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91. 发明申请

US20120248094A1 Soldering Method 有权
标题翻译：焊接方法
公开(公告)号：US20120248094A1
公开(公告)日：2012-10-04
申请号：US13077163
申请日：2011-03-31
申请人： Guido Strotmann , Achim Froemelt
发明人： Guido Strotmann , Achim Froemelt
IPC分类号： B23K1/002
CPC分类号： B23K1/0016 , B23K1/008 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering partner, a second soldering partner, and a solder. During the soldering process, the individual temperatures of each one of the sets are transmitted by a radio frequency transmitter to a receiving and control unit. The control unit controls the heating of the sets depending on the transmitted individual temperatures.
摘要翻译：提供焊接方法。根据该方法，通过加热加热和焊接至少两组部件。每组包括第一焊接伙伴，第二焊接伙伴和焊料。在焊接过程中，每个组的各个温度由射频发射器传输到接收和控制单元。控制单元根据所传送的各个温度来控制组的加热。

92. 发明授权

US08274161B2 Flux-free chip to substrate joint serial linear thermal processor arrangement 有权
标题翻译：无焊芯片与衬底接合串联线性热处理器布置
公开(公告)号：US08274161B2
公开(公告)日：2012-09-25
申请号：US12930462
申请日：2011-01-07
申请人： Jian Zhang , Chunghsin Lee
发明人： Jian Zhang , Chunghsin Lee
IPC分类号： H01L23/48
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/008 , B23K2101/42 , H01L24/75 , H01L2224/81054 , H01L2224/81065 , H01L2224/8109 , H01L2224/81097 , H01L2224/81193 , H01L2224/81205 , H01L2224/81211 , H01L2224/81815 , H01L2924/01322 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers beginning at a loading station and ending up at an unloading station after various melting and vacuuming of chip/substrate components has been stepwise indexed through those various chambers to the final joining thereof.
摘要翻译：一种线性，串行芯片/基板组装处理机，用于通过一系列可在密封室开始的可密封室逐步推进预组装的芯片/模具基板，并且在各种熔融和抽真空之后在卸载站处结束 /基板部件已经通过这些不同的室逐步分度到其最终连接。

93. 发明申请

US20120205424A1 Methods and Systems Involving Soldering 有权
标题翻译：涉及焊接的方法和系统
公开(公告)号：US20120205424A1
公开(公告)日：2012-08-16
申请号：US13027375
申请日：2011-02-15
申请人： Julien Sylvestre
发明人： Julien Sylvestre
IPC分类号： B23K31/02 , B23K1/00 , B23K3/00 , B23K3/08
CPC分类号： H05K3/341 , B23K1/0016 , B23K1/008 , B23K1/06 , B23K3/04 , B23K3/08 , B23K31/02 , H01L24/13 , H01L24/16 , H01L24/74 , H01L24/75 , H01L24/81 , H01L2224/1416 , H01L2224/16225 , H01L2224/16227 , H01L2224/75252 , H01L2224/75272 , H01L2224/75701 , H01L2224/75702 , H01L2224/75801 , H01L2224/75841 , H01L2224/759 , H01L2224/81024 , H01L2224/81149 , H01L2224/81169 , H01L2224/81193 , H01L2924/12042 , H01L2924/00012 , H01L2924/00
摘要： A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.
摘要翻译：一种方法包括将焊料施加到半导体器件的导电焊盘，将焊料施加到衬底的导电焊盘上，使半导体器件上的焊料与衬底上的焊料对准，使得半导体器件上的焊料的部分接触到在衬底上焊接，加热半导体器件和衬底以使焊料液化，并发挥振荡力，使振荡力以一定的频率相对于衬底振荡半导体器件。

94. 发明授权

US08132710B2 Deconstructable assembly and method 有权
标题翻译：可解构装配和方法
公开(公告)号：US08132710B2
公开(公告)日：2012-03-13
申请号：US12194900
申请日：2008-08-20
申请人： Gerald J. Bruck , Douglas A. Arrell
发明人： Gerald J. Bruck , Douglas A. Arrell
IPC分类号： B23K1/018
CPC分类号： B23K1/018 , B23K1/008 , Y10T29/49822 , Y10T428/12986
摘要： An assembly (10) that can be both joined and parted by temperature processing. A parting member (20) captured between two members of the assembly exhibits a state change as a function of temperature such that the two members can be joined with a meltable joining material (18) at a joining temperature, operated at an operating temperature lower than the joining temperature, and then separated at a parting temperature higher or lower than the operating and joining temperatures as a result of a parting force caused by the state change of the parting member. In one embodiment, the parting member has a coefficient of thermal expansion higher than a coefficient of thermal expansion of the assembly members such that differential thermal expansion causes the parting member to expand across the interface (16) between the members to generate the parting force.
摘要翻译：可以通过温度处理连接和分配的组件（10）。捕获在组件的两个构件之间的分离构件（20）表现出作为温度的函数的状态变化，使得两个构件可以在接合温度下与可熔融接合材料（18）接合，操作温度低于接合温度，然后在由于分离构件的状态变化引起的分离力的结果，高于或低于操作和接合温度的分离温度下分离。在一个实施例中，分离构件的热膨胀系数高于组装构件的热膨胀系数，使得差分热膨胀导致分离构件在构件之间的界面（16）上膨胀以产生分离力。

