专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明授权

US08918589B2 Memory controller, memory system, semiconductor integrated circuit, and memory control method 有权
标题翻译：存储控制器，存储器系统，半导体集成电路和存储器控制方法
公开(公告)号：US08918589B2
公开(公告)日：2014-12-23
申请号：US12988396
申请日：2009-04-21
申请人： Koji Asai , Tetsuji Mochida , Daisuke Imoto , Takashi Yamada , Wataru Ohkoshi
发明人： Koji Asai , Tetsuji Mochida , Daisuke Imoto , Takashi Yamada , Wataru Ohkoshi
IPC分类号： G06F12/02 , G06F13/16 , G06F12/08 , G06F9/45
CPC分类号： G06F13/1642 , G06F8/4442 , G06F12/0862 , G06F2212/6022
摘要： A memory controller (101) according to this invention includes: a command generation unit (102) which generates access commands each including a physical address, based on an access request including a logical address indicating a rectangular area in image data; and a command issuance unit (105) which issues, to a memory (0), the access commands generated by the command generation unit (102). The command generation unit (102) includes a group determination unit (104) which determines a group to which a bank including data to be accessed belongs, based on the physical address corresponding to the access request. The command generation unit (102) generates a pair of a first and a second access commands which share a prefetch buffer between two banks belonging to different groups, when data to be accessed is continuous across two banks belonging to different groups.
摘要翻译：根据本发明的存储器控制器（101）包括：命令产生单元（102），其基于包括指示图像数据中的矩形区域的逻辑地址的访问请求，生成包括物理地址的访问命令; 以及向存储器（0）发出由命令生成单元（102）生成的访问命令的命令发布单元（105）。命令生成单元（102）包括：组决定单元（104），其基于与访问请求对应的物理地址，确定包含要访问的数据的存储体所属的组。命令生成单元（102）生成一对第一和第二访问命令，当要访问的数据在属于不同组的两个存储体中是连续的时，共享一个属于不同组的两个存储体之间的预取缓冲器。

92. 发明授权

US08815019B2 Bonding wire for semiconductor 有权
标题翻译：半导体用导线
公开(公告)号：US08815019B2
公开(公告)日：2014-08-26
申请号：US12993401
申请日：2010-02-12
申请人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Ryo Oishi , Daizo Oda
发明人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Ryo Oishi , Daizo Oda
IPC分类号： B23K35/34
CPC分类号： C22C5/02 , B32B15/018 , C22C5/04 , C22C5/06 , C22C9/00 , C22C21/02 , C22C21/12 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/45686 , H01L2224/4569 , H01L2224/48011 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/00011 , H01L2924/00015 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3025 , Y10T428/12222 , H01L2924/01001 , H01L2924/00014 , H01L2924/20754 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/01202 , H01L2924/01007 , H01L2924/01205 , H01L2224/45639 , H01L2224/45669 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20656 , H01L2924/20652 , H01L2924/20645 , H01L2924/20654 , H01L2924/20655 , H01L2924/00 , H01L2224/48227 , H01L2224/48824 , H01L2924/013 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.
摘要翻译：本发明的目的是提供一种能够同时实现滚珠接合性能和线加工性的多层线材，并且提高了环路稳定性，拉伸强度和楔形粘合性能。半导体接合线包括主要由等于或大于一种以下元素构成的芯部件：Cu，Au和Ag，以及形成在芯部件上并主要由Pd构成的外层。总线中含有的总氢浓度在0.0001〜0.008质量％的范围内。

