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91. 发明授权

US08273607B2 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof 有权
标题翻译：具有封装和底部填充的集成电路封装系统及其制造方法
公开(公告)号：US08273607B2
公开(公告)日：2012-09-25
申请号：US12818462
申请日：2010-06-18
申请人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
发明人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除由升高的部分分离而产生的表面。

92. 发明授权

US08211749B2 Integrated circuit package system with waferscale spacer 有权
标题翻译：集成电路封装系统，带有硅片间隔器
公开(公告)号：US08211749B2
公开(公告)日：2012-07-03
申请号：US11465706
申请日：2006-08-18
申请人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L21/50
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2924/01067 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit packaging system is provided including forming a first device wafer having a first backside and a first active side; forming a waferscale spacer wafer having a waferscale spacer and a first opening; mounting the waferscale spacer wafer on the first backside; and singulating an first integrated circuit die having the waferscale spacer from the first device wafer having the first backside with the waferscale spacer wafer thereon.
摘要翻译：提供一种集成电路封装系统，包括形成具有第一背面和第一有源侧的第一器件晶片; 形成具有晶片间隔件和第一开口的晶片间隔晶片; 将所述晶片间隔晶片安装在所述第一背面上; 以及从具有第一背面的第一器件晶片和其上具有晶片间隔晶片的单片化第一集成电路晶片，其具有晶片尺寸间隔物。

93. 发明申请

US20110312133A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND UNDERFILL AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：集成电路包装系统及其制造方法及其制造方法
公开(公告)号：US20110312133A1
公开(公告)日：2011-12-22
申请号：US12818462
申请日：2010-06-18
申请人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
发明人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
IPC分类号： H01L21/56 , H01L21/60
CPC分类号： H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除由升高的部分分离而产生的表面。

94. 发明授权

US08059598B2 Wireless communication system and method for managing service flow identifier in the same 有权
标题翻译：用于管理业务流标识符的无线通信系统和方法
公开(公告)号：US08059598B2
公开(公告)日：2011-11-15
申请号：US11636784
申请日：2006-12-11
申请人： Jung-Mo Moon , Sang-Ho Lee
发明人： Jung-Mo Moon , Sang-Ho Lee
IPC分类号： H04W4/00
CPC分类号： H04W8/26 , H04W36/08
摘要： The present invention relates to a wireless communication system and a service flow identifier method of the system. The wireless communication system includes a plurality of PARs that provides wireless communication services to a plurality of access terminals through a plurality of access points for separate management of service flow identifiers. The PARs include a service flow identifier controller for managing a service flow identifier used for identifying a connection service of each access terminal. The service flow identifier controller manages a service flow identifier generated by a home PAR and a service flow identifier generated by another PAR among service flow identifiers of an access terminal that has performed handoff from the other PAR to the home PAR. The wireless communication system manages service flow identifiers by using a separate control method, thereby preventing interruption of the entire system network operation due to a signal system error.
摘要翻译：本发明涉及一种系统的无线通信系统和服务流识别方法。无线通信系统包括多个PAR，其通过多个接入点向多个接入终端提供无线通信服务，用于单独管理业务流标识符。 PAR包括用于管理用于识别每个接入终端的连接服务的服务流标识符的服务流标识符控制器。服务流标识符控制器管理由家庭PAR产生的服务流标识符和由另一个PAR生成的服务流标识符，该服务流标识符已经执行了从其他PAR到家庭PAR的切换的接入终端的服务流标识符。无线通信系统通过使用单独的控制方法来管理服务流标识符，从而防止由于信号系统错误而导致的整个系统网络操作的中断。

95. 发明申请

US20110255715A1 MULTIFUNCTIONAL MICRO-SPEAKER 审中-公开
标题翻译：多功能微型扬声器
公开(公告)号：US20110255715A1
公开(公告)日：2011-10-20
申请号：US13142152
申请日：2009-07-23
申请人： Sung-Hwan Doh , Han-Ryang Lee , Sang-Ho Lee
发明人： Sung-Hwan Doh , Han-Ryang Lee , Sang-Ho Lee
IPC分类号： H04R9/06
CPC分类号： B06B1/045 , G10K9/13 , H04R9/025 , H04R9/10 , H04R2400/03
摘要： An integrated multifunctional micro speaker including a speaker frame having an upper portion (an outer portion) that is configured by a moving voice coil type speaker and a lower portion (an inner portion) that is configured by a moving magnet and weight type vibrator supported by a suspension, thereby reproducing a sound and a vibration. The multifunctional micro speaker includes a cylindrical speaker frame; a yoke having an end fixed to the cylindrical speaker frame; a speaker magnet fixed onto the yoke; a speaker plate fixed onto the speaker magnet; a diaphragm having an outer circumferential surface supported against the cylindrical speaker frame; a voice coil that is attached to the diaphragm so as to be disposed in a space formed between the speaker plate and the yoke; a suspension fixed to a lower portion of the speaker frame; a cylindrical weight attached to a central portion of the suspension; a lower plate attached onto the cylindrical weight and having the same shape as the cylindrical weight; a vibrator magnet attached onto the lower plate and having the same shape as the lower plate; an upper plate attached onto the vibrator magnet and having the same shape as the vibrator magnet; and a vibrator coil attached to the yoke.
摘要翻译：一种集成的多功能微型扬声器，包括具有由移动音圈型扬声器构成的上部（外部）和由移动磁体和重量型振动器构成的下部（内部）的扬声器框架，所述移动磁体和重量型振动器由悬挂，从而再现声音和振动。多功能微型扬声器包括一个圆柱形扬声器框架; 轭具有固定在圆柱形扬声器框架上的一端; 固定在轭上的扬声器磁体; 扬声器板固定在扬声器磁体上; 隔膜，其具有支撑在所述圆筒形扬声器框架上的外周面; 音圈，其附接到所述隔膜，以便布置在形成在所述扬声器板和所述轭之间的空间中; 固定到扬声器框架的下部的悬架; 连接到悬架的中心部分的圆柱形重物; 附着在圆柱形重物上并具有与圆柱形重量相同形状的下板; 安装在下板上并具有与下板相同形状的振动器磁体; 上板安装在振动磁体上并具有与振动磁体相同的形状; 以及附接到轭的振动器线圈。

