufacture of top port multi-part surface mount MEMS microphones 有权
标题翻译：顶端多部件表面贴装MEMS麦克风的制造方法
公开(公告)号：US09096423B1
公开(公告)日：2015-08-04
申请号：US14159742
申请日：2014-01-21
申请人： Knowles Electronics, LLC
发明人： Anthony D. Minervini
IPC分类号： H01L21/00 , H04R31/00 , H01L23/12 , H04R11/04 , B81C1/00 , B81C3/00 , B81B7/00 , H01L23/10 , H04R19/04 , H04R19/00
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port disposed in the lid. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.
摘要翻译：公开了制造多个顶端口表面贴装麦克风的方法，每个麦克风包含微机电系统（MEMS）麦克风管芯。每个表面贴装麦克风都具有带有金属垫的基板，用于将封装表面安装到设备的印刷电路板上，并用于在麦克风封装和设备的电路板之间进行电气连接。表面安装式麦克风由基板，侧壁间隔件和盖子的面板制成。每个MEMS麦克风管芯被盖安装并且声耦合到设置在盖中的声学端口。面板连接在一起，并且每个单独的基板，侧壁间隔件和盖子协作以形成用于其各自的MEMS麦克风管芯的声室。然后将接合的面板分割成单个MEMS麦克风。

92. 发明授权

US09067780B1 Methods of manufacture of top port surface mount MEMS microphones 有权
标题翻译：顶端表面贴装MEMS麦克风的制造方法
公开(公告)号：US09067780B1
公开(公告)日：2015-06-30
申请号：US14321525
申请日：2014-07-01
申请人： Knowles Electronics, LLC
发明人： Anthony D. Minervini
IPC分类号： H01L21/00 , H04R31/00 , H04R11/04 , H01L23/12 , B81C1/00 , H04R19/04 , H01L21/78 , B81B7/00 , H01L23/10 , B81B3/00 , H04R19/00
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, and each MEMS microphone die is substrate-mounted. Individual covers, each with an acoustic port, are joined to the panel of unsingulated substrates, and each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die, which is acoustically coupled to the acoustic port in the cover. The completed panel is singulated to form individual MEMS microphones.
摘要翻译：公开了制造多个顶端口表面贴装麦克风的方法，每个麦克风包含微机电系统（MEMS）麦克风管芯。每个表面贴装麦克风都具有带有金属垫的基板，用于将封装表面安装到设备的印刷电路板上，并用于在麦克风封装和设备的电路板之间进行电气连接。表面安装式麦克风是由一组不带键盘的基板制成的，每个MEMS麦克风模具都是基板安装的。每个具有声学端口的单个盖子被连接到未弯曲的基板的面板，并且每个单独的基板和盖子对协作以形成用于其相应的MEMS麦克风管芯的声室，其声学耦合到盖子中的声学端口。完成的面板被单独形成单个MEMS麦克风。

93. 发明申请

US20150059485A1 MICROMECHANICAL SENSOR SYSTEM AND CORRESPONDING MANUFACTURING METHOD 有权
标题翻译：微机械传感器系统及相关制造方法
公开(公告)号：US20150059485A1
公开(公告)日：2015-03-05
申请号：US14472167
申请日：2014-08-28
申请人： Frieder Haag , Hubert Benzel
发明人： Frieder Haag , Hubert Benzel
IPC分类号： G01L9/00 , B81B7/02 , B81C1/00 , B81B3/00
CPC分类号： G01L9/0052 , B81B3/0021 , B81B7/007 , B81B7/02 , B81B2201/0264 , B81B2207/092 , B81C1/00373 , B81C2203/0154 , G01L9/0047 , G01L19/148 , H01L2224/48091 , H01L2224/49171 , H01L2924/00014
摘要： A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.
摘要翻译：微机械传感器系统包括微机械传感器芯片，所述微机械传感器芯片至少由模制壳体横向包围，所述模制壳体具有前侧和后侧。微机械传感器芯片包括从模制壳体中省略的后侧的芯片区域和形成在后侧的重新布线装置，其从芯片区域开始延伸到后侧的周围的模制外壳，并且从那里经过模制外壳的后侧至前侧的至少一个通孔。