93. 发明授权

US08653668B2 Copper bonding wire for semiconductor device and bonding structure thereof 有权
标题翻译：半导体器件用铜接合线及其接合结构
公开(公告)号：US08653668B2
公开(公告)日：2014-02-18
申请号：US13577199
申请日：2011-02-03
申请人： Tomohiro Uno , Takashi Yamada , Atsuo Ikeda
发明人： Tomohiro Uno , Takashi Yamada , Atsuo Ikeda
IPC分类号： H01L23/49
CPC分类号： H01L24/48 , B23K35/0244 , B23K35/3046 , C22C9/00 , C22F1/08 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/48453 , H01L2224/48463 , H01L2224/48507 , H01L2224/48799 , H01L2224/48824 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/181 , H01L2924/20104 , H01L2924/20105 , H01L2924/01032 , H01L2924/00012 , H01L2924/00 , H01L2924/013 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/01049 , H01L2924/01203 , H01L2924/00013 , H01L2924/01004 , H01L2924/01204
摘要： A bonding structure and a copper bonding wire for semiconductor device include a ball-bonded portion formed by bonding to the aluminum electrode a ball formed on a front end of the copper bonding wire. After being heated at any temperature between 130° C. and 200° C., the ball-bonded portion exhibits a relative compound ratio R1 of 40-100%, the relative compound ratio R1 being a ratio of a thickness of a Cu—Al intermetallic compound to thicknesses of intermetallic compounds that are composed of Cu and Al and formed on a cross-sectional surface of the ball-bonded portion.
摘要翻译：用于半导体器件的接合结构和铜接合线包括通过将形成在铜接合线的前端上的球接合到铝电极而形成的滚珠接合部。在130℃至200℃之间的任何温度下加热后，球形接合部分的相对化合物比率R1为40-100％，相对化合物比例R1为Cu-Al 金属间化合物与由Cu和Al组成并形成在球形接合部分的横截面上的金属间化合物的厚度。

94. 发明授权

US08571236B2 Volume control system, controller, and amplifying apparatus 有权
标题翻译：音量控制系统，控制器和放大装置
公开(公告)号：US08571236B2
公开(公告)日：2013-10-29
申请号：US12861956
申请日：2010-08-24
申请人： Takashi Yamada , Kazushige Otsu
发明人： Takashi Yamada , Kazushige Otsu
IPC分类号： H03G3/00
CPC分类号： H03G3/04 , G06F3/165 , H03G3/002
摘要： A volume control system comprises: an amplifying apparatus; and a controller connectable to the amplifying apparatus. The amplifying apparatus includes; a first receiving section for receiving a volume value from the controller, a first input section into which an instruction for changing the volume value is input by a user's operation, a first transmitting section for transmitting the volume value input into the first input section to the controller, and a volume control section for, when the first receiving section receives the volume value or the changed volume value is input into the first input section, controlling a volume value of the amplifying apparatus based on the volume value. The controller includes; a display section for displaying the volume value on a display device, a second receiving section for receiving the volume value from the amplifying apparatus, a changing section for changing the volume value to be displayed on the display device by the display section into the volume value received by the second receiving section; a second input section into which an instruction for changing the volume value to be displayed on the display device by the display section is input by a user's operation; and a second transmitting section for, when the instruction for changing the volume value to be displayed on the display device by the display section is input by the user's operation, transmitting the changed volume value to the amplifying apparatus.
摘要翻译：音量控制系统包括：放大装置; 以及可连接到放大装置的控制器。放大装置包括：用于从控制器接收音量值的第一接收部分，用户操作输入用于改变音量值的指令的第一输入部分，用于将输入到第一输入部分的音量值传送到第一输入部分的第一发送部分，控制器和音量控制部分，用于当第一接收部分接收到音量值或改变的音量值被输入到第一输入部分时，基于音量值控制放大装置的音量值。控制器包括用于在显示装置上显示音量值的显示部分，用于从放大装置接收音量值的第二接收部分，用于将由显示部分显示在显示装置上的音量值改变为音量值的改变部分由第二接收部分收到; 第二输入部，通过用户的操作输入用于改变由显示部显示在显示装置上的音量值的指令; 以及第二发送部，用于当通过用户的操作输入用于改变由显示部显示在显示装置上的音量值的指令时，将改变的音量值发送到放大装置。

