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    • 99. 发明授权
    • Integrated circuit packaging for optical sensor devices
    • 用于光学传感器设备的集成电路封装
    • US06396116B1
    • 2002-05-28
    • US09513797
    • 2000-02-25
    • Michael G. KellyJames-Yu ChangGary Dean SasserAndrew Arthur HunterCheng-Cheng Chang
    • Michael G. KellyJames-Yu ChangGary Dean SasserAndrew Arthur HunterCheng-Cheng Chang
    • H01L27148
    • H01L31/0203H01L27/14618H01L27/14636H01L31/02325H01L2224/48091H01L2924/09701H01L2924/16195H01L2924/00014
    • An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate. In the embodiment, contact pads of the first substrate are flip chip bonded to contact pads of the circuit board with conductive balls. The connection between the first substrate and the circuit board provides the electrical connection between the optical sensor and the circuit board.
    • 光学器件封装技术涉及形成在第一衬底上的光学传感器和与第二衬底结合的倒装芯片。 第二基板包括与光学传感器对准的通孔或透明部分,以允许光接触光学传感器。 光学装置结构的实施例包括光学传感器,第一基板,第二基板和电路板。 光学传感器形成在第一基板上或内部,并且光学传感器的各个传感器或像素电连接到暴露在第一基板上的接触焊盘。 第一衬底被倒装芯片接合到第二衬底。 第二基板被倒装芯片接合到电路板上。 光学装置结构的另一实施例包括光学传感器,第一基板和作为第二基板的电路板。 在本实施例中,第一基板的接触焊盘与导电球倒装芯片接合到电路板的接触焊盘。 第一基板和电路板之间的连接提供光学传感器和电路板之间的电连接。
    • 100. 发明授权
    • Cycloalkyl-substituted aryl-piperazines, piperidines and tetrahydropyridines as serotonergic agents
    • 环烷基取代的芳基哌嗪,哌啶和四氢吡啶作为血清素能药
    • US06376494B1
    • 2002-04-23
    • US09723478
    • 2000-11-28
    • Wayne E. ChildersMichael G. KellyYvette L. PalmerEdward J. Podlesny
    • Wayne E. ChildersMichael G. KellyYvette L. PalmerEdward J. Podlesny
    • A61K31496
    • C07D239/42C07D209/08C07D211/22C07D213/74C07D217/22C07D277/82C07D295/125C07D295/13C07D319/20
    • This invention relates to compounds which have activity as 5-HT1A agonists and antagonists which may be useful for the treatment of anxiety, depression, cognitive deficits, and prostate cancer, having the formula wherein: X is a moiety selected from the group of: n is selected from the integers 1 through 5; R1 is optionally substituted aryl or mono or bicyclic heteroaryl, with a proviso that heteroaryl is not thiadiazole; R2 is H or alkyl; R3 is H, COR5, COOR5, and CONR5R6; R4 is H, alkyl, alkenyl, alkynyl, aryl, mono or bicyclic heteroaryl, aralkyl, and mono or bicyclic heteroaralkyl, wherein the aryl or heteroaryl groups are optionally substituted; R5 and R6 are H, alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl, adamantyl, and noradamantyl or R5 and R6 taken together may form a 5-7 membered azacyclic ring, optionally containing an additional heteroatom selected from O, S, or NR4; when R5 or R6 are chosen from cycloalkyl or cycloalkenyl, the cyclic group may optionally be substituted at the 1-position with a C1-C3 alkyl group; or an optical isomer; or a pharmaceutically acceptable salt thereof.
    • 本发明涉及具有作为5-HT 1A激动剂和拮抗剂的活性的化合物,其可用于治疗具有下列基团的焦虑,抑郁,认知缺陷和前列腺癌:X是选自以下的部分:n是 从整数1到5中选择; R1是任选取代的芳基或单或双环杂芳基,条件是杂芳基不是噻二唑; R2是H或烷基; R3是H,COR5,COOR5和CONR5R6; R 4是H,烷基,烯基,炔基,芳基,单或双环杂芳基,芳烷基和单或双环杂芳烷基,其中芳基或杂芳基任选被取代; R5和R6是H,烷基,烯基,炔基,环烷基,环烯基,金刚烷基和去月桂烷基或R5和R6一起可以形成5-7元的氮杂环,任选地含有选自O,S或NR4的另外的杂原子; 当R5或R6选自环烷基或环烯基时,环状基团可以任选在1-位被C1-C3烷基取代;或光学异构体; 或其药学上可接受的盐。