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91. 发明授权

US07602431B2 Solid-state imaging element and solid-state imaging apparatus 失效
标题翻译：固态成像元件和固态成像装置
公开(公告)号：US07602431B2
公开(公告)日：2009-10-13
申请号：US11533616
申请日：2006-09-20
申请人： Masaaki Takayama , Hiroaki Tanaka
发明人： Masaaki Takayama , Hiroaki Tanaka
IPC分类号： H04N3/14 , H04N5/335
CPC分类号： H04N9/045 , H04N2209/045
摘要： A solid-state imaging element includes: a plurality of light receiving elements provided within an imaging region on a semiconductor substrate; a color filter with a plurality of colors provided on the plurality of light receiving elements for filtering with a predetermined color; a vertical shift register disposed adjacent to the light receiving elements for transferring a charge from the light receiving elements; and a first horizontal shift register and a second shift register disposed interposing the imaging region therebetween for transferring a charge transferred from the vertical shift register and outputting a signal in accordance with the charge, respectively; wherein a respective charge of the light receiving elements accumulated therein in accordance with a light transmitted through filters of the same color in the color filter is transferred exclusively via either one of the first horizontal shift register or the second horizontal shift register to be outputted as the signal.
摘要翻译：固态成像元件包括：设置在半导体衬底上的成像区域内的多个光接收元件; 具有多个颜色的滤色器，设置在所述多个光接收元件上，用于以预定颜色进行滤波; 垂直移位寄存器，其设置成与光接收元件相邻，用于从光接收元件传送电荷; 以及第一水平移位寄存器和第二移位寄存器，其设置在其间插入成像区域，用于传送从垂直移位寄存器传送的电荷并分别根据电荷输出信号; 其中根据通过滤色器中相同颜色的滤光器透射的光累积在其中的光接收元件的相应电荷仅通过第一水平移位寄存器或第二水平移位寄存器中的任一个被传送，作为信号。

92. 发明申请

US20090209070A1 METHOD FOR MANUFACTURING A THIN FILM TRANSISTOR HAVING A MICRO-CRYSTALLINE SILICON HYDROGEN FEEDING LAYER FORMED BETWEEN A METAL GATE AND A GATE INSULATING FILM. 有权
标题翻译：用于制造具有金属栅和栅绝缘膜之间形成的微晶硅氢输送层的薄膜晶体管的方法。
公开(公告)号：US20090209070A1
公开(公告)日：2009-08-20
申请号：US12379991
申请日：2009-03-05
申请人： Hiroaki Tanaka
发明人： Hiroaki Tanaka
IPC分类号： H01L21/336
CPC分类号： H01L29/66757 , H01L29/4908 , H01L29/78675 , Y10S438/91 , Y10S438/958
摘要： A TFT (Thin Film Transistor) is provided in which a hydrogen feeding layer is able to be formed in a position where diffusing distance of hydrogen can be made short without causing an increase in photolithography processes. In the TFT, the hydrogen feeding layer to diffuse hydrogen into a dangling bond existing at an interface between a polycrystalline silicon thin film and a gate insulating film is formed in a position between the gate insulating film and a gate electrode. According to this configuration, diffusing distance of hydrogen at a period of time during hydrogenation can be made short and the hydrogenation process can be sufficiently performed without taking time in heat treatment.
摘要翻译：提供了一种TFT（薄膜晶体管），其中能够在不使光刻工艺增加的情况下将氢气的漫射距离缩小的位置形成氢供给层。在TFT中，在栅极绝缘膜和栅电极之间的位置形成有将氢扩散到存在于多晶硅薄膜和栅极绝缘膜之间的界面处的悬空键的氢供给层。根据该结构，可以缩短氢化期间的氢气的扩散距离，能够充分进行氢化处理，而不需要花费时间进行热处理。

