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    • 94. 发明授权
    • Multiple spacer steps for pitch multiplication
    • 用于间距倍增的多个间隔步长
    • US08003542B2
    • 2011-08-23
    • US12489337
    • 2009-06-22
    • Sanket SantGurtej S. SandhuNeal R. Rueger
    • Sanket SantGurtej S. SandhuNeal R. Rueger
    • H01L21/302
    • H01L21/3088H01L21/0337H01L21/3085H01L21/3086H01L21/76802H01L27/1052
    • Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed around a plurality of mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.
    • 使用多个间距倍数的间隔物来形成具有特别小的临界尺寸的特征的掩模图案。 去除围绕多个心轴形成的每对间隔件中的一个,并且由两个相互选择性可蚀刻的材料形成的交替层围绕剩余的间隔物沉积。 然后蚀刻由一种材料形成的层,留下由形成掩模图案的另一种材料形成的垂直延伸层。 或者,代替沉积交替层,无定形碳沉积在剩余的间隔物周围,随后在无定形碳上形成一对间隔物的多个循环,去除一对隔离物中的一个并沉积无定形碳层。 可以重复循环以形成所需的图案。 由于图案中的某些特征的临界尺寸可以通过控制间隔物之间​​的间隔的宽度来设定,所以可以形成特别小的掩模特征。
    • 100. 发明申请
    • Methods Of Forming And Using Reticles
    • 形成和使用网格的方法
    • US20100248094A1
    • 2010-09-30
    • US12797508
    • 2010-06-09
    • William StantonGurtej S. Sandhu
    • William StantonGurtej S. Sandhu
    • G03F1/00
    • G03F1/72G03F1/50
    • Some embodiments include methods of treating reticles to provide backside masking across regions of the reticle to compensate for problems occurring during photolithographic processing. The problems may be, for example, defects in the reticle, problems associated with deposition or development of photoresist, or problems associated with substrate topography. The masking may alter one or both of transmission of electromagnetic radiation through the masked regions, and polarization of electromagnetic radiation passed through the masked regions. Some embodiments include reticles having patterns along front sides for patterning electric magnetic radiation, and masks across portions of the backsides to at least partially block transmission of electromagnetic radiation through portions of the patterns.
    • 一些实施例包括处理掩模版以在掩模版的区域之间提供背面掩蔽以补偿光刻处理期间出现的问题的方法。 问题可能是例如掩模版中的缺陷,与光致抗蚀剂的沉积或显影相关的问题,或与衬底形貌有关的问题。 掩蔽可以改变透过屏蔽区域的电磁辐射的一种或两种以及通过掩蔽区域的电磁辐射的极化。 一些实施例包括具有沿着前侧的图案的掩模版,用于图形化电磁辐射,以及掩模跨越所述背面的部分以至少部分地阻挡电磁辐射通过所述图案的一部分的透射。