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    • 96. 发明授权
    • Recovery of gadolinium and gallium oxides
    • 回收钆和氧化镓
    • US4405568A
    • 1983-09-20
    • US451297
    • 1982-12-20
    • David Nalewajek
    • David Nalewajek
    • C01F17/00C01G15/00
    • C01G15/00C01F17/0043C01P2006/80
    • A process is described whereby the "saw kerf" can be reprocessed in sufficient purity to be re-used in the process, thereby improving the economics of production of GGG wafers significantly. Gadolinium and gallium oxides are recovered and separated from transition metal impurities introduced during fabrication of GGG wafers. The process "saw kerf" produced from slicing the crystal boule is dissolved by refluxing in HNO.sub.3, treated with oxalic acid and the resulting oxalates and nitrates separated. Pyrolysis of these salts at temperatures of at least 850.degree. C. resulted in their conversion to Ga.sub.2 O.sub.3 of purity >99.99%. The process can be extended to include purification and re-use of by-products generated in other grinding and polishing operations which may result in the recycling of the order of 80% of the generated by-products.
    • 描述了一种方法,其中“锯切”可以以足够的纯度重新加工以在该过程中重新使用,从而显着提高了GGG晶片的生产经济性。 钆和镓氧化物被回收并与制造GGG晶片期间引入的过渡金属杂质分离。 通过在HNO 3中回流溶解通过切片晶体棒产生的过程“锯切”,用草酸处理,所得草酸盐和硝酸盐分离。 这些盐在至少850℃的温度下热分解,导致其转化为纯度> 99.99%的Ga 2 O 3。 该方法可以扩展到包括在其它研磨和抛光操作中产生的副产物的纯化和再利用,这可能导致生成的副产物的80%的量级的再循环。