95. 发明授权

US08467635B2 Optical modulator 有权
标题翻译：光调制器
公开(公告)号：US08467635B2
公开(公告)日：2013-06-18
申请号：US13129680
申请日：2009-12-02
申请人： Yoshiyuki Doi , Takashi Yamada , Yohei Sakamaki , Akimasa Kaneko
发明人： Yoshiyuki Doi , Takashi Yamada , Yohei Sakamaki , Akimasa Kaneko
IPC分类号： G02F1/035 , G02F1/225
CPC分类号： G02F1/225 , G02F1/2257 , G02F2001/212 , G02F2001/217 , G02F2202/09 , G02F2202/20 , G02F2202/28 , G02F2203/20 , G02F2203/21
摘要： An optical modulator having a high stability is provided. In the optical modulator according to the present invention, a phase modulation by an electro-optic effect is made on an optical substrate of an electro-optic material while the setting of an operating point by a thermal-optic effect is made on a planar lightwave circuit (PLC) substrate of quartz, silicon, or the like. Such configuration can suppress the influence of thermal drift or the like because no heat is applied directly to the optical substrate of the electro-optic material. In addition, breakage and warpage of the substrate due to heat are also mitigated. Further, quartz used for the PLC has a low thermal conductivity, approximately one-fifth of that of the LN substrate (approximately 1 W/(m·K)), and therefore, a desired phase difference can be maintained with a low power consumption, and thus, the operating point becomes stabilized.
摘要翻译：提供了具有高稳定性的光调制器。在根据本发明的光调制器中，在电光材料的光学基板上进行通过电光效应的相位调制，同时通过热光学效应设置工作点在平面光波石英，硅等的电路（PLC）基板。这种构造可以抑制热漂移等的影响，因为没有热直接施加到电光材料的光学基板。此外，还减轻了由于热而引起的基板的断裂和翘曲。此外，用于PLC的石英具有低导热性，大约是LN衬底的约五分之一（约1W /（m·K）），因此可以以低功耗维持期望的相位差因此，工作点变得稳定。

96. 发明申请

US20130058704A1 SQUEEZE CONTAINER 有权
公开(公告)号：US20130058704A1
公开(公告)日：2013-03-07
申请号：US13638988
申请日：2011-04-01
申请人： Takashi Yamada , Yoshinori Inagawa
发明人： Takashi Yamada , Yoshinori Inagawa
IPC分类号： B05C17/005 , B65B1/04
CPC分类号： B65D83/0055 , A45D19/02 , A45D34/042 , A45D2024/345 , A45D2200/052 , A45D2200/056 , A61M35/00 , B05B9/0822 , B05B9/0838 , B05B11/00 , B05B11/00412 , B05B11/00414 , B05B11/0056 , B05B11/0097 , B05B11/048 , B65D25/56
摘要： A squeeze container (1) of the present invention includes a concave storage portion (2) in which a content is stored, a sheet-shaped elastic body (3) which is arranged to cover an opening portion of the storage portion (2), pressurization means (4) which swells the elastic body (3) to the storage portion (2) side with gas pressure, and a delivery passage (5) which provides communication between the inside and outside of the storage portion (2) and which delivers the content squeezed by the elastic body (3) to the outside. It is preferable that the pressurization means (4) is structured to be capable of gradually swelling the elastic body (3) by repeating squeezing with a hand and releasing thereof.
摘要翻译：本发明的挤压容器（1）包括：容纳部件的凹部收纳部（2），设置成覆盖收纳部（2）的开口部的片状弹性体（3）加压装置（4），其利用气体压力将弹性体（3）膨胀到储存部分（2）侧;以及输送通道（5），其在储存部分（2）的内部和外部之间提供连通并且输送由弹性体（3）挤压到外部的内容物。优选的是，加压装置（4）被构造成能够通过用手重复挤压并释放弹性体（3）而逐渐膨胀。

