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91. 发明授权

US07101273B2 Carrier head with gimbal mechanism 有权
标题翻译：承载头与万向架机构
公开(公告)号：US07101273B2
公开(公告)日：2006-09-05
申请号：US11237062
申请日：2005-09-28
申请人： Ming-Kuei Tseng , Steven M. Zuniga
发明人： Ming-Kuei Tseng , Steven M. Zuniga
IPC分类号： B24B5/00
CPC分类号： B24B37/30
摘要： A carrier head includes a housing connectable to a drive shaft to rotate therewith, a lower assembly having a substrate mounting surface, and a gimbal mechanism that connects the housing to the lower assembly to permit the lower assembly to pivot with respect to the housing about an axis substantially parallel to the polishing surface. The gimbal mechanism includes a shaft having an upper end slidably disposed in a vertical passage in a vertical passage in the housing, and a lower member that connects a lower end of the shaft to the lower assembly. The lower member bends to permit the base to pivot with respect to the housing. The shaft and the lower member are a unitary body.
摘要翻译：载体头包括可连接到驱动轴以与其一起旋转的壳体，具有基板安装表面的下部组件和将壳体连接到下部组件的万向节机构，以允许下部组件相对于壳体绕枢轴转动基本上平行于抛光表面。万向架机构包括：轴，其上端部可滑动地设置在壳体中的垂直通道中的垂直通道中;以及下部构件，其将轴的下端连接到下部组件。下部构件弯曲以允许基部相对于壳体枢转。轴和下部构件是一体的。

92. 发明授权

US06872122B2 Apparatus and method of detecting a substrate in a carrier head 有权
标题翻译：检测载体头中的基底的装置和方法
公开(公告)号：US06872122B2
公开(公告)日：2005-03-29
申请号：US10670888
申请日：2003-09-24
申请人： Steven M. Zuniga
发明人： Steven M. Zuniga
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , B24B51/00 , B24B49/00
CPC分类号： B24B37/32 , B24B37/30 , B24B49/16
摘要： A method of detecting a substrate in a carrier head for a chemical mechanical polishing system includes connecting a chamber in a carrier head to a pressure source, measuring the pressure in the chamber as a function of time, calculating the derivative of the pressure in the chamber, and determining whether the substrate is adjacent a substrate receiving surface in the carrier head from the derivative.
摘要翻译：一种检测用于化学机械抛光系统的载体头中的基底的方法包括将载体头中的腔室连接到压力源，测量腔室中的压力作为时间的函数，计算腔室中的压力的导数并且从所述导数确定所述衬底是否与所述载体头中的衬底接收表面相邻。

93. 发明授权

US06835125B1 Retainer with a wear surface for chemical mechanical polishing 有权
标题翻译：具有化学机械抛光磨损表面的保持器
公开(公告)号：US06835125B1
公开(公告)日：2004-12-28
申请号：US10327235
申请日：2002-12-20
申请人： Ming-Kuei Tseng , Michael Richter , Steven M. Zuniga
发明人： Ming-Kuei Tseng , Michael Richter , Steven M. Zuniga
IPC分类号： B24B4702
CPC分类号： B24B37/32
摘要： A retaining ring has an inner core of a first material and an outer layer of a second, different material that is deposited on the first material. The outer layer can be deposited by spraying, e.g., by powder coating, and can be a polymer, e.g., polyetheretherketone.
摘要翻译：保持环具有第一材料的内芯和沉积在第一材料上的第二不同材料的外层。外层可以通过例如通过粉末涂覆的喷涂沉积，并且可以是聚合物，例如聚醚醚酮。

94. 发明授权

US06602114B1 Multilayer retaining ring for chemical mechanical polishing 失效
标题翻译：用于化学机械抛光的多层固定环
公开(公告)号：US06602114B1
公开(公告)日：2003-08-05
申请号：US09574391
申请日：2000-05-19
申请人： Junshi Wang , Steven M. Zuniga
发明人： Junshi Wang , Steven M. Zuniga
IPC分类号： B24B100
CPC分类号： B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion. A shim can be inserted between the retaining ring and a base of the carrier head to improve the retaining ring lifetime. A seal may be inserted between the retaining ring and a flexible membrane to seal the chamber between the flexible membrane and the base.
摘要翻译：用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。可以在保持环和承载头的基座之间插入垫片，以改善保持环的使用寿命。可以在保持环和柔性膜之间插入密封件，以密封柔性膜和基底之间的腔室。

95. 发明授权

US5957751A Carrier head with a substrate detection mechanism for a chemical mechanical polishing system 失效
公开(公告)号：US5957751A
公开(公告)日：1999-09-28
申请号：US862350
申请日：1997-05-23
申请人： Boris Govzman , Steven M. Zuniga , Hung Chen , Sasson Somekh
发明人： Boris Govzman , Steven M. Zuniga , Hung Chen , Sasson Somekh
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B49/00
CPC分类号： B24B37/30 , B24B37/0053
摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