93. 发明申请

US20080266436A1 TRANSFER PULSE SUPPLYING CIRCUIT 失效
标题翻译：传输脉冲供电电路
公开(公告)号：US20080266436A1
公开(公告)日：2008-10-30
申请号：US12108152
申请日：2008-04-23
申请人： Shogo Numaguchi , Hiroaki Tanaka , Isao Hirota , Norihiko Yoshimura
发明人： Shogo Numaguchi , Hiroaki Tanaka , Isao Hirota , Norihiko Yoshimura
IPC分类号： H04N5/335
CPC分类号： H04N5/3728 , H01L27/14636 , H01L27/14843 , H04N5/357
摘要： A transfer pulse supplying circuit for supplying transfer pulses to a solid-state imaging apparatus including a charge transfer unit includes N (N is an integer of two or more) transfer pulse supplying wirings to which the transfer pulses are supplied, and lead-in wirings connecting the transfer pulse supplying wirings to corresponding lead-out wirings from the charge transfer unit. The respective lead-in wirings have almost the same width and length as one another. At least part of the lead-in wirings is divided into a first region and a second region by slits, and the first region is connected to the transfer pulse supplying wirings and the lead-out wiring, the second region is connected to the lead-out wiring. Regions of the respective lead-in wirings connected to the transfer pulse supplying wirings have almost the same ratio of width to length as one another.
摘要翻译：用于向包括电荷转移单元的固态成像装置提供转移脉冲的转移脉冲提供电路包括N（N是两个或更多个的整数）传送脉冲供给布线，其中提供转移脉冲，并且引入布线将传送脉冲供给布线连接到来自电荷转移单元的相应引出布线。相应的引入布线具有几乎相同的宽度和长度。导入布线的至少一部分通过狭缝分为第一区域和第二区域，第一区域与传送脉冲供电布线和引出布线连接，第二区域与引出线连接，接线。连接到传送脉冲供电布线的相应引入布线的区域具有几乎相同的宽度与长度的比率。

94. 发明授权

US07405156B2 Method of forming wiring pattern 有权
标题翻译：形成布线图案的方法
公开(公告)号：US07405156B2
公开(公告)日：2008-07-29
申请号：US11174622
申请日：2005-07-06
申请人： Hiroaki Tanaka
发明人： Hiroaki Tanaka
IPC分类号： H01L21/44
CPC分类号： H01L21/76838 , H01L21/288 , H05K3/125 , H05K3/1258 , H05K2203/013 , H05K2203/0568 , H05K2203/0577 , H05K2203/0594
摘要： A photoresist pattern is formed on an insulating substrate so that it has a reverse tapered cross section and a reverse pattern of a wiring pattern to be formed. Next, a nanoparticles-containing ink is injected on a wiring region using an inkjet system, followed by a leveling process, a drying process, a resist separation process and a baking process. Thus a wiring pattern is formed.
摘要翻译：在绝缘基板上形成光致抗蚀剂图案，使其具有反向锥形横截面和要形成的布线图案的反向图案。接下来，使用喷墨系统将含纳米颗粒的油墨注入布线区域，然后进行流平处理，干燥处理，抗蚀剂分离处理和烘烤处理。因此形成布线图案。

95. 发明授权

US07393250B2 Table tap 失效
标题翻译：表敲击
公开(公告)号：US07393250B2
公开(公告)日：2008-07-01
申请号：US10549815
申请日：2004-03-17
申请人： Hiroaki Tanaka
发明人： Hiroaki Tanaka
IPC分类号： H01R25/00
CPC分类号： H01R25/003 , H01R35/00
摘要： A power strip includes two or more spaced-apart sockets each having a set of terminal insertion holes for insertion of plug terminals of a power cable or the like and either at least one flexible joint that interconnects adjacent sockets or a flexible cover of substantially tubular shape that substantially covers and interconnects the sockets. The interconnection of the sockets by the flexible joints or the flexible cover. enables the spaces between adjacent sockets to be optimized for the types and numbers of plugs, AC adapters and the like to plugged into the sockets.
摘要翻译：电源条带包括两个或更多个间隔开的插座，每个插座具有用于插入电力电缆等的插头端子的一组端子插入孔以及将相邻插座互连的至少一个柔性接头或基本上管状的柔性盖其基本上覆盖和互连插座。通过柔性接头或柔性盖将插座互连。使得相邻插座之间的空间可针对插入插座的插头，AC适配器等的类型和数量进行优化。