97. 发明授权

US08299356B2 Bonding wire for semiconductor devices 有权
标题翻译：半导体器件用接合线
公开(公告)号：US08299356B2
公开(公告)日：2012-10-30
申请号：US12669662
申请日：2008-12-02
申请人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
发明人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
IPC分类号： H01B7/00
CPC分类号： C22C5/04 , B23K35/0222 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , C22C5/02 , C22C5/06 , C22C9/00 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4851 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48839 , H01L2224/48844 , H01L2224/78301 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/851 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01203 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3011 , H01L2924/3025 , H01L2924/3861 , H01L2924/01028 , H01L2924/01046 , H01L2924/01004 , H01L2924/0102 , H01L2924/01078 , H01L2924/01005 , H01L2924/01015 , H01L2924/01083 , H01L2924/01014 , H01L2924/01029 , H01L2924/20652 , H01L2924/20656 , H01L2924/20754 , H01L2924/20755 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/00014 , H01L2924/01202 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/0104 , H01L2924/01007 , H01L2924/01018 , H01L2924/01001 , H01L2924/20658 , H01L2924/20654 , H01L2224/48824 , H01L2924/00 , H01L2924/013 , H01L2924/00013 , H01L2924/2075 , H01L2924/01049 , H01L2924/01006
摘要： A semiconductor-device bonding wire includes a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. An orientation ratio of orientations in crystalline orientations in a wire lengthwise direction at a crystal face of a surface of the skin layer is greater than or equal to 50%, and the orientations have an angular difference relative to the wire lengthwise direction, the angular difference being within 15 degrees.
摘要翻译：半导体器件接合线包括由导电金属形成的芯部件和主要由与芯部件不同的面心立方金属形成的表皮层。在表层的表面的晶面处的线长度方向上的结晶取向<111k方向的取向比大于或等于50％，并且<111>取向具有相对的角度差在线长度方向上，角度差在15度以内。

98. 发明申请

US20120171595A1 POWER GENERATION CELL FOR SOLID ELECTROLYTE FUEL CELL AND STRUCTURE OF FUEL ELECTRODE THEREOF 审中-公开
标题翻译：固体电解质燃料电池的发电单元及其燃料电极的结构
公开(公告)号：US20120171595A1
公开(公告)日：2012-07-05
申请号：US13406642
申请日：2012-02-28
申请人： Takashi Yamada , Norikazu Komada
发明人： Takashi Yamada , Norikazu Komada
IPC分类号： H01M4/86 , H01M8/10 , B82Y30/00
CPC分类号： H01M8/1246 , B22F2301/15 , B22F2302/25 , B22F2303/40 , B22F2998/00 , C04B35/01 , C04B35/6262 , C04B2235/3206 , C04B2235/3213 , C04B2235/3227 , C04B2235/3275 , C04B2235/3286 , C04B2235/5436 , C04B2235/6025 , H01M4/8621 , H01M4/8642 , H01M4/8652 , H01M4/8803 , H01M4/8835 , H01M4/8846 , H01M4/8885 , H01M4/90 , H01M4/9066 , H01M4/9075 , H01M4/92 , H01M4/98 , H01M2004/8684 , H01M2008/1293 , Y02E60/525 , Y02P70/56 , B22F3/11
摘要： Provided is a power generation cell for a solid electrolyte fuel cell using a lanthanum gallate solid electrolyte as a solid electrolyte, particularly a structure of a fuel electrode of the power generation cell for the solid electrolyte fuel cell. The fuel electrode is of a power generation cell for a solid electrolyte fuel cell in which particles (2) of a B-doped ceria (wherein, B represents one or two or more of Sm, La, Gd, Y and Ca) are attached to the surface of the framework of porous nickel having a framework structure in which a network is formed by mutual sintering of nickel particles (1). The ceria particles (2) are distributed with the highest density and attached around the framework structure portions (3) the sectional areas of which are made small by the mutual sintering of the nickel particles (1) to be bonded to each other.
摘要翻译：本发明提供一种使用无铼酸镓固体电解质作为固体电解质的固体电解质型燃料电池的发电电池，特别是固体电解质型燃料电池用发电电池的燃料电极的结构。燃料电极是固体电解质燃料电池的发电电池，其中附着有B掺杂二氧化铈（其中，B表示Sm，La，Gd，Y和Ca中的一种或两种以上）的颗粒（2）通过镍颗粒（1）的相互烧结而形成网状结构的多孔镍的骨架表面。二氧化铈颗粒（2）以最高的密度分布，并且通过相互结合的镍颗粒（1）的相互烧结使其截面积较小的骨架结构部分（3）附着。