95. 发明申请

US20120058364A1 BRAZED ALUMINUM LAMINATE MOLD TOOLING 审中-公开
标题翻译： BRAZED铝合金模具工具
公开(公告)号：US20120058364A1
公开(公告)日：2012-03-08
申请号：US13295442
申请日：2011-11-14
申请人： Matthew T. Lowney , Michael Wasylenko , Anthony Nicholas Tanascu
发明人： Matthew T. Lowney , Michael Wasylenko , Anthony Nicholas Tanascu
IPC分类号： B32B15/01 , B23K1/20 , B32B3/00 , B23K31/02
CPC分类号： B32B15/016 , B21D37/20 , B22D17/22 , B23K1/008 , B23K1/206 , B23K3/087 , B23K2101/18 , B23K2101/20 , B23K2103/10 , B23P15/246 , B29C33/301 , B29C45/7312 , B29C2045/7318 , Y10T428/12639 , Y10T428/12736 , Y10T428/12764 , Y10T428/24479
摘要： A laminate aluminum block for forming an article includes a series of aluminum laminate plates to collectively form a tool body for forming an article in a forming operation. A series of aluminum brazing layers are formed for brazing together adjacent aluminum laminate plates. The series of aluminum laminate plates and the series of aluminum brazing layers are deoxidized. Draining apertures are formed through a plurality of the series of aluminum laminate plates. The series of aluminum laminate plates are stacked alternating with the aluminum brazing layers between adjacent aluminum laminate plates without a flux. The stacked series of alternating aluminum plates and aluminum brazing layers are pressed. The stacked series of alternating aluminum plates and aluminum brazing layers are heated in a vacuum furnace to a temperature wherein the aluminum brazing layers braze the aluminum laminate plates together and excess braze material drains from the draining apertures.
摘要翻译：用于形成物品的层压铝块包括一系列铝层压板，以在成型操作中共同形成用于形成物品的工具主体。形成一系列铝钎焊层，用于将邻近的铝层压板钎焊在一起。一系列铝层压板和一系列铝钎焊层脱氧。通过多个一系列铝层压板形成排水孔。一系列铝层压板与相邻的铝层压板之间的铝钎焊层交替堆叠而没有焊剂。交替的铝板和铝钎焊层的叠层系列被按压。将交替的铝板和铝钎焊层的堆叠系列在真空炉中加热至其中铝钎焊层将铝层压板钎焊在一起并且从排水孔排出多余的钎焊材料的温度。

96. 发明授权

US08128720B2 Method and apparatus for removing contaminants from a reflow apparatus 有权
公开(公告)号：US08128720B2
公开(公告)日：2012-03-06
申请号：US13185314
申请日：2011-07-18
申请人： John Neiderman , Rita Mohanty , Marc C. Apell , Azhar Qureshi , Giovanni Filippelli
发明人： John Neiderman , Rita Mohanty , Marc C. Apell , Azhar Qureshi , Giovanni Filippelli
IPC分类号： B01D53/00
CPC分类号： B23K1/008 , B23K1/018 , B23K2101/42 , Y10S55/10
摘要： A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.

97. 发明授权

US08110015B2 Method and apparatus for removing contaminants from a reflow apparatus 有权
标题翻译：从回流装置中除去污染物的方法和装置
公开(公告)号：US08110015B2
公开(公告)日：2012-02-07
申请号：US11807659
申请日：2007-05-30
申请人： John Neiderman , Rita Mohanty , Marc C. Apell , Azhar Qureshi , Giovanni Filippelli
发明人： John Neiderman , Rita Mohanty , Marc C. Apell , Azhar Qureshi , Giovanni Filippelli
IPC分类号： B01D53/00
CPC分类号： B23K1/008 , B23K1/018 , B23K2101/42 , Y10S55/10
摘要： A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.
摘要翻译：用于将电子部件焊接到基板的用于焊接的回流装置包括回流室，用于输送室内的基板的输送器，至少一个加热元件，以提供热量以在基板上回流焊料，以及至少一个系统以除去产生的污染物从回流焊料。该系统与腔室相耦合，以使来自腔室的蒸气流通过该系统。该系统包括与蒸气流流体连通的污染物收集单元。污染物收集单元包括线圈和收集容器。线圈构造成在其中接收冷却的气体。这种布置使得当在线圈中引入冷却气体时，蒸气流中的污染物在线圈上冷凝，并且当停止在线圈中引入冷却的气体时，蒸气流中的污染物从线圈释放并收集在集合体中容器。进一步公开了用于去除污染物的其它实施例和方法。

