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    • 92. 发明申请
    • Charge Pump Systems and Methods
    • 电荷泵系统和方法
    • US20130187707A1
    • 2013-07-25
    • US13726522
    • 2012-12-24
    • Hieu Van TranSang Thanh NguyenNasrin JaffariHung Quoc NguyenAnh Ly
    • Hieu Van TranSang Thanh NguyenNasrin JaffariHung Quoc NguyenAnh Ly
    • G05F3/02
    • G05F3/02H02M3/073H02M2001/322
    • Digital multilevel memory systems and methods include a charge pump for generating regulated high voltages for various memory operations. The charge pump may include a plurality of pump stages. Aspects of exemplary systems may include charge pumps that performs orderly charging and discharging at low voltage operation conditions. Additional aspects may include features that enable state by state pumping, for example, circuitry that avoids cascaded short circuits among pump stages. Each pump stage may also include circuitry that discharges its nodes, such as via self-discharge through associated pump interconnection(s). Further aspects may also include features that: assist power-up in the various pump stages, double voltage, shift high voltage levels, provide anti-parallel circuit configurations, and/or enable buffering or precharging features, such as self-buffering and self-precharging circuitry.
    • 数字多电平存储器系统和方法包括用于为各种存储器操作产生调节的高电压的电荷泵。 电荷泵可以包括多个泵级。 示例性系统的方面可以包括在低电压操作条件下执行有序充电和放电的电荷泵。 其他方面可以包括使状态状态泵送的特征,例如避免泵级之间的级联短路的电路。 每个泵级还可以包括排放其节点的电路,例如通过相关联的泵互连通过自放电。 另外的方面还可以包括以下功能:辅助各个泵级的上电,双电压,高电平移位,提供反并联电路配置和/或实现缓冲或预充电特征,例如自缓冲和自缓冲, 预充电电路。
    • 99. 发明授权
    • Method and apparatus for testing the connectivity of a flash memory chip
    • 用于测试闪存芯片连接性的方法和装置
    • US08020055B2
    • 2011-09-13
    • US12629302
    • 2009-12-02
    • Sang Thanh NguyenHieu Van TranHung O. NguyenPhil Klotzkin
    • Sang Thanh NguyenHieu Van TranHung O. NguyenPhil Klotzkin
    • G11C29/00G11C7/00
    • G11C29/02G11C29/022G11C2029/3202
    • In one embodiment of the invention, circuitry and hardware for connectivity testing are fabricated on an IC, and in particular an IC containing a flash memory array. This testing circuitry is electrically connected to the bond pads of the IC. In some embodiments, the testing circuitry includes a boundary scan cell connected to each bond pad, allowing for rapid connectivity testing of flash memory chips in accordance with testing standards such as the JTAG standard. The invention further includes methods in which the pins and/or memory cells of a flash memory chip are sequentially sent a series of data so as to test the connectivity of portions of the IC. The sequentially-sent data is then retrieved and compared to the original data. Discrepancies between these sets of data thus highlight connectivity problems in the IC.
    • 在本发明的一个实施例中,用于连接测试的电路和硬件被制造在IC上,特别是包含闪存阵列的IC。 该测试电路电连接到IC的接合焊盘。 在一些实施例中,测试电路包括连接到每个接合焊盘的边界扫描单元,允许根据诸如JTAG标准的测试标准对闪存芯片进行快速连接测试。 本发明还包括其中闪存芯片的引脚和/或存储单元被顺序发送一系列数据以测试IC的部分连通性的方法。 然后检索顺序发送的数据并将其与原始数据进行比较。 因此,这些数据集之间的差异突出了IC中的连接问题。