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91. 发明授权

US07669688B2 Automobile front portion structure 有权
标题翻译：汽车前部结构
公开(公告)号：US07669688B2
公开(公告)日：2010-03-02
申请号：US10572063
申请日：2005-10-26
申请人： Akira Yamaguchi , Go Fujimaru , Masahiko Tabe , Tsuyoshi Kobayashi , Gousuke Wakana
发明人： Akira Yamaguchi , Go Fujimaru , Masahiko Tabe , Tsuyoshi Kobayashi , Gousuke Wakana
IPC分类号： B62D21/15
CPC分类号： B62D21/152 , B60G2206/016 , B62D21/155
摘要： A front structure for a vehicle comprises a power unit mounted at a front end of the vehicle, a steering gear box provided in front of or behind the power unit in the vehicle, and a suspension member supporting the steering gear box, the steering gear box being situated at a bottom surface of the suspension member so as to move beneath the power unit when the front end of the vehicle is deformed due to a frontal collision.
摘要翻译：车辆的前部结构包括安装在车辆的前端的动力单元，设置在车辆中的动力单元的前方或后方的转向齿轮箱，以及支撑转向齿轮箱的悬挂构件，转向齿轮箱位于悬挂构件的底面，以便当车辆的前端由于正面碰撞而变形时在动力单元的下方移动。

92. 发明授权

US07546197B2 Driving force control device of vehicle 有权
标题翻译：车辆驱动力控制装置
公开(公告)号：US07546197B2
公开(公告)日：2009-06-09
申请号：US11783266
申请日：2007-04-06
申请人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Atsushi Atake , Kouji Kaneda , Tatsuru Fukuda , Minoru Yuki , Masayuki Ushiki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
发明人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Atsushi Atake , Kouji Kaneda , Tatsuru Fukuda , Minoru Yuki , Masayuki Ushiki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
IPC分类号： G06F19/00
CPC分类号： F02D11/105 , F02D41/2422 , F02D2200/604
摘要： A driving force control device can set driving force characteristics which conform to tastes of drivers using one vehicle thus giving the easy-to-drive feeling to the drivers. An E/G13ECU possesses three modes 1 to 3 as control modes and selects one mode from these modes based on a manipulation input using a mode selection switch. Further, any one of the mode out of these modes 1 to 3 is preset in the E/G13ECU as a temporary changeover mode, and the E/G13ECU changes over a mode selected by the mode selection switch and the preset temporary changeover mode alternatively by the temporary changeover switch.
摘要翻译：驱动力控制装置可以设置符合使用一个车辆的驾驶员的口味的驱动力特性，从而给驾驶员提供易于驾驶的感觉。 E / G13ECU具有三种模式1至3作为控制模式，并且基于使用模式选择开关的操纵输入从这些模式中选择一种模式。此外，这些模式1至3中的模式中的任何一种在E / G13ECU中被预设为临时切换模式，并且E / G13ECU通过模式选择开关选择的模式和预设的临时切换模式交替地改变临时切换开关。

93. 发明授权

US07501696B2 Semiconductor chip-embedded substrate and method of manufacturing same 有权
标题翻译：半导体芯片嵌入式基板及其制造方法
公开(公告)号：US07501696B2
公开(公告)日：2009-03-10
申请号：US11188322
申请日：2005-07-25
申请人： Tetsuya Koyama , Tsuyoshi Kobayashi
发明人： Tetsuya Koyama , Tsuyoshi Kobayashi
IPC分类号： H01L21/70 , H01L23/12
CPC分类号： H01L24/82 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L24/48 , H01L2224/12105 , H01L2224/16225 , H01L2224/24226 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , H05K1/185 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip-embedded substrate comprising a supporting substrate and an insulating layer thereon, members for the connection to external circuits, and a plurality of semiconductor chips embedded in the insulating layer, wherein at least some of the plurality of semiconductor chips are embedded as a stack or stacks thereof. A method of manufacturing such a semiconductor chip-embedded substrate is also disclosed.
摘要翻译：一种包括支撑衬底和绝缘层的半导体芯片嵌入式衬底，用于连接到外部电路的部件和嵌入绝缘层中的多个半导体芯片，其中多个半导体芯片中的至少一些嵌入作为堆栈或堆栈。还公开了制造这种半导体芯片嵌入式基板的方法。

