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91. 发明授权

US08633064B1 Methods of manufacture of top port multipart surface mount silicon condenser microphone package 有权
标题翻译：顶端多端表面贴装硅电容麦克风封装的制造方法
公开(公告)号：US08633064B1
公开(公告)日：2014-01-21
申请号：US13841796
申请日：2013-03-15
申请人： Knowles Electronics, LLC
发明人： Anthony D. Minervini
IPC分类号： H01L21/00 , H04R31/00 , H01L23/12 , H04R11/04
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's sprinted circuit board.
摘要翻译：本发明涉及一种用于硅电容麦克风的表面安装封装以及用于制造表面贴装封装的方法。表面安装封装使用有限数量的部件，其简化了制造并降低了成本，并且具有执行传统上需要多个部件的功能的基板，包括提供其上机械地连接硅冷凝器管芯的内表面，表面，用于在硅冷凝器管芯和封装之间进行电连接，并提供用于将封装表面安装到器件的印刷电路板的外表面，以及用于在封装和器件的冲压电路板之间进行电连接。

92. 发明授权

US08592981B2 Via structure and method thereof 有权
标题翻译：其结构及其方法
公开(公告)号：US08592981B2
公开(公告)日：2013-11-26
申请号：US13141609
申请日：2009-12-23
申请人： Thorbjörn Ebefors , Edvard Kälvesten , Peter Ågren , Niklas Svedin
发明人： Thorbjörn Ebefors , Edvard Kälvesten , Peter Ågren , Niklas Svedin
IPC分类号： H01L29/40
CPC分类号： G02B26/0833 , B81B7/0006 , B81B7/007 , B81B2207/092 , B81B2207/095 , G02B6/3518 , G02B6/3584 , G02B26/0841 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： The invention relates to a layered micro-electronic and/or micro-mechanic structure, comprising at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.
摘要翻译：本发明涉及分层的微电子和/或微机械结构，其包括在导电层之间具有绝缘层的至少三个交替的导电层。还提供了在第一外层中的通孔，所述通孔包括由穿过该层的晶片天然材料制成的绝缘导电连接，在第一外层中延伸穿过其它层并进入所述通孔的导电插塞，以便提供通过层的导电性，以及围绕所述其它层的至少一个所选层的所述导电插塞的绝缘外壳，用于使所述插塞与所述选定层中的材料绝缘。它还涉及微电子和/或微机械装置，其包括设置在空腔上方的可动构件，使得其可在至少一个方向上移动。该装置具有根据本发明的分层结构。还提供了制造这种分层MEMS结构的方法。

93. 发明申请

US20130223031A1 SENSOR COMPRISING A MULTI-LAYERED CERAMIC SUBSTRATE AND METHOD FOR ITS PRODUCTION 有权
标题翻译：包含多层陶瓷基板的传感器及其生产方法
公开(公告)号：US20130223031A1
公开(公告)日：2013-08-29
申请号：US13880348
申请日：2011-10-10
申请人： Sabine Schmideder , Torsten Thelemann , Josef Nagl , Heinrich Aschenbrenner , Reinhold Hoenicka
发明人： Sabine Schmideder , Torsten Thelemann , Josef Nagl , Heinrich Aschenbrenner , Reinhold Hoenicka
IPC分类号： H05K1/18 , H05K3/32
CPC分类号： H05K1/181 , B81B7/0006 , B81B2207/092 , B81B2207/096 , B81C1/00301 , H01L2924/0002 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K1/185 , H05K3/32 , H05K3/3447 , H05K3/4046 , H05K3/4629 , H05K2201/10151 , H05K2201/10287 , H05K2201/10303 , H05K2201/10318 , H05K2201/10356 , Y10T29/49128 , H01L2924/00
摘要： A sensor comprises a preferably multi-layer ceramic substrate (2) and at least one sensor element (1) arranged in, at, or on the ceramic substrate (2). The sensor element (1) can be contacted via a metallic contact (6), with the metallic contact (6) being produced via a soldering connection, which electrically connects the contact (6) with the sensor element (1) and here generates a fixed mechanic connection of the contact (6) in reference to the ceramic substrate (2). Furthermore, a method is claimed for producing the sensor according to the invention.
摘要翻译：传感器包括优选多层陶瓷衬底（2）和布置在陶瓷衬底（2）上，之中或之上的至少一个传感器元件（1）。传感器元件（1）可以经由金属触点（6）接触，金属触点（6）通过焊接连接产生，焊接连接将触点（6）与传感器元件（1）电连接，并且这里产生触点（6）相对于陶瓷基板（2）的固定机械连接。此外，要求保护用于制造根据本发明的传感器的方法。

