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91. 发明申请

US20080132095A1 METHOD OF MAKING A SOCKET TO PERFORM TESTING ON INTEGRATED CIRCUITS AND SOCKET MADE 审中-公开
标题翻译：制作插座对整体电路和插座进行测试的方法
公开(公告)号：US20080132095A1
公开(公告)日：2008-06-05
申请号：US12030037
申请日：2008-02-12
申请人： Igor Y. Khandros , Gaetan L. Mathieu , Carl V. Reynolds
发明人： Igor Y. Khandros , Gaetan L. Mathieu , Carl V. Reynolds
IPC分类号： H01R43/00 , H01R12/00
CPC分类号： G01R3/00 , G01R1/0433 , G01R1/0483 , G01R1/07378 , G01R31/2863 , H01L24/13 , H01L2224/131 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , Y10T29/49197 , Y10T29/49204 , Y10T29/4921 , Y10T29/49211 , Y10T29/49224 , Y10T29/53217 , Y10T29/53265 , H01L2924/014
摘要： A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.
摘要翻译：互连结构廉价地制造并且容易地插入到插座中。通过形成具有由具有与空腔对应的开口的掩模材料覆盖的空腔的牺牲衬底来制造互连结构。通过沉积导电材料，然后在开口内连接线并通过沉积更多导电材料进行另一电镀工艺来执行第一电镀工艺。通过首先去除掩模材料和牺牲衬底来完成互连结构。电线的端部与现在形成的接触结构相对联接到电路板。要完成插座，支持设备耦合到电路板以保持测试的集成电路。

92. 发明授权

US06274823B1 Interconnection substrates with resilient contact structures on both sides 失效
标题翻译：两侧具有弹性接触结构的互连基板
公开(公告)号：US06274823B1
公开(公告)日：2001-08-14
申请号：US08735812
申请日：1996-10-21
申请人： Igor Y. Khandros , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R909
CPC分类号： H05K7/1069 , B23K2101/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond. The component carries the contact structures on both sides, the spacing of the structures on the first side being different than that of the second side.
摘要翻译：一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。该部件在两侧承载接触结构，第一侧上的结构的间隔与第二侧不同。

93. 发明申请

US20090197484A1 CARBON NANOTUBE SPRING CONTACT STRUCTURES WITH MECHANICAL AND ELECTRICAL COMPONENTS 有权
标题翻译：碳纳米管弹簧接触结构与机械和电气部件
公开(公告)号：US20090197484A1
公开(公告)日：2009-08-06
申请号：US12421805
申请日：2009-04-10
申请人： Jimmy K. Chen , Treliant Fang , Michael Harburn , Igor Y. Khandros , Rodney I. Martens , Gaetan L. Mathieu , Alexander Slocum , Onnik Yaglioglu
发明人： Jimmy K. Chen , Treliant Fang , Michael Harburn , Igor Y. Khandros , Rodney I. Martens , Gaetan L. Mathieu , Alexander Slocum , Onnik Yaglioglu
IPC分类号： H01R13/02 , H01R43/16
CPC分类号： G01R1/06716 , G01R1/06744 , G01R1/06755 , G01R1/07357 , H01L23/49811 , H01L24/72 , H01L2924/01078 , H01L2924/01079 , H01L2924/19107 , Y10T29/49204
摘要： A composite spring contact structure includes a structural component and a conduction component distinct from each other and having differing mechanical and electrical characteristics. The structural component can include a group of carbon nanotubes. A mechanical characteristic of the composite spring contact structure can be dominated by a mechanical characteristic of the structural component, and an electrical characteristic of the composite spring contact structure can be dominated by an electrical characteristic of the conduction component. Composite spring contact structures can be used in probe cards and other electronic devices. Various ways of making contact structures are also disclosed.
摘要翻译：复合弹簧接触结构包括彼此不同的并具有不同机械和电特性的结构部件和导电部件。结构组分可以包括一组碳纳米管。复合弹簧接触结构的机械特性可以由结构部件的机械特性主导，并且复合弹簧接触结构的电特性可以由导电部件的电特性来支配。复合弹簧接触结构可用于探针卡和其他电子设备。还公开了制备接触结构的各种方式。

94. 发明授权

US06920689B2 Method for making a socket to perform testing on integrated circuits 失效
标题翻译：一种套接字在集成电路上进行测试的方法
公开(公告)号：US06920689B2
公开(公告)日：2005-07-26
申请号：US10310791
申请日：2002-12-06
申请人： Igor Y. Khandros , Gaetan L. Mathieu , Carl V. Reynolds
发明人： Igor Y. Khandros , Gaetan L. Mathieu , Carl V. Reynolds
IPC分类号： G01R1/04 , G01R1/073 , G01R3/00 , H01R43/02
CPC分类号： G01R3/00 , G01R1/0433 , G01R1/0483 , G01R1/07378 , G01R31/2863 , H01L24/13 , H01L2224/131 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , Y10T29/49197 , Y10T29/49204 , Y10T29/4921 , Y10T29/49211 , Y10T29/49224 , Y10T29/53217 , Y10T29/53265 , H01L2924/014
摘要： A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.
摘要翻译：互连结构廉价地制造并且容易地插入到插座中。通过形成具有由具有与空腔对应的开口的掩模材料覆盖的空腔的牺牲衬底来制造互连结构。通过沉积导电材料，然后在开口内连接线并通过沉积更多导电材料进行另一电镀工艺来执行第一电镀工艺。通过首先去除掩模材料和牺牲衬底来完成互连结构。电线的端部与现在形成的接触结构相对联接到电路板。要完成插座，支持设备耦合到电路板以保持测试的集成电路。

