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    • 94. 发明授权
    • Arrangement for determining a temperature loading of an integrated circuit and method
    • 用于确定集成电路的温度负载的方案和方法
    • US07198403B2
    • 2007-04-03
    • US11009969
    • 2004-12-10
    • Manfred PröllJürgen AugeStephan SchröderThomas Huber
    • Manfred PröllJürgen AugeStephan SchröderThomas Huber
    • G01K7/00
    • H01L22/34G01K1/024G01K7/01H01L2924/0002H01L2924/00
    • In an arrangement for determining a temperature loading during a soldering process, a semiconductor chip (1) comprises at least one contact (2) to be soldered or is electrically conductively connected to at least one contact (14d) to be soldered that is situated outside the semiconductor chip. The semiconductor chip (1) furthermore comprises a temperature sensor device (3), which determines a measurement quantity corresponding to the temperature. A processing device (4, 5) has an analog-to-digital converter (5), which is electrically conductively connected to the temperature sensor device (3) and converts the measurement quantity into at least one storable signal that represents the temperature loading. A voltage supply device (10), which is electrically conductively connected to the temperature sensor device (3) and the processing device (4, 5), supplies these components with an operating voltage. A data memory (6) serves for storing the at least one storable signal. An electrical line (7, 11) connected to the data memory (6) serves for outputting the stored signal. As a result, it is possible to monitor temperature loadings of the semiconductor chip also outside the sphere of influence of the semiconductor manufacturer.
    • 在用于确定在焊接过程期间的温度负载的布置中,半导体芯片(1)包括至少一个要被焊接的触点(2)或者导电地连接到至少一个待焊接的触点(14d) 在半导体芯片之外。 半导体芯片(1)还包括温度传感器装置(3),其确定与温度相对应的测量量。 处理装置(4,5)具有电导体连接到温度传感器装置(3)的模拟数字转换器(5),并将测量量转换成表示温度负载的至少一个可存储信号。 与温度传感器装置(3)和处理装置(4,5)导电连接的电压供给装置(10)向这些部件提供工作电压。 数据存储器(6)用于存储至少一个可存储信号。 连接到数据存储器(6)的电线(7,11)用于输出所存储的信号。 因此,可以在半导体制造商的影响范围之外监视半导体芯片的温度负载。
    • 97. 发明申请
    • Arrangement for determining a temperature loading of an integrated circuit and method
    • 用于确定集成电路的温度负载的方案和方法
    • US20050226309A1
    • 2005-10-13
    • US11009969
    • 2004-12-10
    • Manfred ProllJurgen AugeStephan SchroderThomas Huber
    • Manfred ProllJurgen AugeStephan SchroderThomas Huber
    • G01K1/02G01K7/01H01L23/544G01K7/00
    • H01L22/34G01K1/024G01K7/01H01L2924/0002H01L2924/00
    • In an arrangement for determining a temperature loading during a soldering process, a semiconductor chip (1) comprises at least one contact (2) to be soldered or is electrically conductively connected to at least one contact (14d) to be soldered that is situated outside the semiconductor chip. The semiconductor chip (1) furthermore comprises a temperature sensor device (3), which determines a measurement quantity corresponding to the temperature. A processing device (4, 5) has an analog-to-digital converter (5), which is electrically conductively connected to the temperature sensor device (3) and converts the measurement quantity into at least one storable signal that represents the temperature loading. A voltage supply device (10), which is electrically conductively connected to the temperature sensor device (3) and the processing device (4, 5), supplies these components with an operating voltage. A data memory (6) serves for storing the at least one storable signal. An electrical line (7, 11) connected to the data memory (6) serves for outputting the stored signal. As a result, it is possible to monitor temperature loadings of the semiconductor chip also outside the sphere of influence of the semiconductor manufacturer.