94. 发明授权

US08486744B2 Multiple bonding in wafer level packaging 有权
标题翻译：晶圆级封装的多重接合
公开(公告)号：US08486744B2
公开(公告)日：2013-07-16
申请号：US12892003
申请日：2010-09-28
申请人： Chung-Hsien Lin , Chia-Hua Chu , Li-Cheng Chu , Yuan-Chih Hsieh , Chun-Wen Cheng
发明人： Chung-Hsien Lin , Chia-Hua Chu , Li-Cheng Chu , Yuan-Chih Hsieh , Chun-Wen Cheng
IPC分类号： H01L21/00
CPC分类号： B81B7/0032 , B81B2207/092 , B81C1/00269 , B81C1/00357 , B81C2203/0109 , B81C2203/0792 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure provides a method for fabricating a MEMS device including multiple bonding of substrates. In an embodiment, a method includes providing a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, providing a semiconductor substrate including a second bonding layer, and providing a cap including a third bonding layer. The method further includes bonding the MEMS substrate to the semiconductor substrate at the first and second bonding layers, and bonding the cap to the semiconductor substrate at the second and third bonding layers to hermetically seal the MEMS substrate between the cap and the semiconductor substrate. A MEMS device fabricated by the above method is also provided.
摘要翻译：本公开提供了一种用于制造包括多个基板结合的MEMS装置的方法。在一个实施例中，一种方法包括提供包括第一结合层的微电子机械系统（MEMS）衬底，提供包括第二接合层的半导体衬底，以及提供包括第三接合层的帽。该方法还包括在第一和第二接合层处将MEMS衬底接合到半导体衬底，并且在第二和第三接合层处将盖接合到半导体衬底上，以密封MEMS衬底在盖和半导体衬底之间。还提供了通过上述方法制造的MEMS器件。

95. 发明授权

US08479375B2 Method of making an embedded electromagnetic device 有权
标题翻译：制作嵌入式电磁装置的方法
公开(公告)号：US08479375B2
公开(公告)日：2013-07-09
申请号：US12686984
申请日：2010-01-13
申请人： Henry Helvajian
发明人： Henry Helvajian
IPC分类号： H04R31/00
CPC分类号： H05K7/02 , B01J19/0093 , B01J2219/00824 , B01J2219/00835 , B01J2219/00853 , B01J2219/00941 , B01J2219/00948 , B01L3/502707 , B01L2300/0654 , B01L2300/0681 , B01L2300/0867 , B01L2300/0874 , B81B7/0077 , B81B2207/07 , B81B2207/092 , B81B2207/095 , B81B2207/096 , B81C99/0095 , B81C2201/0143 , B81C2201/0159 , G02B2006/12035 , G02B2006/12171 , H01P3/121 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K3/0023 , H05K3/101 , Y10T29/42 , Y10T29/49002 , Y10T29/49005 , Y10T29/4908
摘要： A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
摘要翻译：使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷，该器件可以包括化学，机械，电子，电磁，光学和声学设备中的一种或多种，所有这些都部分地通过在陶瓷或通过陶瓷体的表面端口设置器件材料，使用内部连接和表面接口互连这些器件。

96. 发明申请

US20130135317A1 THIN BACK GLASS INTERCONNECT 有权
标题翻译：薄背玻璃互连
公开(公告)号：US20130135317A1
公开(公告)日：2013-05-30
申请号：US13306284
申请日：2011-11-29
申请人： Ravindra V. Shenoy
发明人： Ravindra V. Shenoy
IPC分类号： G06T1/00 , B32B38/10 , B32B37/02 , B05D3/00 , H01R13/02 , B05D5/00
CPC分类号： B81C1/00047 , B81B2203/0315 , B81B2207/092 , B81B2207/095 , B81C1/00301 , B81C2203/0127
摘要： This disclosure provides systems, methods and apparatus for providing packaged microelectromechanical systems (MEMS) devices. In one aspect, package can include a cover glass joined to a device substrate, the cover glass including integrated electrical connectivity and configured to encapsulate one or more MEMS devices on the device substrate. The cover glass can include one or more spin-on glass layers and electrically conductive routing and interconnects. The package can include a narrow seal surrounding the one or more encapsulated MEMS devices.
摘要翻译：本公开提供了用于提供封装的微机电系统（MEMS）装置的系统，方法和装置。在一个方面，封装可以包括接合到器件衬底的覆盖玻璃，所述覆盖玻璃包括集成的电连接并且被配置为将一个或多个MEMS器件封装在所述器件衬底上。盖玻璃可以包括一个或多个旋涂玻璃层和导电布线和互连。封装可以包括围绕一个或多个封装的MEMS器件的窄密封。