98. 发明授权

US08084717B2 Reflow furnace 有权
标题翻译：回流炉
公开(公告)号：US08084717B2
公开(公告)日：2011-12-27
申请号：US11659235
申请日：2005-08-03
申请人： Hideki Nakamura , Atsushi Obara
发明人： Hideki Nakamura , Atsushi Obara
IPC分类号： F27B14/00 , B01J3/04
CPC分类号： F27B9/10 , B23K1/008 , B23K2101/42 , F27B9/36 , H05K3/3494
摘要： The suction ports of a hot air blowing heater are arranged in a zigzag shape crossing the direction of travel of a printed circuit board, and hot air discharge nozzles project from inside or alongside the suction ports. Accordingly, in the reflow furnace according to the present invention, hot air discharged from the hot air discharge nozzles does not collide with hot air sucked into the suction ports, and turbulence does not take place.
摘要翻译：热风吹风加热器的吸入口布置成与印刷电路板的行进方向交叉的锯齿形状，并且热空气排放喷嘴从吸入口的内部或旁边突出。因此，在根据本发明的回流炉中，从热空气排放喷嘴排出的热空气不会吸入吸入口中的热空气，并且不发生湍流。

99. 发明申请

US20110248549A1 WELD-ON COMPOSITE TOOTH FOR ROLL CRUSHERS HAVING A CHROME CARBIDE BODY VACUUM BRAZED TO A MILD STEEL BACKING PLATE 审中-公开
标题翻译：用于滚筒式破碎机的焊接复合陶瓷具有将碳化硼体积直接喷淋到一个轻钢背板上
公开(公告)号：US20110248549A1
公开(公告)日：2011-10-13
申请号：US12759557
申请日：2010-04-13
申请人： Brook Hugh Knotts
发明人： Brook Hugh Knotts
IPC分类号： E21C35/18 , B23K1/20 , B23K31/02
CPC分类号： B23K1/0008 , B02C4/08 , B02C4/305 , B23K1/008 , B23K1/203 , B23K2101/20 , B23K2103/04 , B23K2103/18 , B23K2103/52
摘要： A durable, weld-on chrome carbide tooth is provided for roll crushers. The tooth includes a chrome carbide body that is vacuum brazed to a mild steel backing plate. An upper portion of the tooth is preferably cast from chrome carbide alloy having 25 percent high-chrome-molybdenum content and a Brinell Hardness Number of about 700. The mating surfaces of the chrome carbide body and the mild steel backing plate are surface ground, then brazed together in a heat-treating furnace that has been evacuated to a pressure of less than 1×10−3 Torr. The minor differences in thermal expansion coefficients of the chrome carbide body and the mild steel backing plate are absorbed in the brazed joint, thereby reducing the buildup of mechanical stresses at the boundary layer. The mild steel backing plate enables the tooth to be welded directly to the drum of a rotary crusher.
摘要翻译：为辊式破碎机提供耐用的焊接铬碳牙齿。齿包括一个碳化铬体，它被真空钎焊到低碳钢背板上。优选地，该齿的上部由具有25％的高铬钼含量和约700的布氏硬度值的碳化铬合金铸造。碳化铬体和低碳钢背板的配合表面是表面磨削的，然后在已经抽真空至小于1×10-3乇的压力的热处理炉中钎焊在一起。碳化铬体和低碳钢背板的热膨胀系数的微小差异被吸收在钎焊接头中，从而减少了边界层的机械应力的累积。低碳钢背板使齿能够直接焊接在旋转破碎机的滚筒上。

100. 发明申请

US20110226839A1 JET STACK BRAZING IN A DIFFUSION FURNACE 有权
标题翻译：喷浆机在扩散炉中打浆
公开(公告)号：US20110226839A1
公开(公告)日：2011-09-22
申请号：US13149559
申请日：2011-05-31
申请人： J. Kirk McGlothlan , Christopher Lansing Renfro , Constance Hilliary Texley Jones
发明人： J. Kirk McGlothlan , Christopher Lansing Renfro , Constance Hilliary Texley Jones
IPC分类号： B23K31/12 , B23K31/02
CPC分类号： B23K1/008 , B23K3/087 , Y10S206/832
摘要： A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.
摘要翻译：一种用于在扩散炉中分批钎焊喷射叠层的方法和装置。该方法可以包括将易熔部件插入石英舟的槽中并将石英舟运送到扩散炉的反应室的内部。操作员可以密封反应室的内部，并且可以根据钎焊配方调节反应室内部的气氛。预热炉加热元件可以朝向反应室移动以增加温度，并且可熔体部分可以根据钎焊配方进行钎焊。然后可以将炉加热元件移离远离反应室，将该室未密封，并且将钎焊的部件移除。

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