94. 发明申请

US20090050484A1 PROCESS FOR PRODUCING MEMBRANE ELECTRODE ASSEMBLY, AND FUEL CELL USING THE MEMBRANE ELECTRODE ASSEMBLY PRODUCED BY THE PROCESS 有权
标题翻译：用于生产膜电极组件的方法和使用由该方法生产的膜电极组件的燃料电池
公开(公告)号：US20090050484A1
公开(公告)日：2009-02-26
申请号：US12049770
申请日：2008-03-17
申请人： Masaaki YAMAMOTO , Wu Mei , Tsuyoshi Kobayashi , Taishi Fukazawa , Itsuko Mizutani , Yoshihiko Nakano
发明人： Masaaki YAMAMOTO , Wu Mei , Tsuyoshi Kobayashi , Taishi Fukazawa , Itsuko Mizutani , Yoshihiko Nakano
IPC分类号： C25D1/04 , C25D7/00
CPC分类号： H01M8/1004 , C23C14/185 , H01M4/8878 , H01M4/8882 , H01M4/921 , H01M8/1011 , Y02E60/366 , Y02E60/523 , Y02P70/56
摘要： This invention provides a process for producing a membrane electrode assembly which has high and stable catalytic activity, and suppressed deterioration in catalytic activity during operation, and can prevent a deterioration in performance attributable to a structural factor of the membrane electrode assembly. The process comprises the step of, after the washing/removing step, drying the catalyst electrode in an atmosphere having a lower oxygen partial pressure than the air. The anode/cathode is a covered catalyst electrode having a structure formed by supporting/depositing a catalytically active material composed mainly of platinum/ruthenium subjected to the potential holding step, the washing/removing step, and the drying step, on a porous electroconductive carrier to cover at least a part of the porous electroconductive carrier with the ion conductive material.
摘要翻译：本发明提供了具有高且稳定的催化活性的电极组件的制造方法，抑制了操作时的催化活性的劣化，能够防止膜电极接合体的结构因素引起的性能的劣化。该方法包括以下步骤：在洗涤/除去步骤之后，在氧气分压低于空气的气氛中干燥催化剂电极。阳极/阴极是具有通过在多孔导电载体上负载/沉积主要由经受电位保持步骤的铂/钌，洗涤/去除步骤和干燥步骤的催化活性材料形成的结构的被覆催化剂电极用离子导电材料覆盖多孔导电载体的至少一部分。

95. 发明申请

US20090008765A1 CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME 有权
标题翻译：芯片嵌入式基板及其制造方法
公开(公告)号：US20090008765A1
公开(公告)日：2009-01-08
申请号：US11815580
申请日：2006-12-12
申请人： Takaharu Yamano , Hajime Iizuka , Hideaki Sakaguchi , Toshio Kobayashi , Tadashi Arai , Tsuyoshi Kobayashi , Tetsuya Koyama , Kiyoaki Iida , Tomoaki Mashima , Koichi Tanaka , Yuji Kunimoto , Takashi Yanagisawa
发明人： Takaharu Yamano , Hajime Iizuka , Hideaki Sakaguchi , Toshio Kobayashi , Tadashi Arai , Tsuyoshi Kobayashi , Tetsuya Koyama , Kiyoaki Iida , Tomoaki Mashima , Koichi Tanaka , Yuji Kunimoto , Takashi Yanagisawa
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/56 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/49822 , H01L23/49833 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/105 , H01L25/16 , H01L25/162 , H01L2221/68345 , H01L2224/0401 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81005 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/83192 , H01L2224/85 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/207 , H01L2924/3025 , H01L2924/3511 , H05K1/185 , H05K1/186 , H05K3/20 , H05K3/4614 , H05K3/462 , H05K3/4644 , H05K2201/10007 , H05K2201/10378 , H05K2201/10674 , H05K2201/10977 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.
摘要翻译：公开了一种制造芯片嵌入式基板的方法。该方法包括将半导体芯片安装在其上形成有第一布线的第一基板上的第一步骤; 以及将第一基板与形成有第二布线的第二基板接合的第二步骤。在第二步骤中，将半导体芯片封装在第一基板和第二基板之间，并且在第一布线和第二布线之间形成电连接，以形成连接到半导体芯片的多层布线。

