专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明授权

US5578934A Method and apparatus for testing unpackaged semiconductor dice 失效
标题翻译：用于测试未封装的半导体骰子的方法和装置
公开(公告)号：US5578934A
公开(公告)日：1996-11-26
申请号：US432111
申请日：1995-05-01
申请人： Alan G. Wood , Warren M. Farnworth , Salman Akram , David R. Hembree
发明人： Alan G. Wood , Warren M. Farnworth , Salman Akram , David R. Hembree
IPC分类号： G01R31/26 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/60 , H01L21/66 , H01L21/68 , H01L23/13 , H01L23/498 , H05K3/00 , H05K3/40 , H05K3/42 , G01R31/02
CPC分类号： G01R1/07314 , G01R1/0433 , G01R1/0483 , G01R31/2886 , G01R31/2893 , H01L21/6835 , H01L22/20 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L24/80 , H01L24/85 , H05K3/4007 , G01R1/0466 , G01R3/00 , G01R31/2863 , G01R31/2889 , H01L2224/16145 , H01L2224/48 , H01L2224/85001 , H01L2224/85205 , H01L2225/06562 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H01L2924/19041 , H01L2924/30105 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A method and apparatus for testing unpackaged semiconductor dice includes a mother board and a plurality of interconnects mounted on the mother board and adapted to establish a temporary electrical connection with the dice. The interconnects can be formed with a silicon substrate and raised contact members for contacting the bond pads of a die. Alternately the interconnects can be formed with micro bump contact members mounted on an insulating film. The mother board allows each die to be tested separately for speed and functionality and to also be burn-in tested in parallel using standard burn-in ovens. In an alternate embodiment testing is performed using a mother board/daughter board arrangement. Each daughter board includes interconnects that allow the dice to be tested individually for speed and functionality. Multipule daughter boards can then be mounted to the mother board for burn-in testing using standard burn-in ovens.
摘要翻译：用于测试未封装半导体晶片的方法和装置包括安装在母板上的母板和多个互连件，并且适于与裸片建立临时电连接。互连可以形成有硅衬底和用于接触管芯的接合焊盘的凸起的接触构件。或者，互连可以由安装在绝缘膜上的微凸块接触构件形成。母板允许每个模具分别测试速度和功能，并且还可以使用标准烧录炉并行测试。在替代实施例中，使用母板/子板布置进行测试。每个子板包括互连，允许骰子单独测试速度和功能。然后可以将多个子板安装到母板上，以使用标准老化炉进行老化测试。

92. 发明授权

US08502353B2 Through-wafer interconnects for photoimager and memory wafers 失效
标题翻译：用于光刻机和存储晶圆的透晶片互连
公开(公告)号：US08502353B2
公开(公告)日：2013-08-06
申请号：US13154550
申请日：2011-06-07
申请人： Salman Akram , Charles M. Watkins , William M. Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
发明人： Salman Akram , Charles M. Watkins , William M. Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
IPC分类号： H01L23/485
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译：公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

93. 发明授权

US08111515B2 Methods and apparatuses for transferring heat from stacked microfeature devices 有权
标题翻译：用于从堆叠的微特征装置传递热量的方法和装置
公开(公告)号：US08111515B2
公开(公告)日：2012-02-07
申请号：US12557198
申请日：2009-09-10
申请人： Salman Akram , David R. Hembree
发明人： Salman Akram , David R. Hembree
IPC分类号： H05K7/20 , H01L23/367 , F28F7/00
CPC分类号： H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.
摘要翻译：本文公开了用于从堆叠的微特征装置传递热量的方法和装置。在一个实施例中，微特征装置组件包括具有端子的支撑构件和具有由支撑构件承载的第一外部触点的第一微电子模具。第一外部触点可操作地耦合到支撑构件上的端子。组件还包括具有集成电路的第二微电子管芯和电耦合到第一外部触点的第二外部触头。第一模具在支撑构件和第二模具之间。组件还可以包括在第一模具和第二模具之间的传热单元。传热单元包括第一传热部分，第二传热部分和第一和第二传热部分之间的间隙，使得第一外部接触部和第二外部接触部与间隙对准。

94. 发明授权

US07713841B2 Methods for thinning semiconductor substrates that employ support structures formed on the substrates 有权
标题翻译：减薄采用在基板上形成的支撑结构的半导体衬底的方法
公开(公告)号：US07713841B2
公开(公告)日：2010-05-11
申请号：US10666742
申请日：2003-09-19
申请人： Alan G. Wood , Warren M. Farnworth , David R. Hembree , Sidney B. Rigg , William M. Hiatt , Peter Benson , Kyle K. Kirby , Salman Akram
发明人： Alan G. Wood , Warren M. Farnworth , David R. Hembree , Sidney B. Rigg , William M. Hiatt , Peter Benson , Kyle K. Kirby , Salman Akram
IPC分类号： H01L21/46
CPC分类号： G03F7/0037 , B33Y30/00 , B33Y70/00 , B33Y80/00 , G03F7/0047
摘要： A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface. Assemblies that include the support structure and a semiconductor substrate are also within the scope of the present invention, as are methods for forming the support structures and thinning and post-thinning processes that include use of the support structures.
摘要翻译：在半导体衬底的薄化或后研磨以及后稀化处理期间与半导体衬底一起使用的支撑结构包括基本上沿半导体衬底的外周延伸并且围绕半导体衬底的外周延伸的部分，以使薄化半导体基板具有刚性。支撑结构可以被配置为环或作为基本上覆盖半导体衬底的有源表面并且在由有源表面承载的每个半导体器件上形成保护结构的构件。包括支撑结构和半导体衬底的组件也在本发明的范围内，形成支撑结构的方法和包括使用支撑结构的减薄和后变薄工艺也是如此。