94. 发明申请

US20140199835A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
标题翻译：芯片包装及其形成方法
公开(公告)号：US20140199835A1
公开(公告)日：2014-07-17
申请号：US14214389
申请日：2014-03-14
申请人： XINTEC INC.
发明人： Yu-Lin YEN , Chien-Hui CHEN , Tsang-Yu LIU , Long-Sheng YEOU
IPC分类号： H01L21/768
CPC分类号： H01L21/76879 , B81B7/007 , B81B2207/07 , B81B2207/092 , H01L21/76805 , H01L21/76898 , H01L23/3178 , H01L23/481 , H01L23/49827 , H01L24/06 , H01L24/13 , H01L24/32 , H01L24/94 , H01L25/0657 , H01L2221/68377 , H01L2224/0401 , H01L2224/05553 , H01L2224/0557 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/13025 , H01L2224/9202 , H01L2924/01013 , H01L2924/01014 , H01L2924/01021 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/00014 , H01L2924/00
摘要： According to an embodiment of the invention, a chip package is provided. The chip package includes: a substrate having an upper surface and a lower surface; a plurality of conducting pads located under the lower surface of the substrate; a dielectric layer located between the conducting pads; a trench extending from the upper surface towards the lower surface of the substrate; a hole extending from a bottom of the trench towards the lower surface of the substrate, wherein an upper sidewall of the hole inclines to the lower surface of the substrate, and a lower sidewall or a bottom of the hole exposes a portion of the conducting pads; and a conducting layer located in the hole and electrically connected to at least one of the conducting pads.
摘要翻译：根据本发明的实施例，提供了芯片封装。芯片封装包括：具有上表面和下表面的基板; 位于所述基板的下表面下方的多个导电垫; 位于导电垫之间的电介质层; 从衬底的上表面延伸到下表面的沟槽; 从所述沟槽的底部延伸到所述衬底的下表面的孔，其中所述孔的上侧壁倾斜到所述衬底的下表面，并且所述孔的下侧壁或底部暴露所述导电垫的一部分 ; 以及导电层，其位于所述孔中并电连接到至少一个所述导电焊盘。

95. 发明授权

US08765530B1 Methods of manufacture of top port surface mount silicon condenser microphone packages 有权
公开(公告)号：US08765530B1
公开(公告)日：2014-07-01
申请号：US13838319
申请日：2013-03-15
申请人： Knowles Electronics, LLC
发明人： Anthony D. Minervini
IPC分类号： H01L21/00 , H04R31/00 , H01L23/12 , H04R11/04
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

96. 发明授权

US08729695B2 Wafer level package and a method of forming a wafer level package 有权
标题翻译：晶圆级封装以及形成晶片级封装的方法
公开(公告)号：US08729695B2
公开(公告)日：2014-05-20
申请号：US13497611
申请日：2009-09-25
申请人： Chirayarikathu Veedu Sankarapillai Premachandran , Rakesh Kumar , Nagarajan Ranganathan , Won Kyoung Choi , Ebin Liao , Yasuyuki Mitsuoka , Hiroshi Takahashi , Ryuta Mitsusue
发明人： Chirayarikathu Veedu Sankarapillai Premachandran , Rakesh Kumar , Nagarajan Ranganathan , Won Kyoung Choi , Ebin Liao , Yasuyuki Mitsuoka , Hiroshi Takahashi , Ryuta Mitsusue
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： H01L21/6836 , B81B2207/092 , B81B2207/093 , B81B2207/097 , B81C2203/019 , H01L24/48 , H01L24/94 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/1461 , H01L2924/16195 , H01L2924/16235 , H01L2924/16315 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In an embodiment, a wafer level package may be provided. The wafer level package may include a device wafer including a MEMS device, a cap wafer disposed over the device wafer, at least one first interconnect disposed between the device wafer and the cap wafer and configured to provide an electrical connection between the device wafer and the cap wafer, and a conformal sealing ring disposed between the device wafer and the cap wafer and configured to surround the at least one first interconnect and the MEMS device so as to provide a conformally sealed environment for the at least one first interconnect and the MEMS device, wherein the conformal sealing ring may be configured to conform to a respective suitable surface of the device wafer and the cap wafer when the device wafer may be bonded to the cap wafer. A method of forming a wafer level package may also be provided.
摘要翻译：在一个实施例中，可以提供晶片级封装。晶片级封装可以包括包括MEMS器件的器件晶片，设置在器件晶片上的帽晶片，设置在器件晶片和帽晶片之间的至少一个第一互连，并且被配置为在器件晶片和晶片级封装之间提供电连接帽状晶片和保形密封环，其设置在器件晶片和盖晶片之间并且被配置为围绕至少一个第一互连和MEMS器件，以便为至少一个第一互连和MEMS器件提供保形密封的环境，其中所述保形密封环可以被配置为当所述器件晶片可以结合到所述盖晶片时，使其符合所述器件晶片和所述盖晶片的相应合适的表面。还可以提供一种形成晶片级封装的方法。