96. 发明授权

US07459585B2 Benzene derivatives and pharmaceutical use thereof 失效
标题翻译：苯衍生物及其药物用途
公开(公告)号：US07459585B2
公开(公告)日：2008-12-02
申请号：US11087531
申请日：2005-03-24
申请人： Yukio Iino , Kohichi Fujita , Takashi Tsuji , Ariko Kodaira , Kenji Takehana , Tsuyoshi Kobayashi , Takashi Yamamoto
发明人： Yukio Iino , Kohichi Fujita , Takashi Tsuji , Ariko Kodaira , Kenji Takehana , Tsuyoshi Kobayashi , Takashi Yamamoto
IPC分类号： C07C233/60 , C07C233/61 , C07C233/62 , C07C233/63 , C07C309/66 , C07C311/21 , C07D209/38 , C07D209/48 , C07D211/78
CPC分类号： C07D209/48 , C07B2200/05 , C07B2200/07 , C07C233/60 , C07C233/61 , C07C233/62 , C07C233/63 , C07C235/38 , C07C235/56 , C07C237/20 , C07C237/42 , C07C247/10 , C07C251/48 , C07C255/44 , C07C309/66 , C07C311/46 , C07C317/40 , C07C323/40 , C07C2601/02 , C07D207/16 , C07D209/76 , C07D213/81
摘要： The present invention provides an AP-1 activation inhibitor, NF-kappa B activation inhibitor, inflammatory cytokine production inhibitor, matrix metalloprotease production inhibitor, inflammatory cell adhesion molecule expression inhibitor, anti-inflammatory agent, antirheumatic agent, immunosuppressant, cancer metastasis inhibitor, remedy for arteriosclerosis and antiviral agent which contain the benzene derivative of the following general formula (I) or a pharmaceutically acceptable salt thereof as an active ingredient.
摘要翻译：本发明提供了AP-1活化抑制剂，NF-κB活化抑制剂，炎性细胞因子产生抑制剂，基质金属蛋白酶产生抑制剂，炎症细胞粘附分子表达抑制剂，抗炎剂，抗风湿剂，免疫抑制剂，癌症转移抑制剂用于含有下列通式（I）的苯衍生物或其药学上可接受的盐作为活性成分的动脉硬化和抗病毒剂。

97. 发明申请

US20070290306A1 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS 有权
标题翻译：配线基板及其制造方法及半导体装置
公开(公告)号：US20070290306A1
公开(公告)日：2007-12-20
申请号：US11763053
申请日：2007-06-14
申请人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
发明人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H05K3/4647 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/48227 , H05K1/111 , H05K3/108 , H05K3/4007 , H05K2201/0367 , H05K2201/09909 , Y02P70/611
摘要： In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wiring patterns are formed are covered with an insulating layer. Surfaces of connection parts of the wiring patterns formed on the tops of the protrusions are formed with the surfaces of the connection parts exposed to a surface of the insulating layer on a level with the surface of the insulating layer or in a position lower than the surface of the insulating layer. The connection parts are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element is mounted by making electrical connection to the connection parts by flip chip bonding.
摘要翻译：在半导体装置中，将半导体元件安装在布线基板上。布线图案和突起形成在基板的表面上，布线图案在突起的顶部延伸。其上形成有布线图案的基板的表面被绝缘层覆盖。形成在突起的顶部上的布线图形的连接部分的表面形成有连接部分的表面暴露于绝缘层的表面与绝缘层的表面或低于表面的位置的绝缘层。连接部分形成为与半导体元件的连接电极对准形成的用于连接的焊盘。半导体元件通过倒装芯片接合与连接部分进行电连接来安装。

98. 发明申请

US20070247975A1 Vehicle display device 有权
标题翻译：车载显示装置
公开(公告)号：US20070247975A1
公开(公告)日：2007-10-25
申请号：US11783275
申请日：2007-04-06
申请人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Atsushi Atake , Kouji Kaneda , Tatsuru Fukuda , Minoru Yuki , Masayuki Ushiki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
发明人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Atsushi Atake , Kouji Kaneda , Tatsuru Fukuda , Minoru Yuki , Masayuki Ushiki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
IPC分类号： G04B19/22
CPC分类号： G01D7/08 , G01D1/18 , G01D7/12 , G07C5/0825 , G07C5/0841
摘要： The present invention provides a vehicle display device which allows a driver to instantaneously grasp driving force information. A meter_ECU displays a driving force display image which displays driving force information of a vehicle on an MID, displays an acceleration-torque line (driving force characteristic line) L corresponding to the currently selected mode M and, at the same time, changes a power level which is indicated in a power display region P set within the acceleration-torque line L interlockingly with an accelerator operation of a driver. Due to such a constitution, the vehicle display device allows the driver to instantaneously grasp the driving force information.
摘要翻译：本发明提供一种车辆显示装置，其允许驾驶员即时掌握驱动力信息。米_ECU显示在MID上显示车辆的驱动力信息的驱动力显示图像，显示与当前选择的模式M对应的加速度 - 转矩线（驱动力特性线）L，并且同时改变功率在加速扭矩线L内设置的功率显示区域P中指示的电平与驾驶员的加速器操作互锁。由于这样的构成，车辆用显示装置能够使驾驶员立即掌握驱动力信息。

