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91. 发明授权

US6140603A Micro-cleavage method for specimen preparation 有权
标题翻译：样品制备的微裂解法
公开(公告)号：US6140603A
公开(公告)日：2000-10-31
申请号：US283000
申请日：1999-03-31
申请人： Ruey-Lian Hwang , Yung-Sheng Huang
发明人： Ruey-Lian Hwang , Yung-Sheng Huang
IPC分类号： B23K26/40 , H01L21/304 , B23K26/00
CPC分类号： H01L21/3043 , B23K26/362 , B23K26/40 , B23K2203/50
摘要： A micro-cleavage method for preparing a semiconductor specimen for examination by an optical or electron microscopic is disclosed. The method can be carried out by hand and thus no expensive equipment such as a polishing machine is necessary. In the method, at least two bird's beak marks are cut in a top surface of a silicon wafer that contains a target, i.e., a defect or a circuit to be examined. The bird's beak marks are formed by a wide scribe line and a narrow scribe line overlapped together. The wide scribe line of the bird's beak mark is used for visual alignment with the edge of a rigid substrate, while the fine scribe line is utilized for initiating a crack when a bending stress is applied on the bird's beak mark. The bird's beak mark can be made by using a laser cutter after a wafer slice which contains the target area is first cleaved by mechanical means such as a diamond knife. A first bird's beak mark is formed at the cleaved edge of the slice and a second bird's beak mark is formed with its fine scribe line oriented toward the target. When a bending stress is applied on the top surface of the silicon slice, stress concentrates on the bird's beak marks and creates a fine crack to propagate along a crystallographic plane in the wafer toward the target thus exposing the target in a fractured surface.
摘要翻译：公开了一种通过光学或电子显微镜制备用于检查的半导体样品的微裂纹方法。该方法可以手工进行，因此不需要昂贵的设备如抛光机。在该方法中，在包含目标物，即缺陷或待检查的电路的硅晶片的顶表面中切割至少两个鸟的喙标记。鸟的喙标记由宽的划线和狭窄的划线重叠在一起形成。鸟喙标记的宽划线用于与刚性基底的边缘的视觉对准，而当在鸟的喙标记上施加弯曲应力时，细切割线用于引发裂纹。可以通过使用激光切割机在包含目标区域的晶片切片之后首先用诸如金刚石刀等机械手段切割来制作鸟的喙标记。在切片的切割边缘处形成第一只鸟的喙标记，并且形成第二个鸟的喙标记，其细的划线朝向目标。当在硅片的顶表面上施加弯曲应力时，应力集中在鸟的喙痕上，并产生细小的裂纹，沿着晶片中的晶面朝向靶传播，从而将目标暴露在断裂的表面中。

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