96. 发明授权

US5762544A Carrier head design for a chemical mechanical polishing apparatus 失效
标题翻译：用于化学机械抛光设备的载体头设计
公开(公告)号：US5762544A
公开(公告)日：1998-06-09
申请号：US637208
申请日：1996-04-24
申请人： Steven M. Zuniga , Stephen J. Blumenkranz
发明人： Steven M. Zuniga , Stephen J. Blumenkranz
IPC分类号： B24B37/30 , B24B41/04 , H01L21/687 , B24B5/00 , B24B29/00
CPC分类号： H01L21/68785 , B24B37/30 , B24B41/04 , H01L21/68792
摘要： A carrier head uses a pressure chamber and a gimbal. The gimbal allows the carrier base to pivot with respect to the drive shaft about a point at the interface between the substrate and the polishing pad. The gimbal may "float" so that no downward force is applied to the substrate through the gimbal. A rolling diaphragm seals the carrier base to the carrier housing to form a chamber. By pressurizing the chamber, an even load can be applied across the substrate. A retaining ring is independently loaded by an inflatable bladder. Torque is transferred from the carrier housing to the carrier base by horizontal pins positioned near the substrate. The pins can slide vertically in the housing, but not laterally. However, there is sufficiently elasticity to allow the torque pins to comply with manufacturing tolerances so that both torque pins bear the rotational load.
摘要翻译：承载头使用压力室和万向节。万向节允许载体基座相对于驱动轴绕基板和抛光垫之间的界面处的点枢转。万向架可以“浮动”，使得通过万向节不会向基板施加向下的力。滚动隔膜将载体基部密封到载体壳体以形成室。通过对腔室加压，可以跨越衬底施加均匀的负载。保持环由充气气囊独立地装载。扭矩通过位于基板附近的水平销从载体壳体转移到载体基座。销可以在外壳中垂直滑动，但不能横向滑动。然而，具有足够的弹性以允许扭矩销符合制造公差，使得两个扭矩销承受转动负载。

97. 发明申请

US20200276686A1 Retainer for Chemical Mechanical Polishing Carrier Head 审中-公开
公开(公告)号：US20200276686A1
公开(公告)日：2020-09-03
申请号：US16799688
申请日：2020-02-24
申请人： Andrew J. Nagengast , Steven M. Zuniga
发明人： Andrew J. Nagengast , Steven M. Zuniga
IPC分类号： B24B37/32
摘要： A carrier head for chemical mechanical polishing includes a base, an actuator, a substrate mounting surface, and a retainer. The retainer includes an inner section and an outer section connected by a flexure. A bottom of the inner section of the retainer provides an inner portion of a lower surface configured to contact a polishing pad. An inner surface of the inner section extends upwardly from an inner edge of the lower surface to circumferentially surround the substrate mounting surface. The inner section of the retainer is positioned to receive a controllable load from the actuator and is vertically movable relative to the base. A bottom of the outer section of the retainer provides an outer portion of the lower surface. The outer section of the retainer is vertically fixed to the base. The inner section of the retainer is vertically movable relative to the outer section of the retainer.

98. 发明申请

US20200246841A1 Substrate Cleaning Devices and Methods Thereof 审中-公开
公开(公告)号：US20200246841A1
公开(公告)日：2020-08-06
申请号：US16777432
申请日：2020-01-30
申请人： Steven M. Zuniga , Jay Gurusamy , Jagan Rangarajan
发明人： Steven M. Zuniga , Jay Gurusamy , Jagan Rangarajan
IPC分类号： B08B1/00 , H01L21/67 , H01L21/02 , B08B3/08
摘要： A substrate cleaning device may include a chamber body configured to hold a substrate and a brush assembly. The brush assembly may include a first roller, a second roller, and a belt extending between the first roller and the second roller. At least one of the first roller and the second roller may be movable between a first position where the belt contacts a first surface of a substrate disposed in the chamber body and a second position where the belt is spaced from the first surface. Other substrate cleaning devices and methods of cleaning substrates are disclosed.

99. 发明申请

US20200234995A1 Wafer Processing Tools and Methods Thereof 审中-公开
公开(公告)号：US20200234995A1
公开(公告)日：2020-07-23
申请号：US16738798
申请日：2020-01-09
申请人： Jagan Rangarajan , Edward Golubovsky , Shaun Van Der Veen , Justin Ho Kuen Wong , Steven M. Zuniga
发明人： Jagan Rangarajan , Edward Golubovsky , Shaun Van Der Veen , Justin Ho Kuen Wong , Steven M. Zuniga
IPC分类号： H01L21/687 , B24B41/06 , H01L21/677
摘要： A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.

100. 发明授权

US08545660B1 Bonding apparatus and method 失效
标题翻译：接合装置及方法
公开(公告)号：US08545660B1
公开(公告)日：2013-10-01
申请号：US13424984
申请日：2012-03-20
申请人： Steven M. Zuniga , Robert D. Tolles , Derek G. Aqui , Andrew J. Nagengast , Anthony J. Senn , Keenan Leon Guerrero
发明人： Steven M. Zuniga , Robert D. Tolles , Derek G. Aqui , Andrew J. Nagengast , Anthony J. Senn , Keenan Leon Guerrero
IPC分类号： B32B37/00
CPC分类号： B32B37/003 , B32B37/10 , B32B37/1009 , B32B38/004 , B32B2309/60 , B32B2309/68 , B32B2457/14 , H01L21/67092 , H01L21/67748 , H01L21/6875
摘要： A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.
摘要翻译：接合装置和方法将第一和第二主体周边地彼此上下放置在相应的搁架上。下部传热体构造成从下方提升第一体，并且将第一和第二体压靠在上部传热体上，以使第一和第二体之间的粘结。

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