97. 发明授权

US08368224B2 Under land routing 有权
标题翻译：在陆地路线下
公开(公告)号：US08368224B2
公开(公告)日：2013-02-05
申请号：US12829745
申请日：2010-07-02
申请人： Zaid Aboush
发明人： Zaid Aboush
IPC分类号： H01L23/52
CPC分类号： H01L23/525 , B81B7/007 , B81B2207/092 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02331 , H01L2224/0235 , H01L2224/02375 , H01L2224/02381 , H01L2224/0401 , H01L2224/05008 , H01L2224/05012 , H01L2224/05015 , H01L2224/05024 , H01L2224/05026 , H01L2224/05078 , H01L2224/05082 , H01L2224/05088 , H01L2224/05093 , H01L2224/05551 , H01L2224/05555 , H01L2224/05562 , H01L2224/05569 , H01L2224/11334 , H01L2224/13028 , H01L2224/131 , H01L2224/13147 , H01L2924/01029 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： An electronic component comprising an integrated device and a plurality of packaging layers in which routing between locations on the device and lands on the surface of the component is provided by a redistribution layer. The redistribution layer may be routed below the extent of a contact pad on the surface by providing a channel through the via and redistribution layers underneath that land.
摘要翻译：一种电子部件，包括集成器件和多个封装层，其中器件上的位置和部件表面上的焊盘之间的布线由再分配层提供。再分配层可以通过在该平台下方的通孔和重新分布层提供通道而被布置在表面上的接触垫的范围之下。

98. 发明授权

US08358004B2 Surface mount silicon condenser microphone package 有权
标题翻译：表面贴装硅电容麦克风包装
公开(公告)号：US08358004B2
公开(公告)日：2013-01-22
申请号：US13286558
申请日：2011-11-01
申请人： Anthony D Minervini
发明人： Anthony D Minervini
IPC分类号： H01L23/12 , H04R9/08
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board.
摘要翻译：本发明涉及一种用于硅电容麦克风的表面贴装封装。本发明的封装使用有限数量的部件，其简化制造并降低成本，并且具有执行传统上需要多个部件的功能的基板，包括提供其上机械连接硅冷凝器管芯的内表面，提供内表面用于在管芯和封装之间进行电连接，并提供用于在封装和用户印刷电路板之间进行电连接的外表面。

99. 发明申请

US20120139100A1 LAMINATED TRANSFERABLE INTERCONNECT FOR MICROELECTRONIC PACKAGE 有权
标题翻译：用于微电子封装的层压可转换互连
公开(公告)号：US20120139100A1
公开(公告)日：2012-06-07
申请号：US12959549
申请日：2010-12-03
申请人： Ward G. Fillmore , William J. Davis
发明人： Ward G. Fillmore , William J. Davis
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： B81C1/00301 , B81B2207/092 , B81B2207/095 , H01L21/6835 , H01L23/544 , H01L2221/68359 , H01L2221/68363 , H01L2221/68381 , H01L2223/54426 , H01L2924/00013 , H01L2924/0002 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A package for a plurality of semiconductor devices having: an electrical interconnect structure, comprising: an electrical interconnect structure; and an active device structure, comprising the plurality of semiconductor devices on an active device substrate. The electrical interconnect structure is bonded to the active device structure and the electrical interconnect structure provides electrical interconnection among the semiconductor devices.
摘要翻译：一种用于多个半导体器件的封装，具有：电互连结构，包括：电互连结构; 以及有源器件结构，其包括在有源器件衬底上的多个半导体器件。电互连结构被结合到有源器件结构，并且电互连结构提供半导体器件之间的电互连。

100. 发明授权

US08188555B2 Capacitive sensor and manufacturing method therefor 有权
标题翻译：电容传感器及其制造方法
公开(公告)号：US08188555B2
公开(公告)日：2012-05-29
申请号：US12277329
申请日：2008-11-25
申请人： Yasushi Igarashi
发明人： Yasushi Igarashi
IPC分类号： H01L29/84
CPC分类号： G01P15/125 , B81B7/02 , B81B2201/0235 , B81B2201/0264 , B81B2207/092 , B81C1/00301 , G01P1/023 , G01P2015/0828
摘要： A capacitive sensor includes a semiconductor substrate, a fixed electrode serving as a first electrode formed on a surface of or in the semiconductor substrate, a structure formed on the semiconductor substrate to have a vibratable second electrode that is formed to be spaced from and opposed to the semiconductor substrate and from the fixed electrode serving as the first electrode, a sealing member serving as a first sealing member formed on the semiconductor substrate to be spaced from the structure, to cover the structure, and to have a through hole serving as a first through hole, and a movable electrode serving as a vibratable third electrode formed on the sealing member to block up the through hole, and to be spaced from and opposed to the movable electrode.
摘要翻译：电容传感器包括半导体衬底，用作形成在半导体衬底的表面上或半导体衬底中的第一电极的固定电极，形成在半导体衬底上的结构，以具有形成为与第二电极间隔开并与之相对的可振动的第二电极半导体衬底和用作第一电极的固定电极，用作第一密封构件的密封构件，形成在半导体衬底上以与结构间隔开以覆盖结构，并且具有用作第一电极的通孔通孔，以及用作可振动的第三电极的可动电极，形成在密封构件上以阻挡通孔，并与可动电极间隔开并与之相对。

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