    • 在用于确定在焊接过程期间的温度负载的布置中,半导体芯片(1)包括至少一个要被焊接的触点(2)或者导电地连接到至少一个待焊接的触点(14d) 在半导体芯片之外。 半导体芯片(1)还包括温度传感器装置(3),其确定与温度相对应的测量量。 处理装置(4,5)具有电导体连接到温度传感器装置(3)的模拟数字转换器(5),并将测量量转换成表示温度负载的至少一个可存储信号。 与温度传感器装置(3)和处理装置(4,5)导电连接的电压供给装置(10)向这些部件提供工作电压。 数据存储器(6)用于存储至少一个可存储信号。 连接到数据存储器(6)的电线(7,11)用于输出所存储的信号。 因此,可以在半导体制造商的影响范围之外监视半导体芯片的温度负载。
    • 99. 发明授权
    • Adapter apparatus for memory modules
    • 内存模块适配器
    • US06788548B2
    • 2004-09-07
    • US10377349
    • 2003-02-28
    • Manfred DoblerThomas Huber
    • Manfred DoblerThomas Huber
    • H05K702
    • G06F1/185G06F1/184G06F1/186G11C5/04H01R12/721H01R31/005H01R31/065H05K1/117H05K1/14H05K1/141
    • An adapter apparatus for receiving memory modules, each of which has a plurality of data terminals and a plurality of control terminals, comprises first data terminals, first control terminals, a first socket for receiving a first memory module with second data terminals and second control terminals, wherein the second data terminals are associated to the data terminals of the first memory module, wherein the second control terminals are associated to the control terminals of the first memory module, a second socket for receiving a second memory module with third data terminals and third control terminals, wherein the third data terminals are associated to the data terminals of the second memory module, wherein the third control terminals are associated to the control terminals of the second memory module, a signal transformation circuit with an input and an output, wherein the input is connected to the first control terminals, and wherein the output is connected to the second control terminals and to the third control terminals, and wherein a second group of first data terminals is connected to the third data terminals.
    • 一种用于接收存储器模块的适配器装置,每个存储器模块具有多个数据终端和多个控制终端,包括第一数据终端,第一控制终端,用于接收具有第二数据终端的第一存储器模块的第一插槽和第二控制终端 ,其中所述第二数据终端与所述第一存储器模块的数据终端相关联,其中所述第二控制终端与所述第一存储器模块的控制端相关联;第二插槽,用于接收具有第三数据终端的第二存储器模块和第三存储器模块 控制终端,其中第三数据终端与第二存储器模块的数据终端相关联,其中第三控制终端与第二存储器模块的控制端相关联,具有输入和输出的信号变换电路,其中, 输入连接到第一控制端,并且其中输出连接到第二控制 终端和第三控制终端,并且其中第二组第一数据终端连接到第三数据终端。
    • 100. 发明授权
    • Foot liner
    • 脚衬
    • US06766539B1
    • 2004-07-27
    • US10413717
    • 2003-04-15
    • Thomas Huber
    • Thomas Huber
    • A43B1708
    • A43B17/105A41B11/10A43B1/0045A43B19/00Y10S2/01
    • A foot liner comprising an insert positioned within the interior of a shoe, an exterior, a fastener and a bottom liner. The invention may also include deodorizer, talc and/or medicated athletes foot powder. The absorption and neutralization of odors, which may be associated with perspiration of the foot, are also achieved. The use of this product could reduce embarrassment associated with removing one's shoes while also providing individuals with enhanced comfort. The foot liner would also allow individuals to various articles of footwear without the need for socks.
    • 一种脚衬,其包括位于鞋的内部内部的插入件,外部,紧固件和底部衬套。 本发明还可以包括除臭剂,滑石粉和/或药物运动员脚粉。 气味的吸收和中和也可能与脚出汗有关。 使用这种产品可以减少与去除鞋子相关的尴尬,同时为个人提供更好的舒适度。 脚垫也将允许个人对各种鞋类物品而不需要袜子。