96. 发明申请

US20080142374A1 Apparatus For Recovery Metal 审中-公开
标题翻译：回收金属装置
公开(公告)号：US20080142374A1
公开(公告)日：2008-06-19
申请号：US11573746
申请日：2005-08-12
申请人： Hisashi Iwama , Hiroaki Tanaka , Harunobu Kimura , Hitoshi Tanaka , Yutaka Hirota
发明人： Hisashi Iwama , Hiroaki Tanaka , Harunobu Kimura , Hitoshi Tanaka , Yutaka Hirota
IPC分类号： C25C1/12
CPC分类号： C25C7/007 , C25C7/02 , C25C7/08
摘要： An apparatus for recovering a metal, which comprises a metal-recovering board (2) having an electrodeposition surface (2a, 2t) for the attachment of a metal component (R) precipitated from a solution and an insulating material (2b) formed around a pattern of the electrodeposition surface (2a, 2t). The metal-recovering board (2) is immersed in a metal-containing solution in an electrolytic treatment vessel (1), and thereby the metal in the solution is selectively precipitated on the electrodeposition surface (2a, 2t) and is converted to a bulk. The resultant metal bulk is scraped together for recovery with a blade (6) in a form as it is. The above apparatus for recovering a metal can be suitably used for recovering a metal in a solution in a state allowing easy reuse with good efficiency.
摘要翻译：一种用于回收金属的装置，包括具有用于连接从溶液沉淀的金属组分（R）和绝缘材料（2b）的电沉积表面（2 a，2 t）的金属回收板（2）形成在电沉积表面（2a，2t）的图案周围。将金属回收板（2）浸渍在电解处理容器（1）中的含金属溶液中，从而将溶液中的金属选择性沉淀在电沉积面（2a，2t）上，并转化为一大堆。将所得到的金属体刮擦在一起，以原样形式用刀片（6）进行回收。上述用于回收金属的装置可以适合用于在容易再利用的状态下以良好的效率回收溶液中的金属。

97. 发明授权

US07348406B2 Metabolic gene polynucleotides and polypeptides and uses thereof 失效
标题翻译：代谢基因多核苷酸和多肽及其用途
公开(公告)号：US07348406B2
公开(公告)日：2008-03-25
申请号：US10466376
申请日：2002-01-15
申请人： Mary Ruth Erickson , Barbara A. Chicca , Bernard Bihain , Hiroaki Tanaka
发明人： Mary Ruth Erickson , Barbara A. Chicca , Bernard Bihain , Hiroaki Tanaka
IPC分类号： C07K14/00 , C07K16/00 , A61K38/00
CPC分类号： A61K38/1709 , A01K2217/05 , A01K2217/075 , C07K14/47
摘要： The present invention relates to the field of metabolic research. Metabolic disorders, such as obesity, are a public health problem that is serious and widespread. GMG-3, GMG-4, Cluster 1, GMG-6A, or GMG-6B polypeptides have been identified that are beneficial in the treatment of metabolic disorders. These compounds should be effective for reducing body mass and for treating metabolic-related diseases and disorders. These metabolic-related diseases and disorders include hyperlipidemias, atherosclerosis, diabetes, and hypertension.
摘要翻译：本发明涉及代谢研究领域。代谢紊乱，如肥胖，是一个严重而广泛的公共卫生问题。已经鉴定出有益于治疗代谢紊乱的GMG-3，GMG-4，簇1，GMG-6A或GMG-6B多肽。这些化合物应该有效减少体重和治疗与代谢有关的疾病和病症。这些代谢相关的疾病和病症包括高脂血症，动脉粥样硬化，糖尿病和高血压。