99. 发明授权

US08053684B2 Mounting structure and method for mounting electronic component onto circuit board 失效
标题翻译：将电子元件安装到电路板上的安装结构和方法
公开(公告)号：US08053684B2
公开(公告)日：2011-11-08
申请号：US12158904
申请日：2006-12-19
申请人： Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
发明人： Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
IPC分类号： H01L23/28
CPC分类号： B29C45/14655 , B29C2045/14983 , H01L21/565 , H01L23/3135 , H01L27/14618 , H01L31/0203 , H01L33/483 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K3/326 , H05K2201/09081 , H05K2201/091 , H05K2201/10106 , H05K2201/10636 , H05K2201/10727 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
摘要翻译：电子部件安装结构包括其上形成有端子连接图案的柔性电路板和设置有电极的发光部件。将发光部件放置在柔性电路板上，将合成树脂壳体注射成型以覆盖发光部件和围绕放置在其上的发光部件的柔性电路基板的一部分，由此，柔性电路板的发光部件和端子连接图案彼此抵靠接触地连接。

100. 发明申请

US20110171639A1 POLYMER FOR DETECTION OF TARGET SUBSTANCE, AND METHOD FOR DETECTION OF TARGET SUBSTANCE 审中-公开
标题翻译：用于检测目标物质的聚合物和用于检测目标物质的方法
公开(公告)号：US20110171639A1
公开(公告)日：2011-07-14
申请号：US12734362
申请日：2008-10-30
申请人： Motohito Kanashima , Chikako Hakii , Mitsugu Usui , Takashi Yamada , Hiroaki Honma
发明人： Motohito Kanashima , Chikako Hakii , Mitsugu Usui , Takashi Yamada , Hiroaki Honma
IPC分类号： C12Q1/68 , C07H21/04
CPC分类号： G01N33/5308 , C12Q1/6832 , G01N33/531 , C12Q2563/131 , C12Q2525/313
摘要： Provided is a method of detecting a target substance by which the target substance can be detected with efficiency and a high sensitivity, and in a simple manner, a target substance detection polymer used in the method, and a method of forming the polymer. The method of detecting a target substance includes the steps of: (A) forming a target substance detection polymer by causing multiple kinds of nucleic acid probes for forming a polymer to react with a binding probe having a region capable of binding to the target substance and a region capable of binding to at least one of the nucleic acid probes in a solution; (B) binding the target substance detection polymer and the target substance; and (C) detecting the target substance detection polymer to which the target substance is bound.
摘要翻译：本发明提供了一种检测目标物质的方法，其特征在于，检测目标物质的效率和灵敏度，并且以简单的方式检测该方法中使用的目标物质检测聚合物，以及形成聚合物的方法。检测目标物质的方法包括以下步骤：（A）通过使多种用于形成聚合物的核酸探针与具有能够与目标物质结合的区域的结合探针反应而形成靶物质检测聚合物，以及能够与溶液中的至少一个核酸探针结合的区域; （B）结合目标物质检测聚合物和目标物质; 和（C）检测靶物质结合到其上的目标物质检测聚合物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式