97. 发明申请

US20140063580A1 VIA STRUCTURE AND METHOD THEREOF 有权
标题翻译：通过其结构和方法
公开(公告)号：US20140063580A1
公开(公告)日：2014-03-06
申请号：US14073307
申请日：2013-11-06
申请人： SILEX Microsystems AB
发明人： Thorbjorn Ebefors , Edvard Kalvesten , Peter Agren , Niklas Svedin
IPC分类号： G02B26/08
CPC分类号： G02B26/0833 , B81B7/0006 , B81B7/007 , B81B2207/092 , B81B2207/095 , G02B6/3518 , G02B6/3584 , G02B26/0841 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro- mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.
摘要翻译：分层微电子和/或微机械结构包括在导电层之间具有绝缘层的至少三个交替导电层。还提供了在第一外层中的通孔，所述通孔包括由穿过该层的晶片天然材料制成的绝缘导电连接，在第一外层中延伸穿过其它层并进入所述通孔的导电插塞，以便提供通过层的导电性，以及围绕所述其它层的至少一个所选层的所述导电插塞的绝缘外壳，用于使所述插塞与所述选定层中的材料绝缘。它还涉及微电子和/或微机械装置，其包括设置在空腔上方的可动构件，使得其可在至少一个方向上移动。该装置具有根据本发明的分层结构。还提供了制造这种分层MEMS结构的方法。

98. 发明申请

US20140042596A1 BONDED WAFER STRUCTURES 有权
标题翻译：粘结波形结构
公开(公告)号：US20140042596A1
公开(公告)日：2014-02-13
申请号：US14112138
申请日：2011-05-09
申请人： Rodney L. Alley , Donald Milligan
发明人： Rodney L. Alley , Donald Milligan
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0077 , B81B2207/092 , B81C1/00269 , H01L21/2007 , H01L21/50
摘要： The present disclosure includes bonded wafer structures and methods of forming bonded wafer structures. One example of a forming a bonded wafer structure includes providing a first wafer (202, 302) and a second wafer (204, 304) to be bonded together via a bonding process that has a predetermined wafer gap (216, 316) associated therewith, and forming a mesa (215, 315, 415) on the first wafer (202, 302) prior to bonding the first wafer (202, 302) and the second wafer (204, 304) together, wherein a height (220, 320, 420) of the mesa (215, 315, 415) is determined based on a target element gap (217, 317) associated with the bonded wafer structure.
摘要翻译：本公开包括键合晶片结构和形成键合晶片结构的方法。形成键合晶片结构的一个实例包括提供通过具有与其相关联的预定晶片间隙（216,316）的接合工艺来结合在一起的第一晶片（202,302）和第二晶片（204,304）以及在将所述第一晶片（202,302）和所述第二晶片（204,304）接合在一起之前在所述第一晶片（202,302）上形成台面（215,315,415），其中，基于与键合晶片结构相关联的目标元件间隙（217,317）来确定台面（215,315,415）的尺寸（420）420。

99. 发明授权

US08633064B1 Methods of manufacture of top port multipart surface mount silicon condenser microphone package 有权
标题翻译：顶端多端表面贴装硅电容麦克风封装的制造方法
公开(公告)号：US08633064B1
公开(公告)日：2014-01-21
申请号：US13841796
申请日：2013-03-15
申请人： Knowles Electronics, LLC
发明人： Anthony D. Minervini
IPC分类号： H01L21/00 , H04R31/00 , H01L23/12 , H04R11/04
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's sprinted circuit board.
摘要翻译：本发明涉及一种用于硅电容麦克风的表面安装封装以及用于制造表面贴装封装的方法。表面安装封装使用有限数量的部件，其简化了制造并降低了成本，并且具有执行传统上需要多个部件的功能的基板，包括提供其上机械地连接硅冷凝器管芯的内表面，表面，用于在硅冷凝器管芯和封装之间进行电连接，并提供用于将封装表面安装到器件的印刷电路板的外表面，以及用于在封装和器件的冲压电路板之间进行电连接。

100. 发明授权

US08592981B2 Via structure and method thereof 有权
标题翻译：其结构及其方法
公开(公告)号：US08592981B2
公开(公告)日：2013-11-26
申请号：US13141609
申请日：2009-12-23
申请人： Thorbjörn Ebefors , Edvard Kälvesten , Peter Ågren , Niklas Svedin
发明人： Thorbjörn Ebefors , Edvard Kälvesten , Peter Ågren , Niklas Svedin
IPC分类号： H01L29/40
CPC分类号： G02B26/0833 , B81B7/0006 , B81B7/007 , B81B2207/092 , B81B2207/095 , G02B6/3518 , G02B6/3584 , G02B26/0841 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： The invention relates to a layered micro-electronic and/or micro-mechanic structure, comprising at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.
摘要翻译：本发明涉及分层的微电子和/或微机械结构，其包括在导电层之间具有绝缘层的至少三个交替的导电层。还提供了在第一外层中的通孔，所述通孔包括由穿过该层的晶片天然材料制成的绝缘导电连接，在第一外层中延伸穿过其它层并进入所述通孔的导电插塞，以便提供通过层的导电性，以及围绕所述其它层的至少一个所选层的所述导电插塞的绝缘外壳，用于使所述插塞与所述选定层中的材料绝缘。它还涉及微电子和/或微机械装置，其包括设置在空腔上方的可动构件，使得其可在至少一个方向上移动。该装置具有根据本发明的分层结构。还提供了制造这种分层MEMS结构的方法。

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