96. 发明授权

US08039365B2 Integrated circuit package system including wafer level spacer 有权
标题翻译：集成电路封装系统，包括晶圆级隔离器
公开(公告)号：US08039365B2
公开(公告)日：2011-10-18
申请号：US11456845
申请日：2006-07-11
申请人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L25/0657 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06575 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.
摘要翻译：一种集成电路封装系统，其包括提供包括孔的晶片级间隔件，所述孔限定互连的单元间隔件，并且将所述单元间隔件配置为基本上对准在衬底内形成的器件。

97. 发明申请

US20110133325A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有互连的集成电路包装系统及其制造方法
公开(公告)号：US20110133325A1
公开(公告)日：2011-06-09
申请号：US12633789
申请日：2009-12-08
申请人： DongSoo Moon , Taewoo Lee , Soo-San Park , SooMoon Park , Sang-Ho Lee
发明人： DongSoo Moon , Taewoo Lee , Soo-San Park , SooMoon Park , Sang-Ho Lee
IPC分类号： H01L23/48 , H01L21/50 , H01L21/60 , H01L23/485
CPC分类号： H01L25/50 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/13099 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.
摘要翻译：一种集成电路封装系统的制造方法，包括：提供第一基板; 将部件安装在所述第一基板上; 将堆叠衬底安装在所述部件上，所述堆叠衬底具有内衬垫和连接到所述第一衬底的外衬垫; 将第一暴露的互连件安装在所述外垫上; 在所述堆叠衬底上形成第一封装，所述第一暴露的互连部分暴露，并且所述内衬垫部分地暴露在所述第一封装的凹部中; 以及将第二暴露的互连件安装在所述内垫上。

98. 发明申请

US20100320621A1 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH SIDE-BY-SIDE AND OFFSET STACKING AND METHOD FOR MANUFACTURING THEREOF 有权
标题翻译：具有侧面和偏移堆叠的集成电路封装封装系统及其制造方法
公开(公告)号：US20100320621A1
公开(公告)日：2010-12-23
申请号：US12871031
申请日：2010-08-30
申请人： Soo-San Park , BumJoon Hong , Sang-Ho Lee , Jong-Woo Ha
发明人： Soo-San Park , BumJoon Hong , Sang-Ho Lee , Jong-Woo Ha
IPC分类号： H01L23/538 , H01L21/60
CPC分类号： H01L23/3128 , H01L24/48 , H01L25/03 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/45014 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.
摘要翻译：一种用于制造集成电路封装包装系统的方法，包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

99. 发明授权

US07829986B2 Integrated circuit package system with net spacer 有权
标题翻译：集成电路封装系统，带网间隔
公开(公告)号：US07829986B2
公开(公告)日：2010-11-09
申请号：US11278411
申请日：2006-04-01
申请人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L23/495
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06575 , H01L2225/06593 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing an integrated circuit package system is provided including: forming a strip level net spacer including support bars, tie bars and paddles; configuring the support bars, the tie bars and the paddles to form four or more open regions around each of the paddles; and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices formed above first semiconductor devices and directly attached to the paddles.
摘要翻译：提供了一种用于制造集成电路封装系统的方法，包括：形成包括支撑杆，连接杆和桨叶的带状水平网间隔件; 配置支撑杆，连接杆和桨叶以在每个叶片周围形成四个或更多个开放区域; 并且连接支撑杆，连接杆和桨叶，以向在第一半导体器件上方形成并直接连接到桨叶上的垂直堆叠的半导体器件提供结构支撑。

100. 发明授权

US07659140B2 Integrated circuit system with a debris trapping system 有权
标题翻译：具有碎片捕集系统的集成电路系统
公开(公告)号：US07659140B2
公开(公告)日：2010-02-09
申请号：US11694933
申请日：2007-03-30
申请人： Taewoo Lee , Sang-Ho Lee , BoHan Yoon
发明人： Taewoo Lee , Sang-Ho Lee , BoHan Yoon
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L21/3043 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： An integrated circuit system including: providing an integrated circuit wafer having an integrated circuit side and a backside; mounting a protective adhesive on the integrated circuit side of the integrated circuit wafer; removing material from the backside of the integrated circuit wafer; and dicing the integrated circuit wafer through the protective adhesive to form an integrated circuit die.
摘要翻译：一种集成电路系统，包括：提供具有集成电路侧和背面的集成电路晶片; 在集成电路晶片的集成电路侧上安装保护性粘合剂; 从集成电路晶片的背面去除材料; 并且通过保护性粘合剂对集成电路晶片进行切割以形成集成电路管芯。

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