98. 发明授权

US07291495B2 β-Secretase variant 失效
标题翻译： β-分泌酶变体
公开(公告)号：US07291495B2
公开(公告)日：2007-11-06
申请号：US10838854
申请日：2004-05-03
申请人： Stephane Bejanin , Hiroaki Tanaka
发明人： Stephane Bejanin , Hiroaki Tanaka
IPC分类号： C12N9/64 , C12N15/63 , C12N1/20 , C12N15/00 , C12N1/15 , C12P21/00
CPC分类号： C07K14/4711 , A01K2217/05 , A61K38/00 , A61K48/00 , C07K14/47 , C07K2319/02 , C12Q1/6883 , G01N33/5023 , G01N33/6896 , G01N2800/2821
摘要： The invention provides polynucleotides and polypeptides encoding an isolated amyloid inhibitor protein (APIP) and compositions thereof. The polypeptides of the subject invention can be used to inhibit the catabolism or sequential cleavage of amyloid beta precursor protein (APP) by sequential cleavage of APP by beta secretase and gamma secretase.
摘要翻译：本发明提供编码分离的淀粉样蛋白抑制蛋白（APIP）的多核苷酸和多肽及其组合物。本发明的多肽可用于通过用β分泌酶和γ分泌酶连续切割APP来抑制淀粉样蛋白β前体蛋白（APP）的分解代谢或连续切割。

99. 发明申请

US20070132871A1 SOLID-STATE IMAGING DEVICE 失效
标题翻译：固态成像装置
公开(公告)号：US20070132871A1
公开(公告)日：2007-06-14
申请号：US11609074
申请日：2006-12-11
申请人： Masaaki Takayama , Hiroaki Tanaka
发明人： Masaaki Takayama , Hiroaki Tanaka
IPC分类号： H04N5/335
CPC分类号： H01L27/14843 , H01L27/14812
摘要： A solid-state imaging device includes an imaging part, a first horizontal charge-transfer part and a second horizontal charge-transfer part that transfer charges transferred from the imaging part in a horizontal direction, an inter-horizontal charge-transfer part transfer electrode that applies a voltage to a transfer channel area provided between the first horizontal charge-transfer part and the second horizontal charge-transfer part, and a first light-shielding film that is provided over the first horizontal charge-transfer part and the second horizontal charge-transfer part and is made of a conductive material, and the inter-horizontal charge-transfer part transfer electrode and the first light-shielding film are electrically connected to each other.
摘要翻译：固态成像装置包括：成像部，第一水平电荷转移部和第二水平电荷转移部，其在水平方向上转移从成像部转移的电荷;水平间电荷转移部转移电极，对设置在第一水平电荷转移部分和第二水平电荷转移部分之间的转移通道区域施加电压，以及设置在第一水平电荷转移部分和第二水平电荷转移部分上的第一屏蔽膜，并且由导电材料制成，并且水平间电荷转移部分转印电极和第一遮光膜彼此电连接。

100. 发明授权

US07176060B2 Integrated circuit card and a method of manufacturing the same 失效
标题翻译：集成电路卡及其制造方法
公开(公告)号：US07176060B2
公开(公告)日：2007-02-13
申请号：US10902024
申请日：2004-07-30
申请人： Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
发明人： Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
IPC分类号： H01L21/00
CPC分类号： G06K19/07745 , G06K19/077 , G06K19/07718 , G06K19/07724 , G06K19/07733 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.
摘要翻译：推动插入式通用IC卡的多功能结构，降低制造成本。插件UICC的主体由模制树脂构成。胶带基板和安装在带基材一侧的芯片被密封在模塑树脂的内部。与带基片的芯片安装侧相对的一侧暴露于模制树脂的外部，构成插件UICC的表面部分。作为插件UICC的外部端子的接触图案形成在暴露于成型树脂的外部的带基材的表面上。在其主体由模制树脂构成的插件UICC中，即使在芯片尺寸较大的情况下也可以有效地防止芯片的开裂。

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