95. 发明授权

US07602618B2 Methods and apparatuses for transferring heat from stacked microfeature devices 有权
标题翻译：用于从堆叠的微特征装置传递热量的装置
公开(公告)号：US07602618B2
公开(公告)日：2009-10-13
申请号：US11212986
申请日：2005-08-25
申请人： Salman Akram , David R. Hembree
发明人： Salman Akram , David R. Hembree
IPC分类号： H01R12/16
CPC分类号： H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： Apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.
摘要翻译：本文公开了用于从堆叠的微特征装置传递热量的装置。在一个实施例中，微特征装置组件包括具有端子的支撑构件和具有由支撑构件承载的第一外部触点的第一微电子模具。第一外部触点可操作地耦合到支撑构件上的端子。组件还包括具有集成电路的第二微电子管芯和电耦合到第一外部触点的第二外部触头。第一模具在支撑构件和第二模具之间。组件还可以包括在第一模具和第二模具之间的传热单元。传热单元包括第一传热部分，第二传热部分和第一和第二传热部分之间的间隙，使得第一外部接触部和第二外部接触部与间隙对准。

96. 发明授权

US07504615B2 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
标题翻译：具有光学器件的微电子成像器和制造这种微电子成像器的方法
公开(公告)号：US07504615B2
公开(公告)日：2009-03-17
申请号：US11727545
申请日：2007-03-27
申请人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
发明人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
IPC分类号： H01L27/00 , H01L31/0232
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
摘要翻译：微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。微电子成像器组件还包括相对于成像管芯叠加的光学支架。光学支撑件可以直接在基板上或衬底上的盖上。单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

97. 发明授权

US07419841B2 Microelectronic imagers and methods of packaging microelectronic imagers 有权
标题翻译：微电子成像器和包装微电子成像器的方法
公开(公告)号：US07419841B2
公开(公告)日：2008-09-02
申请号：US11494453
申请日：2006-07-28
申请人： Warren M. Farnworth , Sidney B. Rigg , William M. Hiatt , Kyle K. Kirby , Peter A. Benson , James M. Wark , Alan G. Wood , David R. Hembree , Salman Akram , Charles M. Watkins
发明人： Warren M. Farnworth , Sidney B. Rigg , William M. Hiatt , Kyle K. Kirby , Peter A. Benson , James M. Wark , Alan G. Wood , David R. Hembree , Salman Akram , Charles M. Watkins
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译：本文公开了微电子成像器和用于封装微电子成像器的方法。在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。导电晶片互连延伸穿过管芯并且与焊盘接触。互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。导电支撑构件由接合垫承载和突出。图像传感器上的盖连接到支撑构件。

98. 发明授权

US07199439B2 Microelectronic imagers and methods of packaging microelectronic imagers 有权
标题翻译：微电子成像器和包装微电子成像器的方法
公开(公告)号：US07199439B2
公开(公告)日：2007-04-03
申请号：US10867352
申请日：2004-06-14
申请人： Warren M. Farnworth , Sidney B. Rigg , William M. Hiatt , Kyle K. Kirby , Peter A. Benson , James M. Wark , Alan G. Wood , David R. Hembree , Salman Akram , Charles M. Watkins
发明人： Warren M. Farnworth , Sidney B. Rigg , William M. Hiatt , Kyle K. Kirby , Peter A. Benson , James M. Wark , Alan G. Wood , David R. Hembree , Salman Akram , Charles M. Watkins
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译：本文公开了微电子成像器和用于封装微电子成像器的方法。在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。导电晶片互连延伸穿过管芯并且与焊盘接触。互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。导电支撑构件由接合垫承载和突出。图像传感器上的盖连接到支撑构件。

99. 发明授权

US06806493B1 Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching 失效
公开(公告)号：US06806493B1
公开(公告)日：2004-10-19
申请号：US09026080
申请日：1998-02-19
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： H01L2358
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.

100. 发明授权

US06709878B2 Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece 有权
标题翻译：电子设备工件，半导体处理方法以及感应电子设备工件温度的方法
公开(公告)号：US06709878B2
公开(公告)日：2004-03-23
申请号：US10042707
申请日：2002-05-16
申请人： Salman Akram , David R. Hembree
发明人： Salman Akram , David R. Hembree
IPC分类号： H01L2166
CPC分类号： G01K1/026 , H01L22/12 , H01L2224/48091 , H01L2224/48464 , H01L2224/8592 , H01L2924/15156 , H01L2924/00014
摘要： The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.
摘要翻译：本发明包括电子设备工件，半导体处理方法和感测电子设备工件温度的方法。一方面，本发明提供了一种电子设备工件，包括：具有表面的基板; 由基板承载的温度感测装置; 以及形成在所述基板的表面上的电互连，所述电互连件与所述温度感测装置电耦合。另一方面，一种感测电子设备工件的温度的方法包括：提供电子设备工件; 支持使用电子设备工件的温度感测装置; 在所述电子设备工件的表面上提供电互连; 将电互连电气耦合到温度感测装置; 以及使用温度感测装置感测电子装置工件的温度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式