99. 发明授权

US07242973B2 Portable electronic device 失效
标题翻译：便携式电子设备
公开(公告)号：US07242973B2
公开(公告)日：2007-07-10
申请号：US10530925
申请日：2002-10-11
申请人： Eiji Saitoh , Tsuyoshi Kobayashi , Tadayuki Takanashi , Kanta Jyuudai
发明人： Eiji Saitoh , Tsuyoshi Kobayashi , Tadayuki Takanashi , Kanta Jyuudai
IPC分类号： H04M1/00
CPC分类号： H04M1/0262 , H01M2/1066
摘要： An object of the invention is to smoothen the loading of a battery pack, to ensure the electric connection between the battery pack and the main body of a mobile electronic apparatus, and to reduce the manufacture cost. In the invention, a mobile electronic apparatus comprises collision avoiding mechanisms (4) including: generally sector-shaped ascent/descent portions (41A) and suitably shaped push-up portions (41B) disposed higher than and corresponding to connecting terminals (22) disposed in the battery chamber (22), on inner wall faces (21A/21B) formed on the two sides along the loading (α) direction of the battery pack (3) so as to form the battery chamber (21) and near the corner portions intersecting abutting wall faces (21C) perpendicular to the inner wall faces (21A/21B) for forming the battery chamber (21); and riding portions (42) formed on the back face of the battery pack (3) confronting the ascent/descent portions (41A) and the push-up portions (41B) on the two widthwise sides of the battery pack (3) and ascending/descending while sliding on the sector-shaped faces of the push-up portions (41B) thereby to ride over the connecting terminals (22) disposed in the battery chamber (21). When the battery pack (3) is loaded into the battery chamber (21), its riding portions (42) can ride on the ascent/descent portions (41) so that they can safely ride over the connecting terminals (22).
摘要翻译：本发明的目的是平滑电池组的负载，以确保电池组与移动电子设备的主体之间的电连接并降低制造成本。在本发明中，一种移动电子设备包括避碰机构（4），包括：大致扇形的上升/下降部分（41a）和适当形状的上推部分（41B），其布置成高于并对应于连接端子）在沿着电池组（3）的装载（α）方向形成在两侧上的内壁面（21A / 21B）上，以形成电池室（21），并且在与用于形成电池室（21）的内壁面（21A / 21B）垂直的邻接壁面（21C）相交的角部附近; 以及形成在所述电池组（3）的面对所述电池组（3）的两个宽度方向上的上升/下降部分（41A）和所述上推部分（41B）的背面上的搭接部分（42）并且在上推部分（41B）的扇形表面上滑动同时上升/下降，从而跨越设置在电池室（21）中的连接端子（22）。当电池组（3）被装载到电池室（21）中时，其搭载部分（42）可以骑在上升/下降部分（41）上，使得它们可以安全地越过连接端子（22）。

100. 发明申请

US20070082227A1 Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20070082227A1
公开(公告)日：2007-04-12
申请号：US11389206
申请日：2006-03-27
申请人： Tsuyoshi Kobayashi , Satoshi Mikoshiba , Tomoko Eguchi , Takashi Kuboki , Takashi Kishi , Shinji Murai , Hidesato Saruwatari
发明人： Tsuyoshi Kobayashi , Satoshi Mikoshiba , Tomoko Eguchi , Takashi Kuboki , Takashi Kishi , Shinji Murai , Hidesato Saruwatari
IPC分类号： B32B19/00 , B32B9/00
CPC分类号： H05B33/145
摘要： A light-emitting device is provided, which includes an insulating substrate, a first electrode and a second electrode insulated from each other and formed above the insulating substrate, and an electrolyte disposed on the first electrode and the second electrode. The electrolyte contains an ionic liquid and luminescent pigment having a reversible redox structure. Each of the first electrode and the second electrode have an elongated configuration, in an unit length of each of the first electrode and the second electrode, a surface area is 3 to 1000 times as large as a ground contact area, the surface area being an area of a surface of each of the first electrode and the ground contact area being an area projected upon the insulating substrate as the insulating substrate provided with the first electrode and the second electrode is looked from a top surface of the insulating substrate.
摘要翻译：提供了一种发光器件，其包括绝缘基板，第一电极和彼此绝缘并形成在绝缘基板上方的第二电极，以及设置在第一电极和第二电极上的电解质。电解质含有离子液体和具有可逆氧化还原结构的发光颜料。第一电极和第二电极中的每一个具有细长结构，在第一电极和第二电极中的每一个的单位长度上，表面积为接地面积的3至1000倍，表面积为从绝缘基板的上表面看，作为设置有第一电极和第二电极的绝缘基板，投影在绝缘基板上的区域是第一电极和接地区域中的每一个的表面的面积。

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