95. 发明授权

US06836962B2 Method and apparatus for shaping spring elements 失效
标题翻译：用于成形弹簧元件的方法和装置
公开(公告)号：US06836962B2
公开(公告)日：2005-01-04
申请号：US09753188
申请日：2000-12-29
申请人： Igor Y. Khandros , Thomas H. Dozier , Gary W. Grube , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Thomas H. Dozier , Gary W. Grube , Gaetan L. Mathieu
IPC分类号： B21D39/00 , B23K31/02 , H01R9/00
CPC分类号： B21D39/00 , B23K31/02 , H01R9/00 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49208 , Y10T29/49211 , Y10T29/49213
摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.
摘要翻译：通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子部件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触）电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯元件，以赋予期望的弹簧（弹性）特性所得到的复合互连元件。可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。成型工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。描述了在牺牲基板上制造互连元件的方法。还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。

96. 发明授权

US06476333B1 Raised contact structures (solder columns) 失效
标题翻译：凸起的接触结构（焊料柱）
公开(公告)号：US06476333B1
公开(公告)日：2002-11-05
申请号：US08735817
申请日：1996-10-21
申请人： Igor Y. Khandros , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R1204
CPC分类号： H05K7/1069 , B23K2101/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
摘要翻译：一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

97. 发明授权

US5926951A Method of stacking electronic components 失效
标题翻译：堆放电子元器件的方法
公开(公告)号：US5926951A
公开(公告)日：1999-07-27
申请号：US735813
申请日：1996-10-21
申请人： Igor Y. Khandros , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01L23/12 , C23C18/16 , C25D7/12 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/66 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R4/02 , H01R9/00 , H01R12/52 , H01R33/76 , H05K1/14 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1069 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R31/2884 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H05K3/308 , H05K3/326 , H05K3/3426 , H05K3/4015 , B23K2201/40 , G01R1/06761 , G01R3/00 , G01R31/2886 , H01L21/76897 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L24/45 , H01L24/49 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H05K3/3421 , H05K3/368 , H05K3/4092 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224
摘要： A method of stacking electronic components is disclosed. A first electronic component having a first interconnection substrate with a first set of contact pads on at least one surface thereof is provided. At least a first semiconductor device with resilient contact structures mounted thereto is provided. The first semiconductor device is positioned relative to the first electronic component with the resilient contact structures extending therefrom and electrically contacting the first set of contact pads of the first interconnection substrate.
摘要翻译：公开了一种堆叠电子部件的方法。提供了具有在其至少一个表面上具有第一组接触焊盘的第一互连基板的第一电子部件。提供了至少具有安装在其上的弹性接触结构的第一半导体器件。第一半导体器件相对于第一电子部件定位，其中弹性接触结构从其延伸并与第一组互连衬底的第一组接触焊盘电接触。

98. 发明授权

US5917707A Flexible contact structure with an electrically conductive shell 失效
标题翻译：具有导电外壳的柔性接触结构
公开(公告)号：US5917707A
公开(公告)日：1999-06-29
申请号：US340144
申请日：1994-11-15
申请人： Igor Y. Khandros , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01L23/12 , C23C18/16 , C25D7/12 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/66 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R4/02 , H01R9/00 , H01R12/52 , H01R33/76 , H05K1/14 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , H01R9/09 , H01R23/00
CPC分类号： H05K7/1069 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R31/2884 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H05K3/308 , H05K3/326 , H05K3/3426 , H05K3/4015 , B23K2201/40 , G01R1/06761 , G01R3/00 , G01R31/2886 , H01L21/76897 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L24/45 , H01L24/49 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H05K3/3421 , H05K3/368 , H05K3/4092 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224
摘要： An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
摘要翻译：一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

99. 发明授权

US07200930B2 Probe for semiconductor devices 失效
标题翻译：探头用于半导体器件
公开(公告)号：US07200930B2
公开(公告)日：2007-04-10
申请号：US11256514
申请日：2005-10-19
申请人： Igor Y. Khandros , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R43/00 , H05K3/00 , G01R1/067
CPC分类号： B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/06716 , G01R1/06744 , G01R1/07378 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/04042 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/49109 , H01L2224/73203 , H01L2224/73251 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/328 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K7/1069 , H05K2201/0311 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49179 , Y10T29/49204 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/48 , H01L2224/72
摘要： An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
摘要翻译：一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

100. 发明授权

US07084656B1 Probe for semiconductor devices 失效
公开(公告)号：US07084656B1
公开(公告)日：2006-08-01
申请号：US08735816
申请日：1996-10-21
申请人： Igor Y. Khandros , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： G01R1/073
CPC分类号： G01R1/073 , G01R1/07357 , H01L23/49811 , H01L24/13 , H01L24/14 , H01L24/72 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2224/04042 , H01L2224/05572 , H01L2224/11005 , H01L2224/13011 , H01L2224/13016 , H01L2224/13076 , H01L2224/131 , H01L2224/13124 , H01L2224/1329 , H01L2224/13339 , H01L2224/13552 , H01L2224/13562 , H01L2224/13582 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/14181 , H01L2224/16235 , H01L2224/16238 , H01L2224/1624 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/4813 , H01L2224/48132 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73203 , H01L2224/73251 , H01L2224/81192 , H01L2224/85444 , H01L2224/8592 , H01L2225/0651 , H01L2225/06572 , H01L2924/00014 , H01L2924/15151 , H01L2924/15153 , H01L2924/15312 , H01L2924/19041 , H01L2924/19103 , H01L2924/19104 , H01L2924/19107 , H05K3/32 , H05K3/4015 , H05K2201/10378 , H05K2201/10962 , H05K2203/049 , H01L2924/00 , H01L2924/013 , H01L2924/01082 , H01L2924/014 , H01L2924/00012 , H01L2224/16 , H01L2224/72 , H01L2224/4554
摘要： An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

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